CP0603A1441ENTR_技术文档

A KYOCERA GROUP COMPANY

AVX

RF Microwave/Thin-Film

Products

AVX Microwave

Ask The World Of Us

As one of the world’s broadest line

multilayer ceramic chip capacitor

suppliers, and a major Thin Film

RF/Microwave capacitor, inductor,

directional coupler and low pass filter and

microwave ceramic capacitor manufacturer,

it is our mission to provide First In Class

Technology, Quality and Service, by

establishing progressive design,

manufacturing and continuous

improvement programs driving

toward a single goal:

TOTAL CUSTOMER SATISFACTION

1

RF/Microwave Products

Table of Contents

Company Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Thin-Film RF/Microwave Technology – Accu-F^®/ Accu-P^®. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-24

Thin-Film Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Thin-Film Chip Capacitors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Thin-Film Chip Capacitors for RF Signal and Power Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Accu-F^®. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Accu-P^®. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

0201 Typical Electrical Tables – Accu-P^®. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

0402 Typical Electrical Tables – Accu-P^®. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-13

0603 Typical Electrical Tables – Accu-F^®/ Accu-P^®. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

0805 Typical Electrical Tables – Accu-F^®/ Accu-P^®. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

1210 Typical Electrical Tables – Accu-P^®. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

High Frequency Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17-19

Environmental / Mechanical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Performance Characteristics RF Power Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Application Notes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22-23

Automatic Insertion Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Thin-Film RF/Microwave Inductor Technology – Accu-L^®– L0603/L0805 . . . . . . . . . . . . . . . . . . 25-30

SMD High-Q RF Inductor – Accu-L^®. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26-29

Environmental Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Application Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Thin-Film RF/Microwave Directional Couplers – CP0402/CP0603/CP0805/DB0805 3dB 90° . . . . 31-67

CP0402 High Directivity LGA Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32-35

CP0603 High Directivity LGA Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36-40

CP0402 and CP0603 Test Jigs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

CP0603 SMD Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42-44

CP0603 SMD Type – High Directivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

CP0805 Type. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46-49

CP0805 and CP0603 Test Jigs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

DB0805 3dB 90° Couplers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51-62

DB0805 3dB 90° Test Jigs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

Thin-Film RF/Microwave Harmonic Low Pass Filter – LP0603/LP0805 . . . . . . . . . . . . . . . . . . . . 64-71

LP0603 Test Jigs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67-68

LP0805 Test Jigs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

Thin-Film RF/Microwave Products – Designer Kits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72-74

RF/Microwave Multilayer Capacitors (MLC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75-89

Porcelain Capacitors (+90 20ppm/°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76-79

• AQ06 (0.063" x 0.032") - Cap. Range: 0.1 to 120pF

• AQ11; AQ12 (0.055" x 0.055") - Cap. Range: 0.1 to 100pF

• AQ13; AQ14 (0.110" x 0.110") - Cap. Range: 0.1 to 1000pF

Hi-Q NP0 Capacitors (0 30ppm/°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

• AQ06 (0.063" x 0.032") - Cap. Range: 0.1 to 120pF

• AQ11; AQ12 (0.055" x 0.055") - Cap. Range: 0.1 to 1000pF

• AQ13; AQ14 (0.110" x 0.110") - Cap. Range: 0.1 to 5100pF

Hi-K RF Capacitors ( 15ꢀ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78-79

• AQ12 (0.055" x 0.055") - Cap. Range: 0.001 to 0.010µF

• AQ14 (0.110" x 0.110") - Cap. Range: 0.005 to 0.1µF

MIL-PRF-55681 “BG” Voltage Temperature Limits (+90 20ppm/°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80-82

• CDR11BG; CDR12BG (0.055" x 0.055") - Failure Rate Level: M, P, R, S

• CDR13BG; CDR14BG (0.110" x 0.110") - Failure Rate Level: M, P, R, S

MIL-PRF-55681 “BP” Voltage Temperature Limits (0 30ppm/°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80-82

• CDR11BP; CDR12BP (0.055" x 0.055") - Failure Rate Level: M, P, R, S

• CDR13BP; CDR14BP (0.110" x 0.110") - Failure Rate Level: M, P, R, S

Performance Curves. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83-87

Automatic Insertion Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

Hi-Q^®High RF Power MLC Surface Mount Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

RF/Microwave C0G (NP0) Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90-93

Ultra Low ESR “U” Series, C0G (NP0)

• 0402 (0.040" x 0.020"), 0603 (0.060" x 0.030"), 0805 (0.080" x 0.050"), 1210 (0.125" x 0.100") . . . . . . . . . . . . . . . . . . 91-93

RF/Microwave AQ 12 & 14 and “U” Series Designer Kits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94-97

Introduction to Microwave Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98-110

2

RF/Microwave Products

Table of Contents

Company Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Thin-Film RF/Microwave Technology – Accu-F^®/ Accu-P^®. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-24

Thin-Film RF/Microwave Technology – Accu-L^®L0603, L0805. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25-30

Thin-Film RF/Microwave Directional Couplers – CP0402/CP0603/CP0805/DB0805 3dB 90° . . . . 31-63

Thin-Film RF/Microwave Harmonic Low Pass Filter – LP0603/LP0805 . . . . . . . . . . . . . . . . . . . . . . . . . 64-71

Thin-Film RF/Microwave Products – Designer Kits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72-74

RF/Microwave Multilayer Capacitors (MLC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75-89

RF/Microwave C0G (NP0) Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90-93

RF/Microwave AQ 12 & 14 and “U” Series Designer Kits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94-97

1

2

3

4

5

6

7

8

9

Introduction to Microwave Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98-110

3

RF/Microwave Products

Company Profile

AVX Corporation is a leading manufacturer of multilayer ceramic,

thin film, tantalum, and glass capacitors, as well as other passive

electronic components. These products are used in virtually every

variety of electronic system today, including data processing,

telecommunications, consumer/automotive electronics, military and

aerospace systems, and instrumentation and process controls.

We continually strive to be the leader in all component segments we

supply. RF/Microwave capacitors is a thrust business for us. AVX

offers a broad line of RF/Microwave Chip Capacitors in a wide range

of sizes, styles, and ratings.

The Thin-Film Products range illustrated in this catalog represents

the state-of-the-art in RF Capacitors, Inductors, Directional

Couplers and Low Pass Filters. The thin-film technology provides

components that exhibit excellent batch-to-batch repeatability of

electrical parameters at RF frequencies.

The Accu-F^®and Accu-P^®series of capacitors are available in ultra-

tight tolerances (±±.±2pFꢀ as well as non-standard capacitance

values.

The Accu-L^®series of inductors are ideally suited for applications

requiring an extremely high Q and high current capability.

The CP±4±2/CP±6±3/CP±8±5 series of Directional Couplers cover

the frequency range of 8±± MHz to 6 GHz. They feature low inser-

tion loss, high directivity and highly accurate coupling factors.

The LP±8±5 series of Low Pass Filters provide a rugged component

in a small ±8±5 size package with excellent high frequency perfor-

mance.

Another major series of microwave capacitors consists of both

multilayer porcelain and ceramic capacitors for frequencies from

1± MHz to 4.2 GHz (AQ11 - 14 Seriesꢀ. Three sizes of specially

designed ultra-low ESR C±G (NP±ꢀ capacitors are covered for

RF applications (“U” Seriesꢀ.

Ask the world of us. Call (843) 448-9411.

Or visit our website http://www.avx.com

4

1

Thin-Film Technology

®

Accu-F / Accu-P

Thin-Film RF/Microwave Capacitors

5

®

Accu-F / Accu-P

Thin-Film Technology

This accuracy sets apart these Thin-Film capacitors from

ceramic capacitors so that the term Accu has been

employed as the designation for this series of devices, an

abbreviation for “accurate.”

THE IDEAL CAPACITOR

The non-ideal characteristics of a real capacitor can be

ignored at low frequencies. Physical size imparts inductance

to the capacitor and dielectric and metal electrodes result in

resistive losses, but these often are of negligible effect on the

circuit. At the very high frequencies of radio communication

(>100MHz) and satellite systems (>1GHz), these effects

become important. Recognizing that a real capacitor will

exhibit inductive and resistive impedances in addition to

capacitance, the ideal capacitor for these high frequencies is

an ultra low loss component which can be fully characterized

in all parameters with total repeatability from unit to unit.

THIN-FILM TECHNOLOGY

Thin-film technology is commonly used in producing semi-

conductor devices. In the last two decades, this technology

has developed tremendously, both in performance and in

process control. Today’s techniques enable line definitions of

below 1µm, and the controlling of thickness of layers at 100Å

1

-2

(10 µm). Applying this technology to the manufacture of

Until recently, most high frequency/microwave capacitors

were based on fired-ceramic (porcelain) technology. Layers

of ceramic dielectric material and metal alloy electrode paste

are interleaved and then sintered in a high temperature oven.

This technology exhibits component variability in dielectric

quality (losses, dielectric constant and insulation resistance),

variability in electrode conductivity and variability in physical

size (affecting inductance). An alternate thin-film technology

has been developed which virtually eliminates these vari-

ances. It is this technology which has been fully incorporated

capacitors has enabled the development of components

where both electrical and physical properties can be tightly

controlled.

The thin-film production facilities at AVX consist of:

• Class 1000 clean rooms, with working areas under

laminar-flow hoods of class 100, (below 100 particles

per cubic foot larger than 0.5µm).

• High vacuum metal deposition systems for high-purity

electrode construction.

®

into Accu-F and Accu-P to provide high frequency capaci-

tors exhibiting truly ideal characteristics.

• Photolithography equipment for line definition down to

2.0µm accuracy.

®

The main features of Accu-F and Accu-P may be summa-

rized as follows:

• Plasma-enhanced CVD for various dielectric deposi-

tions (CVD=Chemical Vapor Deposition).

• High purity of electrodes for very low and repeatable

ESR.

• High accuracy, microprocessor-controlled dicing saws

for chip separation.

• Highly pure, low-K dielectric for high breakdown field,

high insulation resistance and low losses to frequencies

above 40GHz.

• High speed, high accuracy sorting to ensure strict

tolerance adherence.

• Very tight dimensional control for uniform inductance,

unit to unit.

• Very tight capacitance tolerances for high frequency

signal applications.

TERMINATION

ALUMINA

SEAL

ELECTRODE

DIELECTRIC

ALUMINA

ACCU-P^®CAPACITOR

6

®

Accu-F / Accu-P

Thin-Film Chip Capacitors

ACCU-F^®TECHNOLOGY

ACCU-P^®TECHNOLOGY

As in the Accu-F series the use of very low-loss dielectric

®

The use of very low-loss dielectric materials, silicon dioxide

and silicon oxynitride, in conjunction with highly conductive

electrode metals results in low ESR and high Q. These

high-frequency characteristics change at a slower rate with

increasing frequency than for ceramic microwave capacitors.

materials (silicon dioxide and silicon oxynitride) in conjunction

with highly conductive electrode metals results in low ESR and

high Q. At high frequency these characteristics change at

a slower rate with increasing frequency than conventional

ceramic microwave capacitors. Using thin-film technology, the

above-mentioned frequency characteristics are obtained with-

out significant compromise of properties required for surface

mounting. The use of high thermal conductivity materials

results in excellent RF power handling capabilities.

Because of the thin-film technology, the above-mentioned

frequency characteristics are obtained without significant

compromise of properties required for surface mounting.

1

®

The main Accu-F properties are:

• Internationally agreed sizes with excellent dimensional

control.

• Small size chip capacitors (0603) are available.

• Tight capacitance tolerances.

• Low ESR at VHF, UHF and microwave frequencies.

• High stability with respect to time, temperature, frequency

and voltage variation.

®

The main Accu-P properties are:

• Enhanced RF power handling capability.

• Improved mechanical characteristics.

• Internationally agreed sizes with excellent dimensional control.

• Ultra Small size chip capacitors (0201) are available.

• Tight capacitance tolerances.

• Low ESR at UHF, VHF, and microwave frequencies.

• High-stability with respect to time, temperature, frequency

and voltage variation.

• Nickel/solder-coated terminations to provide excellent

solderability and leach resistance.

ACCU-F^®FEATURES

Accu-F meets the fast-growing demand for low-loss

• High temperature nickel/solder-coated terminations as stan-

dard to provide excellent solderability and leach resistance.

®

(high-Q) capacitors for use in surface mount technology espe-

cially for the mobile communications market, such as cellular

radio of 450 and 900 MHz, UHF walkie-talkies, UHF cordless

telephones to 2.3 GHz, low noise blocks at 11-12.5 GHz and

for other VHF, UHF and microwave applications.

ACCU-P^®FEATURES

• Minimal batch to batch variability of parameters at high fre-

quency.

®

• The Accu-P has the same unique features as the Accu-F

®

Accu-F is currently unique in its ability to offer very

capacitor such as low ESR, high Q, availability of very low

capacitance values and very tight capacitance tolerances.

low capacitance values (0.1pF) and very tight capacitance

®

tolerances ( 0.05pF). Typically Accu-F will be used in small

®

• The RF power handling capability of the Accu-P allows for

its usage in both small signal and RF power applications.

signal applications in VCO’s, matching networks, filters, etc.

Inspection test and quality control procedures in accordance

with ISO 9001, CECC, IECQ and USA MIL Standards yield

products of the highest quality.

• Inspection, test and quality control procedures in accor-

dance with ISO 9001, CECC, IECQ and USA MIL Standards

guarantee product of the highest quality.

®

• Hand soldering Accu-P : Due to their construction

APPLICATIONS

utilizing relatively high thermal conductivity materials,

Accu-P’s have become the preferred device in R & D labs

and production environments where hand soldering is used.

Accu-P’s are available in all sizes and are electrically identi-

cal to their Accu-F counterparts.

Cellular Communications

Radar Systems

Video Switching

Test & Measurements

Filters

VCO’s

Matching Networks

CT2/PCN (Cordless

Telephone/Personal Comm.

Networks)

Satellite TV

Cable TV

GPS (Global Positioning Systems)

Vehicle Location Systems

Vehicle Alarm Systems

Paging

APPLICATIONS

Cellular Communications

CT2/PCN (Cordless

Telephone/Personal Comm.

Networks)

Satellite TV

Cable TV

GPS (Global Positioning Systems)

Vehicle Location Systems

Vehicle Alarm Systems

Paging

Radar Systems

Video Switching

Test & Measurements

Filters

APPROVALS

ISO 9001

Military Communications

VCO's

Matching Networks

RF Amplifiers

APPROVALS

ISO 9001

Military Communications

7

®

Accu-F */ Accu-P

Thin-Film Chip Capacitors for

RF Signal and Power Applications

B₁

T

B₂

ACCU-P^®(Signal and Power Type Capacitors)

L

1

0201

0402*

0603*

0805*

1210

3.±2±±.1

ACCU-F^®*(Signal Type Capacitors)

±.6±±±.±5

1.±±±±.1

1.6±±±.1

2.±1±±.1

L

W

T

0603

1.6±±±.1

(±.±63±±.±±4ꢀ

0805

2.±1±±.1

(±.±79±±.±±4ꢀ

(±.±23±±.±±2ꢀ (±.±39±±.±±4ꢀ (±.±63±±.±±4ꢀ (±.±79±±.±±4ꢀ (±.119±±.±±4ꢀ

±.325±±.±5± ±.55±±.±7 ±.81±±.1 1.27±±.1 2.5±±.1

(±.±128±±.±±2ꢀ (±.±22±±.±±3ꢀ (±.±32±±.±±4ꢀ (±.±5±±±.±±4ꢀ (±.1±±±±.±±4ꢀ

±.225±±.±5± ±.4±±±.1 ±.63±±.1 ±.93±±.2 ±.93±±.2

(±.±±9±±.±±2ꢀ (±.±16±±.±±4ꢀ (±.±25±±.±±4ꢀ (±.±36±±.±±8ꢀ (±.±36±±.±±8ꢀ

±.1±±±.1± ±.±±±±.1/-± ±.35±±.15 ±.3±±±.1 ±.43±±.1

(±.±±4±±.±±4ꢀ (±.±±±±±.±±4/-±ꢀ (±.±14±±.±±6ꢀ (±.±12±±.±±4ꢀ (±.±17±±.±±4ꢀ

±.15±±.±5 ±.2±±±.1 ±.35±±.15 ±.3±±±.1 ±.43±±.1

(±.±±6±±.±±2ꢀ (±.±±8±±.±±4ꢀ (±.±14±±.±±6ꢀ (±.±12±±.±±4ꢀ (±.±17±±.±±4ꢀ

L

W

T

±.81±±.1

(±.±32±±.±±4ꢀ

1.27±±.1

(±.±5±±±.±±4ꢀ

±.63±±.1

(±.±25±±.±±4ꢀ

±.63±±.1

(±.±25±±.±±4ꢀ

B₁

B₂

±.3±±±.1

(±.±12±±.±±4ꢀ

±.3±±±.1

(±.±12±±.±±4ꢀ

B

Not recommended for new designs.

Accu-P’s are recommended.

DIMENSIONS:

millimeters (inches)

Mount Black Side Up

DIMENSIONS: millimeters (inches)

*

HOW TO ORDER

0805

5

J

120

G

A

W

TR

Size

0201*

0402*

0603

0805

Voltage Temperature Capacitance

1 = 100V Coefficient (1)

Tolerance

for

Termination

Code

Packaging

Code

TR = Tape and Reel

Specification

Code

Capacitance

J = 0 30ppm/°C expressed in pF.

®

5 = 50V

3 = 25V

Y = 16V

Z = 10V

C≤2.0pF*

W = Nickel/

A = Accu-F

(-55°C to

+125°C)

K = 0 60ppm/°C

(-55°C to

(2 significant

digits + number Q = 0.03pF

of zeros)

for values

<10pF,

P = 0.02pF

Solder Coated

technology

®

Accu-F Sn63, Pb37

B = Accu-P

®

1210*

* Accu-P ONLY

A = 0.05pF

B = 0.1pF

C = 0.25pF

technology

Accu-P 0201 & 0402

Sn90, Pb10

+125°C)

T = Nickel/High Temperature

letter R denotes

decimal point.

Example:

68pF = 680

8.2pF = 8R2

for

C≤3.0pF

Q = 0.03pF

A = 0.05pF

B = 0.1pF

C = 0.25pF

Solder Coated

®

Accu-P 0603, 0805, 1210

Sn96, Ag4

S = Nickel/Lead Free

Solder Coated

®

Accu-P 0402

⁽¹⁾TC’s shown are per EIA/IEC Specifications.

for

C≤5.6pF

A = 0.05pF

B = 0.1pF

C = 0.25pF

Sn100

for

5.6pF<C<10pF

B = 0.1pF

C = 0.25pF

D = 0.5pF

for

C≥10pF

F = 1ꢀ

G = 2ꢀ

J = 5ꢀ

* Tolerances as tight as 0.01pF are available.

Please consult the factory.

ELECTRICAL SPECIFICATIONS

Operating and Storage Temperature Range

Temperature Coefficients⁽¹⁾

Capacitance Measurement

Insulation Resistance (IR)

Proof Voltage

-55°C to +125°C

0

30ppm/°C dielectric code “J” / 0 60ppm/°C dielectric code “K”

1 MHz, 1 Vrms

≥10¹¹Ohms (≥10 Ohms for 0201 and 0402 size)

2.5 U_Rfor 5 secs.

Zero

10

Aging Characteristic

Dielectric Absorption

0.01ꢀ

⁽¹⁾TC’s shown are per EIA/IEC Specifications.

8

®

Accu-F *

Signal Type Capacitors

Accu-F^®Capacitance Ranges (pF)

TEMP. COEFFICIENT CODE

“J” = 0 30ppm/°C

TEMP. COEFFICIENT CODE

“K” = 0 60ppm/°C

(-55°C to +125°C)⁽²⁾

(-55°C to +125°)⁽²⁾

1

Size

Size Code

Size

Size Code

0603

50

0805

50

0603

50

0805

50

Voltage

100

25

100

25

Voltage

100

25

100

25

Cap in

pF⁽¹⁾

Cap

Cap in

Cap

(

code

pF⁽¹⁾

code

±.1

±.2

±.3

±.4

±.5

±.6

±.7

±.8

±.9

—

±R1

±R2

±R3

±R4

±R5

±R6

±R7

±R8

±R9

±.1

±.2

±.3

±.4

±.5

±.6

±.7

±.8

±.9

—

±R1

±R2

±R3

±R4

±R5

±R6

±R7

±R8

±R9

1.±

1.2

1.5

—

1R±

1R2

1R5

1.±

1.2

1.5

—

1R±

1R2

1R5

1.8

2.2

2.7

—

1R8

2R2

2R7

1.8

2.2

2.7

—

1R8

2R2

2R7

3.3

3.9

4.7

—

3R3

3R9

4R7

3.3

3.9

4.7

—

3R3

3R9

4R7

5.6

6.8

8.2

—

5R6

6R8

8R2

5.6

6.8

8.2

—

5R6

6R8

8R2

1±

12

15

—

1±±

12±

15±

1±

12

15

—

1±±

12±

15±

18

22

27

—

18±

22±

27±

18

22

27

—

18±

22±

27±

33

39

47

—

33±

39±

47±

33

39

47

—

33±

39±

47±

56

68

82

—

56±

68±

82±

56

68

82

—

56±

68±

82±

1±±

12±

15±

—

1±1

121

151

1±±

12±

15±

—

1±1

121

151

(1ꢀ

For capacitance values higher than listed in table,

please consult factory.

For capacitance values higher than listed in table,

please consult factory.

(2ꢀ

TC shown is per EIA/IEC Specifications.

^(2ꢀTC shown is per EIA/IEC Specifications.

Intermediate values are available within the indicated range.

Not recommended for new designs.

Accu-P’s are recommended.

*

9

®

Accu-P

Signal and Power Type Capacitors

Accu-P^®Capacitance Ranges (pF)

TEMP. COEFFICIENT CODE

“K” = 0 60ppm/°C (-55°C to +125°C)

Size

(2)

“J” = 0 30ppm/°C (-55°C to +125°C)

Size

Size Code

Voltage

0805

50

1210

100

Size Code

Voltage

0201

0402

0603

0805

1210

100

25

50⁽³⁾

25 16 10 25 16 10 50 25 100 50 25 100 50

Cap in

Cap

Cap in

Cap

pF⁽¹⁾

code

pF⁽¹⁾

code

1

±.1

±.2

±.3

±.4

±.5

±.6

±.7

±.8

±.9

—

±R1

±R2

±R3

±R4

±R5

±R6

±R7

±R8

±R9

±.1

±.2

±.3

±.4

±.5

±.6

±.7

±.8

±.9

—

±R1

±R2

±R3

±R4

±R5

±R6

±R7

±R8

±R9

1.±

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

—

1R±

1R1

1R2

1R3

1R4

1R5

1R6

1R7

1R8

1R9

1.±

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

—

1R±

1R1

1R2

1R3

1R4

1R5

1R6

1R7

1R8

1R9

2.±

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

2.9

—

2R±

2R1

2R2

2R3

2R4

2R5

2R6

2R7

2R8

2R9

2.±

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

2.9

—

2R±

2R1

2R2

2R3

2R4

2R5

2R6

2R7

2R8

2R9

3.±

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

—

3R±

3R1

3R2

3R3

3R4

3R5

3R6

3R7

3R8

3R9

3.±

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

—

3R±

3R1

3R2

3R3

3R4

3R5

3R6

3R7

3R8

3R9

4.±

4.1

4.2

4.3

4.4

4.5

4.6

4.7

—

4R±

4R1

4R2

4R3

4R4

4R5

4R6

4R7

4.±

4.1

4.2

4.3

4.4

4.5

4.6

4.7

—

4R±

4R1

4R2

4R3

4R4

4R5

4R6

4R7

5.1

5.6

6.2

—

5R1

5R6

6R2

5.1

5.6

6.2

—

5R1

5R6

6R2

6.8

7.5

8.2

—

6R8

7R5

8R2

6.8

7.5

8.2

—

6R8

7R5

8R2

9.1

1±.±

11.±

—

9R1

1±±

11±

9.1

1±.±

11.±

—

9R1

1±±

11±

12.±

13.±

14.±

—

12±

13±

14±

12.±

13.±

14.±

—

12±

13±

14±

15.±

16.±

17.±

—

15±

16±

17±

15.±

16.±

17.±

—

15±

16±

17±

18.±

22.±

24.±

—

18±

22±

24±

18.±

22.±

24.±

—

18±

22±

24±

27.±

3±.±

33.±

—

27±

3±±

33±

27.±

3±.±

33.±

—

27±

3±±

33±

39.±

47.±

56.±

68.±

—

39±

47±

56±

68±

39.±

47.±

56.±

68.±

—

39±

47±

56±

68±

^(1ꢀFor capacitance values higher than listed in table,

please consult factory.

^(1ꢀFor capacitance values higher than listed in table,

please consult factory.

^(2ꢀTC shown is per EIA/IEC Specifications.

^(3ꢀFor 5± volt range, please consult factory.

^(2ꢀTC shown is per EIA/IEC Specifications.

These values are produced with “K” temperature coefficient

code only.

Intermediate values are available within the indicated range.

1±

®

Accu-P

0201 Typical Electrical Tables

Self

250MHz

500MHz

750MHz

1000MHz

1250MHz

Capacitance Resonance

@ 1 MHz

(pF)

Frequency

(GHz)

Typical

Typ.

C(eff)

(pF)

Typ.

Q

Typ.

ESR

(ꢀΩ)

Typ.

C(eff)

(pF)

Typ.

Q

Typ.

ESR

(ꢀΩ)

Typ.

C(eff)

(pF)

Typ.

Q

Typ.

ESR

(ꢀΩ)

Typ.

C(eff)

(pF)

Typ.

Q

Typ.

ESR

(ꢀΩ)

Typ.

C(eff)

(pF)

Typ.

Q

Typ.

ESR

(ꢀΩ)

0.8

1.2

1.8

2.2

3.3

3.9

4.7

5.6

6.8

9.1

7.6

6.3

5.7

4.6

4.3

3.9

3.6

3.3

0.84

1.21

1.84

2.23

3.29

3.91

4.71

5.62

6.77

2154

1375

1298

1355

1295

1902

1677

1391

1135

360

405

271

214

156

93

0.84

1.21

1.85

2.24

3.31

3.93

4.74

5.67

6.83

630

525

520

512

430

460

391

370

314

603

517

341

281

230

181

174

154

149

0.85

1.22

1.86

2.25

3.33

3.97

4.80

5.74

6.91

424

341

337

335

285

298

252

257

217

594

527

347

284

230

185

178

148

142

0.85

1.23

1.87

2.27

3.36

4.02

4.87

5.83

7.03

327

267

270

264

220

227

181

195

164

577

503

326

270

223

181

183

144

139

0.86

1.23

1.88

2.29

3.40

4.08

4.97

5.95

7.18

255

208

201

199

159

163

130

140

118

588

515

347

284

242

198

200

157

151

1

84

Self

1500MHz

1750MHz

2250MHz

2500MHz

2750MHz

Capacitance Resonance

@ 1 MHz

(pF)

Frequency

(GHz)

Typical

Typ.

C(eff)

(pF)

Typ.

Q

Typ.

ESR

(ꢀΩ)

Typ.

C(eff)

(pF)

Typ.

Q

Typ.

ESR

(ꢀΩ)

Typ.

C(eff)

(pF)

Typ.

Q

Typ.

ESR

(ꢀΩ)

Typ.

C(eff)

(pF)

Typ.

Q

M

Typ.

ESR

(ꢀΩ)

Typ.

C(eff)

(pF)

Typ.

Q

Typ.

ESR

(ꢀΩ)

0.8

1.2

1.8

2.2

3.3

3.9

4.7

5.6

6.8

9.1

7.6

6.3

5.7

4.6

4.3

3.9

3.6

3.3

0.86

1.24

1.90

2.32

3.45

4.16

5.08

6.11

7.38

204

155

148

145

119

122

99

611

565

388

320

266

216

213

166

155

0.87

1.26

1.92

2.34

3.50

4.25

5.23

6.31

7.63

168

129

123

101

103

83

631

577

395

322

263

214

212

164

158

0.88

1.28

1.96

2.41

3.63

4.46

5.55

6.76

8.22

141

92

96

93

74

75

60

64

54

587

570

395

329

277

224

221

174

166

0.89

1.30

1.99

2.46

3.73

4.63

5.83

7.16

8.74

126

89

83

81

64

50

53

44

571

566

396

328

276

223

222

175

169

0.90

1.31

2.02

2.50

3.84

4.79

6.10

7.56

9.29

122

81

74

72

55

56

43

45

37

532

558

397

330

281

225

224

141

173

108

93

91

76

11

®

Accu-P

0402 Typical Electrical Tables

Capacitance

Self

& Tolerance* Resonance Ref

Typ.

Q

Typ.

Ref

Typ.

Q

Typ. Ref Typ.

Typ.

Q

Typ.

Ref Typ. Typ.

Typ.

Ref

Typ.

Q

Typ.

@ 1 MHz

(pF)

Frequency

(GHz)

Typical

Freq C(eff)

(MHz) (pF)

ESR Freq C(eff)

(Ω) (MHz) (pF)

ESR Freq C(eff)

(Ω) (MHz) (pF)

ESR Freq C(eff)

(Ω) (MHz) (pF)

Q

ESR

(Ω)

Freq C(eff)

(MHz) (pF)

ESR

(Ω)

0.1 0.05

0.2 0.05

0.3 0.05

0.4 0.05

0.5 0.05

0.6 0.05

0.7 0.05

0.8 0.05

0.9 0.05

1.00 0.05

1.10 0.05

1.20 0.05

1.30 0.05

1.40 0.05

1.50 0.05

1.60 0.05

1.70 0.05

1.80 0.05

1.90 0.05

2.00 0.05

2.10 0.05

2.20 0.05

2.30 0.05

2.40 0.05

2.50 0.05

2.60 0.05

2.70 0.05

2.80 0.05

2.90 0.05

3.00 0.05

3.10 0.05

3.20 0.05

3.30 0.05

3.40 0.05

3.50 0.05

3.60 0.05

3.70 0.05

3.80 0.05

3.90 0.05

4.00 0.05

4.10 0.05

4.20 0.05

4.30 0.05

4.40 0.05

4.50 0.05

4.60 0.05

4.70 0.05

5.10 0.05

5.60 0.05

6.2 0.1

19.4

16.4

14.6

12.5

11.3

10.4

9.5

9.1

8.8

8

7.8

7.4

7

6.8

6.5

6.4

6.2

6

n/a

1.15 1283

1.22 1219

1.33 1153

1.42 1109

1.54 1061

1.63 1002

1.76

1.81

1.86

1.93

2.06

2.14

2.27

2.36

2.48

2.6

2.71

2.83

2.94

3.11

3.39

3.45

3.61

3.72

3.78

3.82

3.87

3.93

4

4.01

4.07

4.18

4.27

4.34

4.45

4.52

4.62

4.74

5.16

5.75

6.09

6.94

7.51

8.36

9.28

n/a

1.13

1.21

1.31

1.4

1.52

1.58

1.69

1.75

1.83

1.91

2.11

2.21

2.26

2.4

2.51

2.62

2.73

2.82

2.9

2.99

3.11

3.22

3.3

3.42

3.53

3.6

3.7

3.81

3.9

4.02

4.11

4.2

4.29

4.43

4.5

n/a

1.12 620

1.19 561

1.3

1.35 480

1.49 461

1.6

1.71 429

1.75 422

1.8

1.91 401

2.01 400

2.1

2.27 396

2.3 379

2.41 358

2.52 349

2.65 331

2.86 313

2.91 308

3.15 303

3.41 299

3.48 291

3.68 285

n/a

1

n/a

247

246

245

244

243

242

241

240

239

238

237

236

235

234

233

232

231

230

229

228

227

226

225

224

223

222

221

220

217

214

211

208

205

202

199

196

193

189

186

184

182

179

178

1.16 1635 0.34

1.25 1581 0.32

1.34 1538 0.30

1.42 1502 0.29

1.53 1476 0.28

1.63 1454 0.28

1.71 1448 0.27

1.85 1444 0.27

1.93 1430 0.26

2.01 1421 0.25

2.11 1410 0.24

2.21 1406 0.23

2.28 1406 0.22

2.32 1405 0.20

2.45 1404 0.19

2.49 1404 0.18

494

492

491

490

488

486

485

483

482

481

480

478

476

475

473

472

470

469

468

467

466

465

464

462

461

460

459

458

457

456

455

454

453

452

451

450

447

443

440

436

433

430

428

0.22 742

0.21 740

0.21 738

0.21 736

0.20 733

0.20 731

0.20 729

0.19 728

0.19 727

0.19 726

0.18 722

0.17 720

0.16 718

0.16 716

0.16 715

0.16 714

0.15 712

0.15 711

0.15 710

0.15 709

0.15 708

0.15 707

0.14 707

0.14 706

0.14 705

0.14 704

0.14 702

0.13 699

0.13 697

0.13 696

0.12 695

0.12 694

0.12 693

0.12 692

0.11 691

0.11 690

0.11 687

0.11 684

0.10 681

0.09 678

0.09 675

0.08 673

0.09 670

870

791

727

701

680

638

622

612

597

583

582

581

549

501

486

477

464

458

450

440

429

421

415

407

402

395

389

386

384

381

380

379

373

369

364

359

351

348

342

339

334

320

306

249

0.22

0.21

0.20

0.19

0.18

0.17

0.16

0.15

0.14

0.13

0.12

0.11

0.10

0.09

0.10

0.11

0.09

0.12

0.10

0.11

0.10

0.11

0.12

991

989

986

983

980

978

986

985

983

972

969

966

964

962

960

959

958

956

954

953

952

951

950

949

948

947

946

945

944

943

942

941

940

939

938

937

934

932

928

926

924

922

920

0.23 1240 1.14

0.24 1238 1.21

0.25 1234 1.33

0.24 1230 1.41

0.23 1229 1.53

0.23 1226 1.65

0.23 1224 1.77

0.22 1223 1.86

0.22 1220 1.91

0.21 1219 1.97

0.20 1215 2.11

0.19 1213 2.22

0.18 1212 2.35

0.18 1209

0.19 1208 2.53

0.19 1205 2.7

0.19 1204 2.85

0.19 1203

0.18 1202 3.12

0.18 1201 3.24

0.18 1201 3.33

0.18 1199 3.45

0.17 1198 3.58

0.17 1197 3.61

0.17 1196 3.78

0.16 1195 3.91

474

425

372

350

333

316

309

305

299

294

293

291

289

262

253

240

231

224

220

218

212

207

203

198

195

191

186

181

177

172

170

169

167

168

162

161

159

131

129

128

127

120

0.25

0.24

0.23

0.22

0.21

0.20

0.19

0.20

0.19

0.18

0.17

0.16

0.15

0.14

0.13

0.12

0.15

0.13

0.14

503

438

986

970

931

897

896

893

870

845

821

799

778

769

751

746

733

725

711

705

693

688

667

658

649

650

655

658

657

660

665

670

673

589

576

585

591

567

542

458

413

5.7

5.4

5.1

5

398

2.4

4.9

4.7

4.6

4.5

4.4

4.3

4.2

4.1

4

3.9

3.8

3.7

3.6

3.5

3.4

3.3

3

2.8

2.7

2.6

2.5

2.4

2.3

2.2

2.1

2

1.9

1.8

1.75

2.6

1402 0.16

2.84 1399 0.15

2.85 1395 0.15

2.87 1395 0.15

2.88 1392 0.14

3

2.9

1392 0.14

2.91 1391 0.14

2.92 1391 0.14

2.93 1390 0.14

2.95 1389 0.13

2.97 1382 0.13

2.99 1381 0.13

3.8

282

3.79 276

3.85 273

3.89 270

3.95 262

4.02 256

4.11 251

4.18 250

4.23 248

4.37 247

4.58 246

4.62 246

0.16 1194

0.16 1193

4

4.1

4

1380 0.13

0.16 1192 4.23

0.16 1191 4.37

0.16 1190 4.46

0.15 1190 4.52

0.15 1199 4.66

0.15 1195 4.75

0.14 1192 4.82

0.14 1190 4.96

0.14 1188 5.07

0.14 1186 5.18

0.14 1184 5.82

0.14 1182 6.62

0.12 1180 7.34

0.11 1177 8.22

0.10 1176 9.01

4.01 1379 0.13

4.09 1372 0.12

4.18 1370 0.12

4.27 1356 0.12

4.36 1355 0.12

4.44 1351 0.11

4.53 1350 0.11

4.62 1347 0.11

4.75 1343 0.11

5.19 1310 0.11

5.74 1297 0.11

6.31 1244 0.10

6.92 1202 0.09

7.57 1155 0.08

8.35 1116 0.08

9.23 1059 0.09

4.6

4.7

245

4.72

4.74

5.23

5.81

6.33

7.04

7.85

8.48

9.87

4.79 244

4.86 244

5.53 230

6.01 201

6.68 202

7.39 203

8.17 191

8.93 186

10.2 152

6.8 0.1

7.5 0.1

8.2 0.1

9.1 0.1

0.10 1174 10.04 118

0.11 1172 11.98

0.13 1171 13.75

0.12 1170 15.3

0.13 1168 17.63

0.11 1164 23.9

0.14 1167 23.1

0.16 1166 23.6

0.13 1161 34.7

0.12 1163 34.9

0.11 1164 35.2

0.11 1163 37.5

0.12 1162 39.1

0.13 1161 100.5

88

70

61

52

47

40

44

28

29

24

19

15

10.0 1ꢀ

11.0 1ꢀ

12.0 1ꢀ

13.0 1ꢀ

14.0 1ꢀ

15.0 1ꢀ

16.0 1ꢀ

17.0 1ꢀ

18.0 1ꢀ

19.0 1ꢀ

20.0 1ꢀ

22.0 1ꢀ

10.14 936

11.19 912

12.16 889

13.3

14.26 802

15.34 791

0.09

0.08

0.07

0.08

0.07

0.08

424 10.24 385

421 11.17 363

418

416 13.32 363

414 14.44 298

413 15.46 283

410

409 18.42 258

407 19.4 241

405 20.43 195

404 23.105 174

0.10 668 10.55 202

0.09 666 11.81 185

0.09 664 12.77 173

0.08 661

0.09 660 15.03 149

0.08 660 16.16 138

0.08 657

0.07 657 19.51 130

0.07 655 20.51 115

0.06 655

0.54 654

919 11.49 118

917 12.87 103

915 14.16 95

12.3

348

984

14.1

183

912

15.8 101

913 16.72 76.7

912 18.51 82

16.3

17.6

780

765

16.4

17.7

270

263

17.6

18.2

129

130

909

910

908

20.2

21.3

22.7 75.5

24.5

26.5

68

70

176.5 18.13 754

175

173

19.2

20.32 520

680

62

57

22.1

25

112

85.5

170.04 22.42 497.5 0.09

907 30.95 44

* Other tolerances are available, see page 8

12

®

Accu-P

0402 Typical Electrical Tables

Capacitance

Self

& Tolerance* Resonance Ref

Typ.

Q

Typ.

Ref

Typ. Typ.

Typ.

Ref Typ.

Typ.

Q

Typ.

Ref

Typ. Typ. Typ.

Ref

Typ.

Q

Typ.

@ 1 MHz

(pF)

Frequency

(GHz)

Typical

Freq C(eff)

(MHz) (pF)

ESR Freq C(eff)

(Ω) (MHz) (pF)

Q

ESR Freq C(eff)

(Ω) (MHz) (pF)

ESR Freq C(eff)

(Ω) (MHz) (pF)

Q

ESR

Freq C(eff)

(MHz) (pF)

ESR

(Ω)

0.1 0.05

0.2 0.05

0.3 0.05

0.4 0.05

0.5 0.05

0.6 0.05

0.7 0.05

0.8 0.05

0.9 0.05

1.00 0.05

1.10 0.05

1.20 0.05

1.30 0.05

1.40 0.05

1.50 0.05

1.60 0.05

1.70 0.05

1.80 0.05

1.90 0.05

2.00 0.05

2.10 0.05

2.20 0.05

2.30 0.05

2.40 0.05

2.50 0.05

2.60 0.05

2.70 0.05

2.80 0.05

2.90 0.05

3.00 0.05

3.10 0.05

3.20 0.05

3.30 0.05

3.40 0.05

3.50 0.05

3.60 0.05

3.70 0.05

3.80 0.05

3.90 0.05

4.00 0.05

4.10 0.05

4.20 0.05

4.30 0.05

4.40 0.05

4.50 0.05

4.60 0.05

4.70 0.05

5.10 0.05

5.60 0.05

6.2 0.1

19.4

16.4

14.6

12.5

11.3

10.4

9.5

9.1

8.8

8

7.8

7.4

7

6.8

6.5

6.4

6.2

6

n/a

380

342

307

289

265

252

246

241

240

239

233

230

228

214

196

182

173

164

159

156

150

148

145

143

138

133

130

126

125

121

120

119

118

105

90

n/a

314

275

251

240

221

203

201

199

198

197

190

185

183

168

151

144

132

122

120

117

114

109

105

101

95

94

92

90

89

88

87

85

81

80

75

61

60

58

n/a

265

232

208

196

179

169

168

167

166

165

160

155

149

132

120

112

97

94

88

84

81

79

77

76

75

73

71

69

67

66

65

n/a

200

177

149

137

125

115

119

120

122

123

118

115

108

99

91

81

72

66

65

63

61

59

58

55

52

51

49

48

47

48

49

50

52

54

39

28

33

36

33

31

15

8

n/a

1

n/a

1489

1485

1483

1479

1477

1474

1472

1470

1469

1468

1466

1463

1461

1460

1459

1458

1455

1453

1451

1450

1449

1448

1447

1446

1445

1444

1443

1442

1441

1440

1439

1438

1437

1435

1434

1432

1430

1.18

1.29

1.37

1.45

1.6

1.72

1.81

1.92

1.98

2.06

2.12

2.31

2.47

2.51

2.6

2.77

2.85

3.18

3.25

3.33

3.49

3.61

3.7

3.79

4.01

4.11

4.2

4.28

4.44

4.72

4.8

4.92

5.01

5.17

5.28

5.41

5.49

5.6

0.25 1739 1.25

0.25 1735 1.33

0.25 1732 1.45

0.25 1729 1.58

0.25 1726 1.71

0.25 1724 1.82

0.24 1722 1.91

0.23 1719 1.99

0.22 1718 2.06

0.22 1717 2.19

0.21 1716 2.22

0.20 1714 2.43

0.20 1711 2.65

0.20 1709 2.81

0.25 1988 1.32

0.25 1986 1.41

0.25 1982 1.54

0.25 1980 1.66

0.25 1977 1.78

0.25 1974 1.94

0.24 1971 2.01

0.24 2240 1.38 229

0.24 2238 1.49 201

0.24 2234 1.59 173

0.24 2230 1.73 166

0.24 2229 1.88 154

0.24 2227 2.01 143

0.23 2493 1.41

0.24 2490 1.55

0.25 2488 1.62

0.25 2485 1.76

0.25 2483 1.89

0.25 2481 2.03

0.23

0.25

0.27

0.26

0.27

0.25

0.24

0.22

0.21

0.20

0.22

0.23

0.24

0.25

0.24

0.23

0.21

0.20

0.19

0.21

0.23

0.19

0.14

0.16

0.18

0.19

0.23 2226

2.1

142

0.24 2479

2.1

0.23 1970

2.1

0.22 2225 2.23 141

0.21 2223 2.34 141

0.21 2222 2.41 140

0.20 2220 2.62 138

0.20 2219 2.76 132

0.20 2217 2.91 126

0.19 2216 3.15 121

0.19 2215 3.42 109

0.19 2214 3.58

0.19 2212 3.73

0.20 2211 3.89

0.20 2210 3.97

0.20 2210 4.12

0.20 2209 4.26

0.20 2209 4.45

0.19 2208 4.62

0.20 2207 4.81

0.20 2206 4.93

0.19 2206 5.21

0.23 2478 2.23

0.22 2477 2.35

0.21 2476 2.42

0.21 2475 2.65

0.22 1969 2.24

0.21 1968 2.33

0.21 1968 2.51

0.21 1966 2.62

0.20 1964 2.83

0.20 1963 2.98

0.20 1962 3.16

0.20 1960 3.32

0.20 1957 3.51

0.20 1956 3.75

0.20 1956 3.93

0.20 1956 4.02

0.20 1955 4.21

5.7

5.4

5.1

5

0.2

2474 2.81

0.19 2473 2.91

0.19 2471 3.16

0.2

4.9

4.7

4.6

4.5

4.4

4.3

4.2

4.1

4

3.9

3.8

3.7

3.6

3.5

3.4

3.3

3

2.8

2.7

2.6

2.5

2.4

2.3

2.2

2.1

2

1.9

1.8

1.75

0.20 1708

3

2469 3.42

0.20 1706 3.12

0.20 1705 3.25

0.20 1703 3.47

0.20 1702 3.62

0.19 1702 3.77

0.19 1701 3.99

0.19 1700 4.16

0.19 1700 4.31

0.19 1699 4.47

0.19 1698 4.62

0.19 1697 4.78

0.19 1697 4.91

0.19 1696 5.05

0.19 1696 5.11

0.19 1695 5.26

0.18 1694 5.38

92

85

78

75

73

72

70

69

68

66

65

63

62

61

60

59

58

57

56

55

56

45

0.21 2468 3.66

0.22 2467 3.73

0.24 2466 3.89

0.24 2466 4.03

0.24 2466 4.17

0.24 2465 4.21

0.24 2465 4.33

0.23 2464 4.49

0.23 2464 4.66

0.22 2464 4.92

0.23 2463 5.15

0.22 2463 5.25

0.22 2462 5.41

0.22 2462 5.66

0.22 2461 5.82

0.21 2461 5.86

0.21 2460

0.21 2460 5.95

0.2

0.19 2458 6.23

0.18 2458 6.29

0.18 2457 6.35

0.20 1952

4.4

0.20 1952 4.62

0.20 1951 4.76

0.20 1950 4.92

0.20 1950 5.18

0.20 1949 5.34

0.20 2205

5.4

0.19 1949

5.5

0.20 2205 5.62

0.20 2204 5.78

0.21 2204 5.94

0.20 2203 6.03

0.19 2203 6.11

0.18 2203 6.24

0.18 2202 6.35

0.19 1948 5.61

0.19 1948 5.77

0.19 1947 5.81

0.19 1947 5.93

0.18 1946 6.05

0.18 1946 6.11

0.18 1945 6.23

0.18 1945 6.45

0.18 1944 6.66

0.18 1944 6.72

0.18 1943 7.97

0.17 1942 10.03

0.15 1941 11.52

0.13 1940 13.36

0.14 1939 15.06

0.13 1938 16.85

0.14 1937 28.35

0.16 1936 40.16

0.15 1935 66.25

0.14 1934 92.97

0.17 1934 125

0.21 1934 180.3

0.17 1933 244.5

0.17 1932

0.18 1693

5.5

5.9

0.18 1692 5.63

0.18 1692 5.78

0.18 1691 5.91

0.18 1691 6.04

0.17 1691 6.11

0.17 1690 6.23

0.17 1689 7.48

0.17 1687 8.75

0.15 1686 10.21

0.13 1684 11.43

0.13 1683 12.25

0.13 1682 14.43

0.13 1681 19.07

0.14 1680 26.51

0.15 1679 32.66

0.15 1678 43.51

0.13 1671 63.2

0.15 1677 122

0.14 1676 154

0.14 1670

64

63

60

51

48

45

40

38

25

11

8

5

3

2459 6.01

2459 6.12

0.18 2202

6.4

0.19 2201 6.52

0.17 2201 6.67

0.17 2200 6.71

0.19 2200 8.11

0.21 2199 10.42 37

0.18 2198 11.88 36

0.14 2196 13.72 37

0.13 2195 15.24 35

0.13 2195 16.65 32

0.15 2194 31.08 15

0.17 2194 45.46

0.17 2192 81.07

0.18 2192 123.19

0.18 2191

0.19 2191

0.16 2191

6.59

7.43

8.27

9.41

0.2

2456

8.1

0.22 2456 10.07

0.18 2455 11.02

0.14 2454 12.85

0.15 2454 13.66

0.14 2453 15.32

0.16 2452 29.91

0.18 2452 39.54

0.2

0.18

0.161

0.16

0.155

91

88

85

79

60

41

36

29

18

17

20

12

11

9

7

5

6.8 0.1

7.5 0.1

8.2 0.1

9.1 0.1

1429 10.05

1428 11.64

1427 13.39

1425

1424 20.09

1423 24.14

1417

1422 39.55

1421 38.93

1416

1415

1411 83.13

56

52

33

21

19

13

5

2

10.0 1ꢀ

11.0 1ꢀ

12.0 1ꢀ

13.0 1ꢀ

14.0 1ꢀ

15.0 1ꢀ

16.0 1ꢀ

17.0 1ꢀ

18.0 1ꢀ

19.0 1ꢀ

20.0 1ꢀ

22.0 1ꢀ

17.6

8

5

3

2451 61.28

2450 82.44

6

4

48.3

1

2

79.3

77.6

0.16 2191

0.16 2182

0.16 2181

0.16 2180

0.16 2178

0.14 1670

0.15 1675

0.15 1673

0.17 1932

0.16 1932

0.16 1930

1415

1415.3 78.8

79.6

78.5

4

0.15 1670.5

0.15 1927.5

* Other tolerances are available, see page 8

13

®

Accu-F / Accu-P

0603 Typical Electrical Tables

Capacitance

Self

Ref

Effective

Capacitance

Max/Min

(pF)

Max

ESR

(Ω)

Ref

Freq.

MHz

Effective

Capacitance

Max/Min

(pF)

Max

ESR

(Ω)

Ref

Freq.

MHz

Effective

Capacitance

Max/Min

(pF)

Max

ESR

(Ω)

Ref

Freq.

MHz

Effective

Capacitance

Max/Min

(pF)

Max

ESR

(Ω)

& Tolerance* Resonance Freq.

@ 1 MHz

(pF)

Frequency MHz

(GHz)

0.1 0.05

0.2 0.05

0.3 0.05

0.4 0.05

0.5 0.05

0.6 0.10

0.7 0.10

0.8 0.10

0.9 0.10

1.0 0.10

1.1 0.10

1.2 0.10

1.3 0.10

1.4 0.10

1.5 0.10

1.6 0.10

1.7 0.10

1.8 0.10

1.9 0.10

2.0 0.10

2.1 0.10

2.2 0.10

2.4 0.25

2.7 0.25

3.0 0.25

3.3 0.25

3.6 0.25

3.9 0.25

4.3 0.25

4.7 0.25

5.1 0.25

5.6 0.25

6.2 0.25

6.8 0.25

7.5 0.50

8.2 0.50

9.1 0.50

10 5ꢀ

18.0

12.7

10.4

9.0

N/A

491

490

487

486

485

484

483

482

479

478

477

475

474

471

468

465

459

456

455

451

448

445

443

439

435

432

429

425

422

420

418

416

414

412

410

408

404

403

402

401

400

N/A

738

736

734

732

731

729

727

725

723

721

720

718

717

713

709

706

699

697

695

692

689

686

684

680

677

675

672

670

667

665

663

661

660

659

657

656

654

653

652

651

650

N/A

987

985

981

974

977

976

973

971

969

967

966

964

962

958

954

951

945

942

940

937

935

931

929

927

925

921

919

917

916

914

913

912

911

910

908

906

905

904

N/A

1

8.1

N/A

7.4

N/A

6.8

N/A

6.4

N/A

6.0

N/A

5.7

5.4

5.2

5.0

4.8

4.7

4.5

4.4

4.2

4.1

4.0

3.9

3.8

3.7

3.5

3.3

3.1

3.0

2.9

2.7

2.6

2.5

2.4

2.3

2.2

2.1

2.0

1.9

1.8

1.7

1.6

1.5

1.4

1.3

1.2

1.1

1.0

245

244

243

242

241

240

239

238

237

236

234

232

230

226

224

223

220

218

216

214

211

208

205

202

200

195

191

189

187

185

182

179

176

170

168

165

163

160

1.15/0.90

1.25/1.00

1.35/1.10

1.45/1.15

1.55/1.25

1.65/1.35

1.75/1.45

1.85/1.55

2.10/1.70

2.15/1.78

2.11/1.80

2.25/1.95

2.40/2.05

2.70/2.15

3.00/2.45

3.40/2.75

3.60/3.05

3.90/3.30

4.20/3.65

4.60/4.00

5.00/4.45

5.40/4.85

5.90/5.35

6.50/5.95

7.20/6.55

8.10/7.00

8.80/7.70

9.80/8.60

10.70/9.50

11.60/10.90

12.90/11.40

13.10/12.90

14.90/13.25

15.90/14.25

17.00/15.15

19.50/17.00

24.00/20.90

26.00/22.80

29.00/25.60

32.00/28.50

37.65/31.35

.280

.270

.260

.250

.240

.230

.220

.210

.205

.200

.190

.175

.160

.150

.130

.128

.125

.122

.120

.115

.110

.105

.100

.095

.090

.085

.080

.070

.066

.065

.064

1.10/0.90

1.25/1.00

1.35/1.05

1.45/1.15

1.55/1.25

1.65/1.35

1.75/1.45

1.85/1.60

2.10/1.70

2.15/1.80

2.11/1.80

2.25/1.98

2.45/2.05

2.75/2.15

3.10/2.45

3.40/2.75

3.70/3.05

4.25/3.35

4.35/3.70

4.80/4.05

5.20/4.45

5.70/4.89

6.10/5.35

6.90/5.95

7.25/6.55

8.10/7.00

8.80/7.70

10.95/8.65

11.60/9.50

12.20/10.60

13.40/11.50

14.00/13.00

16.90/14.00

17.50/15.30

18.00/15.90

20.20/17.10

25.00/20.90

30.00/23.00

36.00/27.00

40.00/30.00

45.00/33.00

.220

.210

.200

.190

.180

.170

.160

.155

.150

.145

.140

.125

.120

.119

.115

.117

.110

.105

.100

.099

.098

.097

.095

.090

.085

.080

1.10/0.90

1.11/1.00

1.40/1.05

1.45/1.15

1.45/1.25

1.65/1.35

1.75/1.45

1.85/1.60

2.10/1.70

2.15/1.80

2.11/1.80

2.35/1.98

2.42/2.05

2.80/2.15

3.10/2.45

3.40/2.75

3.70/3.05

3.90/3.35

4.90/3.75

5.10/4.05

5.30/4.50

6.00/4.90

6.15/5.40

7.10/6.00

7.50/6.60

8.20/7.00

9.00/7.70

12.00/9.00

12.50/9.60

13.20/10.50

14.60/11.90

16.00/13.50

19.00/15.00

21.00/16.50

22.00/17.00

23.70/19.00

28.00/21.00

N/A

.220

.210

.200

.190

.180

.170

.167

.165

.162

.160

.150

.145

.140

.130

.125

.120

.115

.110

.100

.10

1.15/0.90

1.25/1.00

1.35/1.05

1.45/1.15

1.55/1.25

1.70/1.35

1.80/1.50

1.90/1.60

2.15/1.70

2.20/1.80

2.25/1.90

2.35/2.00

2.45/2.10

2.80/2.15

3.15/2.48

3.60/2.80

3.80/3.10

4.10/3.40

5.15/3.75

5.30/4.05

5.50/4.55

6.20/5.00

6.50/5.50

8.00/6.10

9.00/6.65

9.50/7.05

10.00/7.80

13.00/9.10

16.00/9.90

17.00/10.00

18.00/12.00

21.00/14.00

26.00/15.00

29.00/17.00

30.00/18.00

33.00/21.00

39.00/21.50

N/A

.300

.290

.280

.270

.260

.250

.240

.230

.220

.210

.200

.190

.170

.165

.160

.150

.145

.140

.135

.130

.125

.120

11 5ꢀ

12 5ꢀ

13 5ꢀ

14 5ꢀ

15 5ꢀ

16 5ꢀ

18 5ꢀ

22 5ꢀ

24 5ꢀ

.10

27 5ꢀ

N/A

.10

N/A

30 5ꢀ

N/A

.10

N/A

33 5ꢀ

N/A

.10

N/A

* Other tolerances are available, see page 8

14

®

Accu-F / Accu-P

0805 Typical Electrical Tables

Capacitance

Ref

Effective

Capacitance

Max/Min

(pF)

Max

ESR

(Ω)

Ref

Freq.

MHz

Effective

Capacitance

Max/Min

(pF)

Max

ESR

(Ω)

Ref

Freq.

MHz

Effective

Capacitance

Max/Min

(pF)

Max

ESR

(Ω)

Ref

Freq.

MHz

Effective

Capacitance

Max/Min

(pF)

Max

ESR

(Ω)

Self

& Tolerance* Resonance Freq.

@ 1 MHz

(pF)

Frequency MHz

(GHz)

0.1 0.05

0.2 0.05

0.3 0.05

0.4 0.05

0.5 0.05

0.6 0.10

0.7 0.10

0.8 0.10

0.9 0.10

1.0 0.10

1.1 0.10

1.2 0.10

1.3 0.10

1.4 0.10

1.5 0.10

1.6 0.10

1.7 0.10

1.8 0.10

1.9 0.10

2.0 0.10

2.1 0.10

2.2 0.10

2.4 0.25

2.7 0.25

3.0 0.25

3.3 0.25

3.6 0.25

3.9 0.25

4.3 0.25

4.7 0.25

5.1 0.25

5.6 0.25

6.2 0.25

6.8 0.25

7.5 0.05

8.2 0.05

9.1 0.05

10 5ꢀ

N/A

500

496

492

488

487

486

484

483

482

481

479

477

475

473

470

465

463

462

459

456

451

447

444

442

435

434

432

429

423

420

418

416

414

411

408

406

405

403

401

400

399

397

396

395

394

N/A

750

754

739

734

733

731

729

728

726

724

722

720

716

714

711

707

704

701

697

691

688

684

683

677

675

673

670

668

665

663

662

661

660

659

657

656

655

654

652

651

650

649

648

647

646

N/A

999

993

987

980

979

977

975

974

972

970

967

964

962

960

957

952

948

947

944

940

936

934

930

927

925

924

922

920

918

916

915

914

913

912

911

910

908

907

906

905

904

903

902

901

900

N/A

1

N/A

5.6

5.4

5.1

4.9

4.8

4.6

4.5

4.3

4.2

4.1

4.0

3.9

3.8

3.6

3.4

3.3

3.1

3.0

2.9

2.7

2.6

2.5

2.4

2.3

2.2

2.1

2.0

1.9

1.8

1.6

1.5

1.4

1.3

1.2

1.1

1.0

0.9

0.8

250

248

245

243

242

241

240

239

238

237

236

235

233

231

229

228

227

223

220

218

215

212

208

206

203

199

196

193

190

187

184

182

179

176

173

171

168

165

163

159

157

155

153

152

1.20/0.90

1.30/1.00

1.40/1.10

1.50/1.20

1.60/1.30

1.70/1.40

1.80/1.50

1.90/1.60

2.00/1.70

2.10/1.80

2.20/1.90

2.30/2.00

2.40/2.10

2.85/2.15

3.19/2.45

3.51/2.75

3.83/3.05

4.16/3.35

4.48/3.65

4.91/4.05

5.35/4.45

5.78/4.85

6.00/5.35

7.00/5.95

7.20/6.55

8.64/7.00

9.40/7.70

10.37/8.60

11.00/9.50

12.50/10.45

13.61/11.40

14.75/12.35

15.88/13.30

17.02/14.25

18.16/15.20

20.42/17.10

22.70/19.00

24.95/20.90

27.20/22.80

30.78/25.69

34.23/28.50

37.85/31.35

41.19/34.20

44.79/37.05

49.99/40.85

55.19/44.65

.320

.290

.270

.260

.240

.230

.220

.210

.200

.190

.180

.170

.160

.150

.140

.130

.120

.100

.090

.080

.070

.060

.050

1.20/0.90

1.30/1.00

1.40/1.10

1.50/1.20

1.60/1.20

1.70/1.40

1.85/1.50

1.95/1.60

2.05/1.70

2.15/1.80

2.30/1.90

2.40/2.00

2.60/2.10

3.13/2.29

3.47/2.55

3.76/2.86

4.04/3.10

4.35/3.42

4.67/3.72

5.11/4.13

5.52/4.53

5.94/4.94

6.82/5.40

7.52/6.00

8.21/6.88

9.02/7.10

9.83/7.90

10.88/8.76

11.92/9.76

13.23/10.50

14.50/11.90

15.80/13.00

17.22/14.00

18.56/15.19

19.90/16.28

22.69/18.57

25.38/20.78

28.08/21.00

31.31/25.61

36.10/32.20

40.58/33.20

46.65/35.00

52.22/38.00

59.08/47.08

70.50/53.04

81.99/59.00

.300

.270

.250

.230

.220

.210

.200

.190

.180

.170

.150

.140

.130

.120

.110

.100

.080

.070

.060

1.20/0.90

1.30/1.00

1.40/1.10

1.50/1.10

1.60/1.20

1.70/1.40

2.00/1.50

2.05/1.60

2.10/1.70

2.25/1.80

2.40/1.90

2.60/2.00

2.80/2.14

3.17/2.30

3.52/2.60

3.84/2.93

4.15/3.19

4.50/3.53

4.85/3.86

5.32/4.25

5.79/4.60

6.25/5.20

7.27/5.60

8.08/6.10

8.90/6.96

9.85/7.50

10.80/8.25

12.02/9.10

13.24/10.00

15.07/11.00

16.90/12.82

18.87/14.00

20.84/16.00

22.62/19.13

27.00/20.89

33.00/22.10

38.00/23.15

42.00/24.00

N/A

.270

.250

.240

.230

.220

.210

.200

.190

.170

.160

.150

.140

.120

.110

.100

.090

1.20/0.90

1.30/1.00

1.40/1.10

1.50/1.20

1.60/1.30

1.70/1.40

2.00/1.50

2.20/1.60

2.30/1.70

2.40/1.80

2.60/1.95

2.80/2.06

3.06/2.17

3.31/2.31

3.67/2.60

4.00/3.00

4.38/3.30

4.80/3.60

5.23/3.90

5.79/4.50

6.36/4.80

7.16/5.74

8.25/5.90

9.35/6.80

10.46/7.32

11.75/8.42

13.04/9.53

14.70/10.70

15.37/11.80

16.00/12.20

N/A

.300

.290

.280

.270

.260

.250

.240

.230

.220

.210

.200

.190

.180

.170

.160

.150

.140

.130

.120

.110

11 5ꢀ

12 5ꢀ

13 5ꢀ

N/A

14 5ꢀ

N/A

15 5ꢀ

N/A

16 5ꢀ

N/A

18 5ꢀ

N/A

20 5ꢀ

N/A

22 5ꢀ

N/A

24 5ꢀ

N/A

27 5ꢀ

N/A

30 5ꢀ

N/A

33 5ꢀ

N/A

36 5ꢀ

N/A

39 5ꢀ

N/A

43 5ꢀ

N/A

47 5ꢀ

N/A

* Other tolerances are available, see page 8

15

®

Accu-P

1210 Typical Electrical Tables

Capacitance

Self

Ref

Effective

Capacitance

Max/Min

(pF)

Max

ESR

(Ω)

Ref

Freq.

(MHz)

Effective

Capacitance

Max/Min

(pF)

Max

ESR

(Ω)

Ref

Freq.

(MHz)

Effective

Capacitance

Max/Min

(pF)

Max

ESR

(Ω)

Ref

Freq.

(MHz)

Effective

Capacitance

Max/Min

(pF)

Max

ESR

(Ω)

& Tolerance* Resonance Freq.

@ 1 MHz

(pF)

Frequency (MHz)

(GHz)

1.0 0.25

1.2 0.25

1.5 0.25

1.8 0.25

2.2 0.25

2.7 0.25

3.3 0.25

3.6 0.25

3.9 0.25

4.3 0.25

4.7 0.25

5.1 0.25

5.6 0.25

6.2 0.25

6.8 0.25

7.5 0.25

8.2 0.25

9.1 0.25

10 5ꢀ

4.98

4.55

4.07

9.71

9.96

2.70

2.60

2.50

2.40

2.30

2.20

2.10

2.00

1.90

1.80

1.70

1.60

1.50

1.40

1.30

1.20

1.10

1.00

0.98

0.96

0.92

0.91

0.88

0.85

0.84

0.82

0.80

0.77

0.73

0.70

247

245

242

240

237

233

229

228

227

223

220

218

215

212

208

206

203

199

196

193

190

185

183

182

180

176

173

171

168

166

164

163

162

161

159

158

157

155

153

152

1.23/0.75

1.32/0.95

.350

.310

.250

.200

.170

.140

.130

.120

.110

.100

.090

.080

.070

.060

495

491

486

482

476

466

463

462

458

456

451

447

441

442

435

434

432

429

423

420

418

416

415

414

411

408

406

405

403

402

401

400

399

398

397

396

395

1.34/0.86

1.45/1.00

.260

.240

.230

.200

.170

.140

.130

.120

.110

.100

.090

.080

.070

745

739

731

727

708

704

701

697

691

683

681

679

677

675

673

670

668

665

663

662

661

660

659

657

656

655

654

653

652

651

650

649

648

1.46/0.94

1.64/1.1

1.82/1.95

2.4/1.6

.280

.260

.250

.200

.180

.150

.140

.130

.120

.110

.100

.090

.080

.070

995

987

978

969

952

948

947

944

940

936

933

928

927

925

924

922

920

918

916

915

914

913

912

911

909

908

907

906

905

904

903

1.6/0.99

2.00/1.2

2.1/1.4

2.54/1.7

3.02/2.2

3.89/2.70

4.49/3.30

4.78/3.45

5.18/3.90

5.72/4.30

6.56/4.70

7.20/5.40

8.15/6.00

9.18/7.00

10.20/7.42

11.36/8.00

13.00/9.10

15.11/10.25

17.22/11.06

N/A

.350

.320

.270

.210

.200

.170

.160

.150

.140

.130

.120

.110

1.6/1.23

1.75/1.3

2.1/1.55

2.21/1.56

2.48/1.95

2.68/2.00

2.85/2.1

3.73/2.63

4.33/3.23

4.50/3.32

4.85/3.75

5.32/4.29

5.94/4.60

6.36/5.10

7.17/5.67

7.99/6.10

8.81/6.93

9.58/7.60

10.68/8.31

12.10/9.66

13.51/10.05

15.07/11.33

16.90/12.82

18.80/13.60

20.85/16.00

22.62/17.00

25.12/18.00

30.00/24.00

35.00/26.00

42.00/27.00

N/A

1

3.42/2.45

3.49/2.55

4.02/3.05

4.09/3.15

4.18/3.35

4.32/3.43

4.53/3.65

4.66/3.73

5.01/4.05

5.11/4.14

5.48/4.45

5.62/4.50

5.88/4.85

6.04/4.90

6.49/5.35

6.72/5.56

7.19/5.95

7.26/6.07

7.38/6.55

8.16/6.42

8.60/7.90

8.90/7.25

9.36/7.70

9.76/7.96

10.34/8.60

11.33/9.50

12.50/10.45

13.61/11.40

14.75/12.35

15.89/13.30

17.02/14.25

18.16/15.20

20.42/17.10

22.70/19.00

24.95/20.90

27.20/22.60

26.39/23.75

30.78/25.65

31.93/26.50

34.23/28.50

36.51/30.40

37.65/31.35

38.83/32.30

41.20/34.20

44.79/37.05

49.99/40.85

55.69/44.65

10.87/8.88

11.97/9.79

13.23/10.83

14.59/11.90

15.64/13.00

17.22/14.00

18.56/15.19

19.90/16.28

22.69/18.57

25.36/20.78

28.06/22.96

31.31/25.60

32.91/26.00

36.10/28.00

37.60/30.76

40.50/33.20

44.63/34.50

46.65/35.00

48.51/37.00

52.22/41.00

59.00/43.00

70.00/46.00

81.00/53.00

11 5ꢀ

12 5ꢀ

N/A

13 5ꢀ

N/A

14 5ꢀ

N/A

15 5ꢀ

N/A

16 5ꢀ

N/A

18 5ꢀ

N/A

20 5ꢀ

N/A

22 5ꢀ

N/A

24 5ꢀ

N/A

25 5ꢀ

N/A

27 5ꢀ

N/A

28 5ꢀ

N/A

30 5ꢀ

N/A

32 5ꢀ

N/A

33 5ꢀ

N/A

34 5ꢀ

N/A

36 5ꢀ

N/A

39 5ꢀ

N/A

43 5ꢀ

N/A

47 5ꢀ

N/A

* Other tolerances are available, see page 8

16

®

Accu-F / Accu-P

High Frequency Characteristics

Typical ESR vs. Frequency

®

Accu-P 0201

1±±±

9±±

8±±

7±±

0.8pF

1.8pF

6±±

5±±

1

4±±

3±±

2.2pF

3.3pF

2±±

1±±

4.7pF

6.8pF

±

5±±

1±±±

15±±

2±±±

25±±

3±±±

Frequency (MHzꢀ

Typical SRF vs. Capacitance

®

Accu-P 0201

8

7

6

5

4

3

2

1

±

3

4

5

6

7

8

9

1±

SRF (GHzꢀ

Typical Q vs. Frequency

®

Accu-P 0201

1±±±

±.8pF

Q

1±±

1.8pF

3.9pF

4.7pF

6.8pF

1±

5±±

1±±±

15±±

2±±±

25±±

3±±±

Frequency (MHzꢀ

17

®

Accu-F / Accu-P

High Frequency Characteristics

Typical ESR vs. Frequency

® ®

®

Accu-P 0402

Accu-F /Accu-P 0603

1

±.25

1.0pF

±.2

2.2pF

2.7pF

10pF

±.15

±.1

1

4.7pF

±.1

10pF

22pF

±.±5

±

5±±

1±±±

Frequency (MHzꢀ

Measured on Boonton 34A

15±±

2±±±

25±±

±.±1

±

±.5

Measured on Boonton 34-A

(34-A limits measurements to 3GHzꢀ

1

1.5

2

2.5

3GHz

Typical Q vs. Frequency

® ®

®

Accu-P 0402

Accu-F /Accu-P 0603

1±±±±

1±±±

1±±

1±

1±±±±

1±±±

1 pF

2.2 pF

4.7 pF

1±±

1±

10 pF

10pF

22pF

2.7pF

1

±

5±±

1±±±

15±±

2±±±

25±±

3±±±

±

±.5

Measured on Boonton 34-A

(34-A limits measurements to 3GHzꢀ

1

1.5

2

2.5

3GHz

Frequency (MHzꢀ

Typical Self Resonant Frequency vs. Capacitance

®

Accu-F /Accu-P 0603

Accu-P 0402

GHz

10

8

7

6

5

4

3

2

1

±

1

±

2

4

6

8

1±

12

0.1

CAPACITANCE (pFꢀ

1

10

100

pF

Measured on Wiltron 36± Vector Analyzer

L (self inductance)

0.78 nH

~

NOTE

L and SRF are obtained from the measured increase in

effective capacitance as the frequency is increased

Measured on the Boonton 34-A

18

®

Accu-F / Accu-P

High Frequency Characteristics

Typical ESR vs. Frequency

Accu-F /Accu-P 0805

Typical ESR vs. Frequency

®

Accu-P 1210

1

1pF

3.3pF

±.1

1

±.1

10pF

33pF

±.±1

±

±.5

Measured on Boonton 34-A

(34-A limits measurements to 3GHzꢀ

1

1.5

2

2.5

3GHz

±

±.5

Measured on Boonton 34-A

(34-A limits measurements to 3GHzꢀ

1

1.5

2

2.5

3GHz

Typical Q vs. Frequency

Accu-F /Accu-P 0805

Typical Q vs. Frequency

®

Accu-P 1210

1±±±±

1±±±

1±±±±

1±±±

1±±

1±

1±±

1±

1pF

3.3pF

2.5

10pF

33pF

±

±.5

1

1.5

2

3GHz

±

±.5

1

1.5

2

2.5

3GHz

Measured on Boonton 34-A

(34-A limits measurements to 3GHzꢀ

Measured on Boonton 34-A

(34-A limits measurements to 3GHzꢀ

Typical Self Resonant Frequency vs. Capacitance

®

Accu-P 1210

Accu-F /Accu-P 0805

GHz

10

GHz

10

1

0.1

1

10

100

pF

1

10

100

pF

L (self inductance)

1.02 nH

~

L (self inductance)

NOTE

0.82 nH

~

NOTE

L and SRF are obtained from the measured increase in

effective capacitance as the frequency is increased

Measured on the Boonton 34-A

19

®

Accu-F / Accu-P

Environmental / Mechanical Characteristics

ENVIRONMENTAL CHARACTERISTICS

TEST

CONDITIONS

REQUIREMENT

Life (Endurance)

MIL-STD-202F Method 108A

125°C, 2U_R,1000 hours

No visible damage

∆ C/C ≤ 2ꢀ for C≥5pF

∆ C ≤ 0.25pF for C<5pF

Accelerated Damp

85°C, 85ꢀ RH, U_R, 1000 hours

No visible damage

Heat Steady State

MIL-STD-202F Method 103B

∆ C/C ≤ 2ꢀ for C≥5pF

∆ C ≤ 0.25pF for C<5pF

1

Temperature Cycling

MIL-STD-202F Method 107E

MIL-STD-883D Method 1010.7

-55°C to +125°C, 15 cycles – Accu-P^®

-55°C to +125°C, 5 cycles – Accu-F^®

No visible damage

∆ C/C ≤ 2ꢀ for C≥5pF

∆ C ≤ 0.25pF for C<5pF

Resistance to Solder Heat

IEC-68-2-58

260°C 5°C for 10 secs

C remains within initial limits

MECHANICAL CHARACTERISTICS

TEST

CONDITIONS

REQUIREMENT

Solderability

IEC-68-2-58

Components completely immersed in a

solder bath at 235°C for 2 secs.

Terminations to be well tinned, minimum 95ꢀ

coverage

Leach Resistance

IEC-68-2-58

Components completely immersed in a

solder bath at 260 5°C for 60 secs.

Dissolution of termination faces ≤15ꢀ of area

Dissolution of termination edges ≤25ꢀ of length

Adhesion

A force of 5N applied for 10 secs.

No visible damage

MIL-STD-202F Method 211A

Termination Bond Strength

IEC-68-2-21 Amend. 2

Tested as shown in diagram

No visible damage

∆ C/C ≤ 2ꢀ for C≥5pF

∆ C ≤ 0.25pF for C<5pF

D

D = 3mm Accu-P

D = 1mm Accu-F

45mm

Robustness of Termination

IEC-68-2-21 Amend. 2

A force of 5N applied for 10 secs.

55Hz to 2000Hz, 20G

No visible damage

High Frequency Vibration

MIL-STD-202F Method 201A,

®

204D (Accu-P only)

Storage

12 months minimum with components

stored in “as received” packaging

Good solderability

Average capacitance with histogram printout for

capacitance distribution;

QUALITY & RELIABILITY

Accu-P is based on well established thin-film technology

and materials.

®

IR and Breakdown Voltage distribution;

Temperature Coefficient;

Solderability;

• ON-LINE PROCESS CONTROL

Dimensional, mechanical and temperature stability.

This program forms an integral part of the production cycle

and acts as a feedback system to regulate and control

production processes. The test procedures, which are

integrated into the production process, were developed

after long research work and are based on the highly

developed semiconductor industry test procedures and

equipment. These measures help AVX to produce a con-

sistent and high yield line of products.

QUALITY ASSURANCE

The reliability of these thin-film chip capacitors has been

studied intensively for several years. Various measures

have been taken to obtain the high reliability required today

by the industry. Quality assurance policy is based on well

established international industry standards. The reliability

of the capacitors is determined by accelerated testing

under the following conditions:

• FINAL QUALITY INSPECTION

Life (Endurance)

Accelerated Damp

Heat Steady State

125°C, 2U_R, 1000 hours

Finished parts are tested for standard electrical parameters

and visual/mechanical characteristics. Each production lot

is 100ꢀ evaluated for: capacitance and proof voltage at

2.5 U_R. In addition, production is periodically evaluated for:

85°C, 85ꢀ RH, U_R,

1000 hours.

2±

®

Accu-F / Accu-P

Performance Characteristics RF Power Applications

ESR and therefore RF heating. Values of ESR for

RF POWER APPLICATIONS

In RF power applications capacitor losses generate heat. Two

factors of particular importance to designers are:

®

Accu-P capacitors are significantly less than those of

ceramic MLC components currently available.

• Minimizing the generation of heat.

• Dissipating heat as efficiently as possible.

HEAT DISSIPATION

• Heat is dissipated from a capacitor through a variety of

paths, but the key factor in the removal of heat is the

thermal conductivity of the capacitor material.

• The higher the thermal conductivity of the capacitor, the

more rapidly heat will be dissipated.

CAPACITOR HEATING

1

• The major source of heat generation in a capacitor in RF

power applications is a function of RF current (I) and ESR,

from the relationship:

• The table below illustrates the importance of thermal

®

2

conductivity to the performance of Accu-P in power

Power dissipation = I _RMSx ESR

applications.

®

• Accu-P capacitors are specially designed to minimize

PRODUCT

MATERIAL

Alumina

Magnesium Titanate

THERMAL CONDUCTIVITY W/mK

®

Accu-P

Microwave MLC

18.9

6.0

Power Handling

®

Accu-P 10pF

Amps

8

6

4

Data used in calculating the graph:

Thermal impedance of capacitors:

0402

0603

0805

1210

17°C/W

12°C/W

6.5°C/W

5°C/W

121±

1210

±8±5

0805

±6±3

±4±2

Thermal impedance measured using RF generator,

amplifier and strip-line transformer.

2

0

ESR of capacitors measured on Boonton 34A

0

200 400 600 800 1000 1200 1400MHz

The thermal impedance expresses the temperature difference

in °C between chip center and termination caused by

a power dissipation of 1 watt in the chip. It is expressed in

°C/W.

THERMAL IMPEDANCE

Thermal impedance of Accu-P chips is shown below com-

pared with the thermal impedance of Microwave MLC’s.

®

CAPACITOR TYPE

Accu-P^®

CHIP SIZE

THERMAL IMPEDANCE (°C/W)

0805

1210

6.5

5

Microwave MLC

0505

1210

12

7.5

ADVANTAGES OF ACCU-P^®

IN RF POWER CIRCUITS

The optimized design of Accu-P offers the designer of RF

power circuits the following advantages:

PRACTICAL APPLICATION

IN RF POWER CIRCUITS

®

• There is a wide variety of different experimental methods

for measuring the power handling performance of a

capacitor in RF power circuits. Each method has its

own problems and few of them exactly reproduce the

conditions present in “real” circuit applications.

• Similarly, there is a very wide range of different circuit appli-

cations, all with their unique characteristics and operating

conditions which cannot possibly be covered by such

“theoretical” testing.

• Reduced power losses due to the inherently low ESR of

®

Accu-P .

• Increased power dissipation due to the high thermal

®

conductivity of Accu-P .

• THE ONLY TRUE TEST OF A CAPACITOR IN ANY PARTICULAR

APPLICATION IS ITS PERFORMANCE UNDER OPERATING

CONDITIONS IN THE ACTUAL CIRCUIT.

21

®

Accu-F / Accu-P

Application Notes

GENERAL

HANDLING

®

Accu-F and Accu-P SMD capacitors are designed for

soldering to printed circuit boards or other substrates. The

construction of the components is such that they will with-

stand the time/temperature profiles used in both wave and

reflow soldering methods.

SMD capacitors should be handled with care to avoid damage

or contamination from perspiration and skin oils. The use of

plastic tipped tweezers or vacuum pick-ups is strongly recom-

mended for individual components. Bulk handling should

ensure that abrasion and mechanical shock are minimized. For

automatic equipment, taped and reeled product gives the

ideal medium for direct presentation to the placement

machine.

1

CIRCUIT BOARD TYPE

COMPONENT PAD DESIGN

®

The circuit board types which may be used with Accu-F and

Component pads must be designed to achieve good

joints and minimize component movement during reflow

soldering. Pad designs are given below for both wave and

reflow soldering.

®

Accu-P are as follows:

®

Accu-F : All flexible types of circuit boards

(eg. FR-4, G-10).

®

The basis of these designs is:

Accu-P : All flexible types of circuit boards

(eg. FR-4, G-10) and also alumina.

a. Pad width equal to component width. It is permissible to

decrease this to as low as 85ꢀ of component width but

it is not advisable to go below this.

For other circuit board materials, please consult factory.

b. Pad overlap 0.5mm beneath large components. Pad

overlap about 0.3mm beneath small components.

c. Pad extension of 0.5mm for reflow of large components

and pad extension about 0.3mm for reflow of small com-

ponents. Pad extension about 1.0mm for wave soldering.

WAVE SOLDERING

DIMENSIONS: millimeters (inches)

1.5

(±.±59ꢀ

1.5

(±.±59ꢀ

5.±

(±.197ꢀ

±.8

(±.±31ꢀ

±.26

1.2

(±.±47ꢀ

1.25

(±.±49ꢀ

4.±

(±.157ꢀ

(±.±1±ꢀ

2.±

(±.±79ꢀ

±.4±

1.±

(±.±39ꢀ

(±.±16ꢀ

2.1

(±.±83ꢀ

±.5

(±.±2±ꢀ

1.±6

(±.±42ꢀ

3.1

(±.122ꢀ

3.1

(±.122ꢀ

±.6

(±.±24ꢀ

±.7

(±.±28ꢀ

±.4±

(±.±16ꢀ

±.8

(±.±31ꢀ

±.34

(±.±13ꢀ

1.5

(±.±59ꢀ

1.25

(±.±49ꢀ

1.2

(±.±47ꢀ

1.5

(±.±59ꢀ

±.55

(±.±22ꢀ

1.25

(±.±49ꢀ

±.8

(±.±31ꢀ

±.8

(±.±31ꢀ

2.5

(±.±98ꢀ

0603

0805

1210

Accu-P^®

0201

Accu-P^®

0402

Accu-P^®

0603

Accu-F^®

Accu-P^®

Accu-F^®

Accu-P^®

REFLOW SOLDERING

DIMENSIONS: millimeters (inches)

1.±

(±.±39ꢀ

1.±

4.±

(±.157ꢀ

±.26

(±.±1±ꢀ

±.8

±.85

(±.±39ꢀ

(±.±31ꢀ

(±.±33ꢀ

±.26

(±.±1±ꢀ

±.6

2.±

(±.±79ꢀ

3.±

(±.±24ꢀ

2.3

(±.±91ꢀ

2.3

(±.±91ꢀ

±.6

(±.±24ꢀ

(±.118ꢀ

±.7

(±.±28ꢀ

1.7

1.±

(±.±39ꢀ

±.78

(±.±3±ꢀ

±.5

(±.±68ꢀ

(±.±2±ꢀ

±.85

(±.±33ꢀ

±.8

(±.±31ꢀ

±.6

(±.±24ꢀ

±.34

(±.±13ꢀ

±.26

(±.±1±ꢀ

1.±

(±.±39ꢀ

1.±

(±.±39ꢀ

±.8

(±.±31ꢀ

±.8

(±.±31ꢀ

±.55

(±.±22ꢀ

1.25

(±.±49ꢀ

2.5

(±.±98ꢀ

0603

0805

1210

Accu-P^®

0201

Accu-P^®

0402

Accu-P^®

0603

Accu-P^®

Accu-F^®

Accu-P^®

Accu-F^®

22

®

Accu-F / Accu-P

Application Notes

PREHEAT & SOLDERING

CLEANING RECOMMENDATIONS

The rate of preheat in production should not exceed 4°C/

second and a recommended maximum is about 2°C/second.

Temperature differential from preheat to soldering should not

exceed 100°C.

For further specific application or process advice, please consult

AVX.

Care should be taken to ensure that the devices are

thoroughly cleaned of flux residues, especially the space

beneath the device. Such residues may otherwise become

conductive and effectively offer a lossy bypass to the device.

Various recommended cleaning conditions (which must be

optimized for the flux system being used) are as follows:

Cleaning liquids. . . . . . . i-propanol, ethanol, acetylacetone,

water and other standard PCB

1

COOLING

cleaning liquids.

After soldering, the assembly should preferably be allowed

to cool naturally. In the event of assisted cooling, similar

conditions to those recommended for preheating should be

used.

Ultrasonic conditions . . power-20w/liter max.

frequency-20kHz to 45kHz.

Temperature . . . . . . . . . 80°C maximum (if not otherwise

limited by chosen solvent system).

Time . . . . . . . . . . . . . . . 5 minutes max.

HAND SOLDERING & REWORK

Hand soldering is permissible. Preheat of the PCB to 150°C is

required. The most preferable technique is to use hot air sol-

dering tools. Where a soldering iron is used, a temperature

controlled model not exceeding 30 watts should be used and

set to not more than 260°C.

STORAGE CONDITIONS

®

Recommended storage conditions for Accu-F and

®

Accu-P prior to use are as follows:

Temperature . . . . . . . . . . 15°C to 35°C

Humidity . . . . . . . . . . . . . ≤65ꢀ

Air Pressure . . . . . . . . . . 860mbar to 1060mbar

RECOMMENDED SOLDERING

PROFILE

IR REFLOW

WAVE SOLDERING

3–5 seconds

22±

26±

24±

22±

2±±

18±

16±

14±

12±

1±±

8±

6±

4±

Assembly exits heat–

21±

2±±

19±

18±

17±

16±

15±

14±

13±

12±

11±

1±±

9±

no forced cooldown

1±±°C

Additional soak time

to allow uniform

heating of the

substrate

Natural

Cooling

186°C solder melting

temperature

Assembly enters the

preheat zone

45-6± sec.

above solder

melting point

Enter Wave

Time (secondsꢀ

Soak time

2±

8±

1ꢀ Activates the flux

2ꢀ Allows center of board

temperatures to catch up with

corners

7±

±

1±

2±

3±

4±

5±

6±

7±

8±

9± 1±± 11± 12±

6±

5±

4±

3±

2±

±

±.5

1

1.5

2

2.5

3

3.5

4

4.5

Time (minsꢀ

VAPOR PHASE

Transfer from

preheat with

min. delay &

temp. loss

Preheat

Reflow

215°C

2±±

18±

16±

14±

12±

1±±

8±

2±±

18±

16±

14±

12±

1±±

8±

Duration varies

Natural

Cooling

with thermal mass

of assembly

1±–6± secs typical

Enter

Vapor

6±

4±

2±

±

10

20

30

40

50

60

70

Time (minutesꢀ

Time (secondsꢀ

23

®

Accu-F /Accu-P

Automatic Insertion Packaging

TAPE & REEL

All tape and reel specifications are in compliance with EIA 481-1-A.

(equivalent to IEC 286 part 3).

• 8mm carrier

• Reeled quantities: Reels of 3,000 per 7" reel or 10,000 pieces per 13" reel

0201 and 0402 = 5,000 pieces per 7" reel and 20,000 pieces per 13" reel

1

REEL

DIMENSIONS: millimeters (inches)

(1)

A

B

C

D

E

F

G

180 1.0

(7.087 0.039)

1.5 min.

(0.059 min.)

13 0.2

(0.512 0.008)

20.2 min.

(0.795 min.)

50 min.

(1.969 min.)

9.6 1.5

(0.370 0.050)

14.4 max.

(0.567 max.)

Metric dimensions will govern.

Inch measurements rounded and for reference only.

(1ꢀ 33±mm (13 inchꢀ reels are available.

G MAX.

B*

C

A

E

F

D*

FULL RADIUS

*DRIVE SPOKES OPTIONAL

IF USED, ASTERISKED

DIMENSIONS APPLY.

CARRIER

DIMENSIONS: millimeters (inches)

A

B

C

D

E

F

+±.1

8.0 0.3

(0.315 0.012)

3.5 0.05

(0.138 0.002)

1.75 0.1

(0.069 0.004)

2.0 0.05

(0.079 0.002)

4.0 0.1

(0.157 0.004)

1.5_-±.±

(0.059_-±.±±±)

+±.±±4

NOTE: The nominal dimensions of the component compartment (W,Lꢀ are derived from the component size.

1± PITCHES

CUMULATIVE

E

TOLERANCE ON

TAPE ±.2

D

F

C

TOP

TAPE

W

B

A

L

P = 4mm except 0201 and 0402 where P = 2mm

P

CENTER LINES

OF CAVITY

DIRECTION OF FEED

NOTE: AVX reserves the right to change the information published herein without notice.

24

2

Thin-Film Technology

®

Accu-L L±6±3/L±8±5

Thin-Film RF/Microwave Inductors

25

®

Accu-L

SMD High-Q RF Inductor

2

1± nH Inductor (Top Viewꢀ

ACCU-L^®TECHNOLOGY

The Accu-L SMD Inductor is based on thin-film multilayer

technology. This technology provides a level of control on the

electrical and physical characteristics of the component which

gives consistent characteristics within a lot and lot-to-lot.

®

The Accu-L inductor is particularly suited for the telecom-

munications industry where there is a continuing trend

towards miniaturization and increasing frequencies. The

Accu-L inductor meets both the performance and tolerance

®

requirements of present cellular frequencies 450MHz and

900MHz and of future frequencies, such as 1700MHz,

1900MHz and 2400MHz.

The original design provides small size, excellent high-

frequency performance and rugged construction for reliable

automatic assembly.

FEATURES

APPLICATIONS

• High Q

• Mobile Communications

• Satellite TV Receivers

• GPS

• RF Power Capability

• High SRF

• Low DC Resistance

• Ultra-Tight Tolerance on Inductance

• Standard 0603 and 0805 Chip Size

• Low Profile

• Vehicle Locations Systems

• Filters

• Matching Networks

• Rugged Construction

• Taped and Reeled

26

®

Accu-L 0603 and 0805

SMD High-Q RF Inductor

Operating/Storage

Temp. Range:

-55°C to +125°C

DIMENSIONS: millimeters (inches)

0603

0805

B

1.6±±.1±

2.11±±.1±

L

(±.±63±±.±±4ꢀ

±.81±±.1±

(±.±32±±.±±4ꢀ

(±.±83±±.±±4ꢀ

1.5±±.1±

(±.±59±±.±±4ꢀ

W

±.61±±.1±

(±.±24±±.±±4ꢀ

±.91±±.13

(±.±36±±.±±5ꢀ

T

top: ±.± +±.3/-±.±

(±.±+±.±12ꢀ

±.25±±.15

(±.±1±±±.±±6ꢀ

L

B

bottom:

±.35±±.2±

(±.±14±±.±±8ꢀ

HOW TO ORDER

L

0805

4R7

D

E

W

TR

Product

Inductor

Size

0603

0805

Termination

Code

Packaging

Code

TR = Tape and Reel

(3,000/reel)

Inductance

Expressed in nH

(2 significant digits +

number of zeros)

for

values <10nH,

letter R denotes

decimal point.

Example:

Tolerance

Specification

Code

2

for

®

L ≤ 4.7nH, L ≥ 10nH,

W = Nickel/

solder coated

E = Accu-L 0805

B = 0.1nH

C = 0.2nH

D = 0.5nH

G = 2ꢀ

J = 5ꢀ

technology

(Sn 63, Pb 37)

®

G = Accu-L 0603

technology

4.7nH<L<10nH,

C = 0.2nH

D = 0.5nH

22nH = 220

4.7nH = 4R7

ELECTRICAL SPECIFICATIONS TABLE FOR ACCU-L^®0603

DC

450 MHz

900 MHz

1900 MHz

2400 MHz

I

max

Test Frequency

(mA)

DC

SRF min

(MHz)

R

max

Inductance

L (nH)

Q

Available

(Ω)

L (nH)

Typical

Inductance Tolerance

(1)

1000

750

500

300

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

10.0

12.0

15.0

49

26

20

21

24

25

23

26

23

28

1.2

70

39

30

35

57

32

36

33

31

39

38

1.2

134

1.2

170

76

59

56

54

64

69

49

60

39

31

41

20

15

10000

9000

8400

6500

5500

5000

4500

3800

3500

3000

2500

0.04

0.06

0.07

0.08

0.12

0.15

0.25

0.30

0.35

0.45

0.50

0.60

0.1, 0.2nH

0.1, 0.2, 0.5nH

0.2, 0.5nH

2ꢀ, 5ꢀ

1.54

1.74

2.2

2.7

3.33

3.9

4.68

5.65

6.9

8.4

10

1.52

1.73

2.24

2.75

3.39

4.06

4.92

5.94

7.3

63

50

49

48

56

60

46

54

47

35

47

30

1.52

1.72

2.24

2.79

3.47

4.21

5.2

6.23

8.1

12.1

10

11.8

14.1

25.9

14.1

17.2

49.8

2ꢀ, 5ꢀ

13.2

16.2

Inductance and Q measured on Agilent 4291B / 4287 using the 16196A test fixture.

(1ꢀ

I

measured for 15°C rise at 25°C ambient temperature when soldered to FR-4 board.

DC

ELECTRICAL SPECIFICATIONS TABLE FOR ACCU-L^®0805

DC

450 MHz

900 MHz

1700 MHz

2400 MHz

I

max

Test Frequency

Test Frequency Test Frequency Test Frequency

(mA)

DC

SRF min

(MHz)

R max

Inductance

L (nH)

Q

∆T = 15°C ∆T = 70°C

Available

(Ω)

L (nH)

Typical

Inductance Tolerance

(1)

(2)

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

10

60

50

42

38

27

43

50

43

46

40

36

30

36

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.8

5.7

92

74

72

62

46

36

62

68

62

56

60

50

46

27

33

1.2

1.5

1.8

2.2

2.8

3.4

4.0

5.3

6.3

7.7

10.0

13.4

17.3

27

122

102

88

82

80

48

38

76

73

71

55

52

40

23

–

1.2

1.5

1.9

2.3

2.9

3.5

4.1

5.8

7.6

9.4

15.2

–

92

84

73

72

70

57

42

60

62

50

32

–

10000

5500

4600

4500

3500

2500

0.05

0.06

0.07

0.08

0.11

0.20

0.10

0.11

0.12

0.13

0.20

0.35

0.40

1000

750

500

2000

1500

1000

0.1nH, 0.2nH, 0.5nH

0.5nH

2ꢀ, 5ꢀ

7.0

8.5

10.6

12.9

16.7

21.9

27.5

12

15

18

22

–

2400

2200

1700

1400

–

(1ꢀ I_DCmeasured for 15°C rise at 25°C ambient temperature

(2ꢀ I_DCmeasured for 7±°C rise at 25°C ambient temperature

L, Q, SRF measured on HP 4291A, Boonton 34A and Wiltron 36±

Vector Analyzer, R_DCmeasured on Keithley 58± micro-ohmmeter.

27

®

Accu-L 0603 and 0805

SMD High-Q RF Inductor

L0603

Typical Q vs. Frequency

Typical Inductance vs. Frequency

L0603

18±

16±

14±

12±

1±±

1±

1

1.2nH

15nH

Q

1±±

8±

6±

8.2nH

6.8nH

1.5nH

5.6nH

4.7nH

3.3nH

2.2nH

4±

8.2nH

15nH

2±

1.8nH

±

1.2nH

±

1

2

3

±

±.5

1

1.5

2

2.5

3

Frequency (GHzꢀ

2

Measured on AGILENT 4291B/4287

using the 16196A test fixture

Measured on AGILENT 4291B/4287

using the 16196A test fixture

L0805

Typical Inductance vs. Frequency

L0805

Typical Q vs. Frequency

L0805

140

100

10

1

120

1.2nH

100

1.5nH

22nH

80

1.8nH

15nH

10nH

5.6nH

60

5.6nH

1.8nH

10nH

40

15nH

20

22nH

0.01

0.1

1

10

0

0.1

1

10

Frequency (GHz)

Measured on HP4291A and

Boonton 34A Coaxial Line

Measured on HP4291A and

Wiltron 36± Vector Analyzer

Maximum Temperature Rise

at 25°C ambient temperature (on FR-4)

L0805

200

15nH

10nH 6.8nH 4.7nH

2.7nH

100

10

1

0

0.5

1

1.5

2

2.5

3

3.5

Current (A)

Temperature rise will typically be no higher than shown by the graph

28

®

Accu-L 0603 and 0805

SMD High-Q RF Inductor

FINAL QUALITY INSPECTION

Finished parts are tested for electrical parameters and visual/

mechanical characteristics.

Parts are 100ꢀ tested for inductance at 450MHz. Parts are

100ꢀ tested for R_DC. Each production lot is evaluated on a

sample basis for:

• Q at test frequency

• Static Humidity Resistance: 85°C, 85ꢀ RH, 160 hours

• Endurance: 125°C, I_R, 4 hours

2

ENVIRONMENTAL CHARACTERISTICS

TEST

Solderability

CONDITIONS

REQUIREMENT

Terminations to be well tinned.

No visible damage.

Components completely immersed in

a solder bath at 235 5°C for 2 secs.

Leach Resistance

Components completely immersed in

Dissolution of termination faces

a solder bath at 260 5°C for 60 secs. ≤ 15ꢀ of area.

Dissolution of termination edges

≤ 25ꢀ of length.

Storage

Shear

12 months minimum with components Good solderability

stored in “as received” packaging.

Components mounted to a substrate.

A force of 5N applied normal to the

line joining the terminations and in

a line parallel to the substrate.

No visible damage

Rapid Change of

Temperature

Components mounted to a substrate.

5 cycles -55°C to +125°C.

Tested as shown in diagram

No visible damage

Bend Strength

1mm

deflection

45mm

Temperature

Coefficient of

Inductance

(TCL)

Component placed in

environmental chamber

-55°C to +125°C.

+0 to +125 ppm/°C

• 10⁶

L₂-L₁

L₁(T₂-T₁)

TCL =

(typical)

T₁= 25°C

29

®

Accu-L 0805

Application Notes

HANDLING

PREHEAT & SOLDERING

SMD chips should be handled with care to avoid damage or

contamination from perspiration and skin oils. The use of

plastic tipped tweezers or vacuum pick-ups is strongly

recommended for individual components. Bulk handling

should ensure that abrasion and mechanical shock are min-

imized. For automatic equipment, taped and reeled product

is the ideal medium for direct presentation to the placement

machine.

The rate of preheat in production should not exceed

4°C/second. It is recommended not to exceed 2°C/

second.

Temperature differential from preheat to soldering should not

exceed 150°C.

For further specific application or process advice, please

consult AVX.

HAND SOLDERING & REWORK

CIRCUIT BOARD TYPE

Hand soldering is permissible. Preheat of the PCB to 100°C

is required. The most preferable technique is to use hot air

soldering tools. Where a soldering iron is used, a tempera-

ture controlled model not exceeding 30 watts should be

used and set to not more than 260°C. Maximum allowed

time at temperature is 1 minute. When hand soldering, the

base side (white side) must be soldered to the board.

All flexible types of circuit boards may be used (e.g. FR-4,

G-10) and also alumina.

2

For other circuit board materials, please consult factory.

COMPONENT PAD DESIGN

Component pads must be designed to achieve good joints

and minimize component movement during soldering.

COOLING

Pad designs are given below for both wave and reflow

soldering.

After soldering, the assembly should preferably be allowed to

cool naturally. In the event of assisted cooling, similar condi-

tions to those recommended for preheating should be used.

The basis of these designs is:

a. Pad width equal to component width. It is permissible

to decrease this to as low as 85ꢀ of component width

but it is not advisable to go below this.

CLEANING RECOMMENDATIONS

b. Pad overlap about 0.3mm.

Care should be taken to ensure that the devices are thor-

oughly cleaned of flux residues, especially the space beneath

the device. Such residues may otherwise become conduc-

tive and effectively offer a lossy bypass to the device. Various

recommended cleaning conditions (which must be optimized

for the flux system being used) are as follows:

c. Pad extension about 0.3mm for reflow.

Pad extension about 0.8mm for wave soldering.

WAVE SOLDERING

DIMENSIONS: millimeters (inches)

Cleaning liquids . . . . . . i-propanol, ethanol, acetylace-

tone, water, and other standard

PCB cleaning liquids.

1.3±

1.2

(±.±51ꢀ

(±.±47ꢀ

Ultrasonic conditions . . power – 20w/liter max.

frequency – 20kHz to 45kHz.

3.1

(±.122ꢀ

±.5±

(±.±2±ꢀ

1.4

3.8

Temperature. . . . . . . . . 80°C maximum (if not otherwise

limited by chosen solvent system).

(±.±55ꢀ

(±.15±ꢀ

1.3±

(±.±51ꢀ

Time. . . . . . . . . . . . . . . 5 minutes max.

1.2

0603

Accu-L

0805

Accu-L

(±.±47ꢀ

±.8

(±.±31ꢀ

®

1.5

(±.±59ꢀ

STORAGE CONDITIONS

®

Recommended storage conditions for Accu-L prior to use

are as follows:

REFLOW SOLDERING

DIMENSIONS: millimeters (inches)

Temperature. . . . . . . . . 15°C to 35°C

Humidity . . . . . . . . . . . ≤65ꢀ

Air Pressure . . . . . . . . . 860mbar to 1060mbar

±.7

±.9±

(±.±28ꢀ

(±.±35ꢀ

2.3

(±.±91ꢀ

±.5±

(±.±2±ꢀ

2.8

1.4

(±.11±ꢀ (±.±55ꢀ

±.9±

(±.±35ꢀ

0603

Accu-L

0805

Accu-L

RECOMMENDED SOLDERING

PROFILE

±.7

(±.±28ꢀ

®

±.8

(±.±31ꢀ

1.5

(±.±59ꢀ

For recommended soldering profile see page 23

3±

Thin-Film Technology

3

CP±4±2/CP±6±3/CP±8±5

and DB±8±5 3dB 9±°

Thin-Film RF/Microwave

Directional Couplers

31

Thin-Film Directional Couplers

CP0402 High Directivity LGA Termination

GENERAL DESCRIPTION

DIMENSIONS:

(Bottom View)

millimeters (inches)

ITF (Integrated Thin-Film) TECHNOLOGY

S

B

The ITF High Directivity LGA Coupler is based on thin-film multilayer

technology. The technology provides a miniature part with excellent high

frequency performance and rugged construction for reliable automatic

assembly.

A

The ITF Coupler is offered in a variety of frequency bands compatible

with various types of high frequency wireless systems.

L

APPLICATIONS

FEATURES

T

• Mobile Communications

• Satellite TV Receivers

• GPS

• Inherent Low Profile

• Self Alignment during Reflow

• Excellent Solderability

• Low Parasitics

W

• Vehicle Location Systems

• Wireless LAN’s

1.±±±±.±5

(±.±4±±±.±±2ꢀ

±.58±±.±4

(±.±23±±.±±2ꢀ

±.35±±.±5

(±.±14±±.±±2ꢀ

±.2±±±.±5

(±.±±8±±.±±2ꢀ

±.18±±.±5

(±.±±7±±.±±2ꢀ

±.±5±±.±5

(±.±±2±±.±±2ꢀ

• Better Heat Dissipation

L

A

B

S

3

• Operating/Storage Temp

-40°C to +85°C

W

• Power Rating 3W RF Cont

T

HOW TO ORDER

CP

0402

X

L

TR

****

Frequency

Style

Size

0402

Type

Sub Type

LGA

Packaging Code

Termination

L = LGA Sn90, Pb10

N = LGA Sn100

TR = Tape and Reel

(MHz)

Directional Coupler

QUALITY INSPECTION

TERMINALS (Top View)

Finished parts are 100ꢀ tested for electrical parameters and

visual characteristics. Each production lot is evaluated on a

sample basis for:

5± OHM

OUT

• Static Humidity: 85°C, 85ꢀ RH, 160 hours

• Endurance: 125°C, I_R, 4 hours

TERMINATION

Sn90Pb10 or Lead-Free Sn100 Nickel/Solder coating

compatible with automatic soldering technologies: reflow,

wave soldering, vapor phase and manual.

COUPLING

IN

Recommended Pad Layout Dimensions

mm (inches)

ORIENTATION IN TAPE

0.63

(0.025)

5±

OUT

IN

OUT

IN

OHM

0.25

(0.010)

CP

0.39

(0.015)

1.18

(0.046)

*The recommended distance to the PCB Ground Plane is ±.254mm (±.±1±"ꢀ

32

Thin-Film Directional Couplers

CP0402 High Directivity LGA Termination

COUPLER TYPE SELECTION GRAPH

Coupling vs. Frequency

0

CP0402A

AL

BL

CL

DL

EL

FL

****

-5

-10

-15

-20

-25

3

-30

-35

-40

0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Frequency (GHz)

Intermediate coupling factors are readily available.

Please contact factory.

33

Thin-Film Directional Couplers

CP0402 High Directivity LGA Termination

Coupler P/N CP0402AxxxxAL

CP0402AxxxxALTR

±

Frequency Coupling I. Loss Return Directivity

I. Loss

P/N

Examples

Application

Band

[dB]

max. Loss

[dB]

-4.±

-8.±

-12

-16

-1±.±

-2±.±

[MHz]

[dB]

32

CP±4±2A±836AL 824 - 849

CP±4±2A±881AL 869 - 894

CP±4±2A±9±2AL 89± - 915

CP±4±2A±947AL 935 - 96±

CP±4±2A±897AL 88± - 915

CP±4±2A±942AL 925 - 96±

CP±4±2A1441AL 1429 - 1453 14.5±

CP±4±2A1747AL 171± - 1785 13.±±

CP±4±2A1842AL 18±5 - 188± 12.5±

CP±4±2A188±AL 185± - 191± 12.3±

CP±4±2A196±AL 193± - 199± 12.±±

19.1±

18.6±

18.5±

18.±±

18.5±

18.±±

Coupling

AMPS

GSM

R. Loss

±.25

±.4±

31

-3±.±

-4±.±

E-GSM

PDC

Isolation

28

26

21

PCN

-2±

-24

-5±.±

-6±.±

PCS

±.5±

±.7±

25

23

±.8

1.6

2.4

3.2

4.±

PHP

DECT

CP±4±2A19±7AL 1895 - 192±

CP±4±2A189±AL 188± - 19±±

12.3±

Frequency (GHzꢀ

Wireless LAN CP±4±2A2442AL 24±± - 2484 1±.3±

3

Coupler P/N CP0402AxxxxBL

CP0402AxxxxBLTR

±

-1±.±

-2±.±

Frequency Coupling I. Loss Return Directivity

I. Loss

P/N

Examples

Application

Band

[MHz]

[dB]

max. Loss

[dB]

-2.±

-4.±

-6.±

-8.±

[dB]

CP±4±2A±836BL 824 - 849

CP±4±2A±881BL 869 - 894

CP±4±2A±9±2BL 89± - 915

CP±4±2A±947BL 935 - 96±

CP±4±2A±897BL 88± - 915

CP±4±2A±942BL 925 - 96±

22.±±

21.7±

21.5±

21.±±

21.5±

21.±±

AMPS

GSM

Coupling

R. Loss

±.2±

28

±.25

±.2±

27

28

27

24

-3±.±

-4±.±

E-GSM

PDC

±.25

±.3±

CP±4±2A1441BL 1429 - 1453 17.5±

CP±4±2A1747BL 171± - 1785 16.±±

27

Isolation

PCN

CP±4±2A1842BL 18±5 - 188±

CP±4±2A188±BL 185± - 191±

-1±.±

-12.±

-5±.±

-6±.±

23

15.5±

PCS

CP±4±2A196±BL 193± - 199± 15.±±

±.35

±.4±

22

23

21

±.8

1.6

2.4

3.2

4.±

PHP

DECT

CP±4±2A19±7BL 1895 - 192±

CP±4±2A189±BL 188± - 19±±

15.5±

Frequency (GHzꢀ

Wireless LAN CP±4±2A2442BL 24±± - 2484 13.3±

Coupler P/N CP0402AxxxxCL

CP0402AxxxxCLTR

±

-1±.±

-2±.±

Frequency Coupling I. Loss Return Directivity

I. Loss

P/N

Examples

Application

Band

[dB]

max. Loss

[dB]

-2.±

-4.±

-6.±

-8.±

[MHz]

[dB]

Coupling

R. Loss

CP±4±2A±836CL 824 - 849

CP±4±2A±881CL 869 - 894

CP±4±2A±9±2CL 89± - 915

CP±4±2A±947CL 935 - 96±

CP±4±2A±897CL 88± - 915

CP±4±2A±942CL 925 - 96±

23.6±

23.±±

AMPS

GSM

33

26

33

25

32

31

±.2±

22.5±

23.±±

22.5±

22

-3±.±

-4±.±

E-GSM

PDC

CP±4±2A1441CL 1429 - 1453 19.±±

CP±4±2A1747CL 171± - 1785 17.2±

CP±4±2A1842CL 18±5 - 188± 17.±±

CP±4±2A188±CL 185± - 191± 16.8±

CP±4±2A196±CL 193± - 199± 16.5±

Isolation

PCN

-1±.±

-12.±

-5±.±

-6±.±

3±

±.25

±.45

3±

PCS

29

±.8

1.6

2.4

3.2

4.±

PHP

DECT

CP±4±2A19±7CL 1895 - 192±

CP±4±2A189±CL 188± - 19±±

16.8±

Frequency (GHzꢀ

3±

28

Wireless LAN CP±4±2A2442CL 24±± - 2484 14.7±

Important: Couplers can be used at any frequency within the indicated range.

34

Thin-Film Directional Couplers

CP0402 High Directivity LGA Termination

Coupler P/N CP0402AxxxxDL

CP0402AxxxxDLTR

I. Loss

±

Frequency Coupling I. Loss Return Directivity

P/N

Examples

Application

Band

[dB]

max. Loss

[dB]

-2.±

-4.±

-6.±

-8.±

-1±.±

-2±.±

[MHz]

[dB]

29

Coupling

R. Loss

CP±4±2A±836DL 824 - 849

CP±4±2A±881DL 869 - 894

CP±4±2A±9±2DL 89± - 915

CP±4±2A±947DL 935 - 96±

CP±4±2A±897DL 88± - 915

CP±4±2A±942DL 925 - 96±

25.2±

24.8±

24.7±

24.1±

24.7±

24.1±

AMPS

GSM

28

2±

-3±.±

-4±.±

±.2±

E-GSM

PDC

CP±4±2A1441DL 1429 - 1453 2±.5±

CP±4±2A1747DL 171± - 1785 19.±±

CP±4±2A1842DL 18±5 - 188± 18.5±

CP±4±2A188±DL 185± - 191± 18.2±

CP±4±2A196±DL 193± - 199± 18.±±

CP±4±2A19±7DL 1895 - 192± 18.1±

CP±4±2A189±DL 188± - 19±± 18.2±

25

24

Isolation

PCN

-1±.±

-12.±

-5±.±

-6±.±

PCS

±.25

±.35

23

22

23

±.8

1.6

2.4

3.2

4.±

PHP

DECT

Frequency (GHzꢀ

Wireless LAN CP±4±2A2442DL 24±± - 2484 16.±±

3

Coupler P/N CP0402AxxxxEL

CP0402AxxxxELTR

I. Loss

±

-1±.±

-2±.±

Frequency Coupling I. Loss Return Directivity

P/N

Examples

Application

Band

[dB]

max. Loss

[dB]

-2.±

-4.±

-6.±

-8.±

[MHz]

[dB]

35

Coupling

R. Loss

CP±4±2A±836EL 824 - 849

CP±4±2A±881EL 869 - 894

CP±4±2A±9±2EL 89± - 915

CP±4±2A±947EL 935 - 96±

CP±4±2A±897EL 88± - 915

CP±4±2A±942EL 925 - 96±

27.2±

26.8±

26.5±

26.±±

26.5±

26.±±

AMPS

GSM

±.2±

34

25

-3±.±

-4±.±

E-GSM

PDC

CP±4±2A1441EL 1429 - 1453 22.3±

CP±4±2A1747EL 171± - 1785 2±.5±

CP±4±2A1842EL 18±5 - 188± 2±.3±

CP±4±2A188±EL 185± - 191±

29

27

Isolation

PCN

-1±.±

-12.±

-5±.±

-6±.±

±.25

±.35

PCS

CP±4±2A196±EL 193± - 199±

CP±4±2A19±7EL 1895 - 192±

26

23

2±.±±

±.8

1.6

2.4

3.2

4.±

4.8

5.6

6.4

PHP

DECT

Frequency (GHzꢀ

CP±4±2A189±EL 188± - 19±±

Wireless LAN CP±4±2A2442EL 24±± - 2484 18.±±

Coupler P/N CP0402AxxxxFL

CP0402AxxxxFLTR

±

-1±.±

-2±.±

Frequency Coupling I. Loss Return Directivity

I. Loss

P/N

Examples

Application

Band

[dB]

max. Loss

[dB]

-1.±

-2.±

-3.±

-4.±

[MHz]

[dB]

29.1±

28.6±

28.5±

28.1±

28.5±

28.1±

CP±4±2A±836FL

CP±4±2A±881FL

CP±4±2A±9±2FL

CP±4±2A±947FL

CP±4±2A±897FL

CP±4±2A±942FL

CP±4±2A1441FL 1429 - 1453 26.5±

CP±4±2A1747FL 171± - 1785 25.±±

CP±4±2A1842FL 18±5 - 188± 24.5±

CP±4±2A188±FL 185± - 191± 24.2±

CP±4±2A196±FL 193± - 199± 24.±±

824 - 849

869 - 894

89± - 915

935 - 96±

88± - 915

925 - 96±

31.±±

3±.7±

3±.6±

3±.±±

3±.6±

3±.±±

Coupling

R. Loss

AMPS

GSM

-3±.±

-4±.±

E-GSM

PDC

±.2± 25.±±

23.8±

11

Isolation

PCN

23.6±

23.5±

23.3±

23.4±

-5±.±

-6±.±

-5.±

-6.±

PCS

±.8

1.6

2.4

3.2

4.±

4.8

5.6

6.4

PHP

CP±4±2A19±7FL 1895 - 192±

CP±4±2A189±FL 188± - 19±±

24.2±

DECT

23.5±

Frequency (GHzꢀ

Wireless LAN CP±4±2A2442FL 24±± - 2484 22.±±

±.25 22.6±

Important: Couplers can be used at any frequency within the indicated range.

35

Thin-Film Directional Couplers

CP0603 High Directivity LGA Termination

GENERAL DESCRIPTION

ITF (Integrated Thin-Film) TECHNOLOGY

DIMENSIONS:

(Bottom View)

millimeters (inches)

S

The ITF LGA Coupler is based on thin-film multilayer technology.

The technology provides a miniature part with excellent high frequency

performance and rugged construction for reliable automatic assembly.

B

A

The ITF Coupler is offered in a variety of frequency bands compatible

with various types of high frequency wireless systems.

FEATURES

APPLICATIONS

L

• Inherent Low Profile

• Self Alignment during Reflow

• Excellent Solderability

• Low Parasitics

• Mobile Communications

• Satellite TV Receivers

• GPS

T

• Vehicle Location Systems

• Wireless LAN’s

W

• Better Heat Dissipation

1.6±±±.1±

(±.±63±±.±±4ꢀ

±.84±±.1±

(±.±33±±.±±4ꢀ

±.25±±.±5

A

• Operating/Storage Temp

-40°C to +85°C

L

(±.±1±±±.±±2ꢀ

3

±.2±±±.±5

W

B

• Power Rating 3W RF Cont

(±.±±8±±.±±2ꢀ

±.6±±±.1±

(±.±24±±.±±4ꢀ

±.±5±±.±5

(±.±±2±±.±±2ꢀ

T

S

HOW TO ORDER

CP

0603

X

L

TR

X

****

Frequency

Type

Style

Size

Sub Type

Termination

Code

Packaging Code

0603

TR = Tape and Reel

(MHz)

Directional Coupler

L = LGA Sn90, Pb10

N = LGA Sn100

QUALITY INSPECTION

TERMINALS (Top View)

Finished parts are 100ꢀ tested for electrical parameters and

visual characteristics. Each production lot is evaluated on a

sample basis for:

50 OHM

OUT

• Static Humidity: 85°C, 85ꢀ RH, 160 hours

• Endurance: 125°C, I_R, 4 hours

TERMINATION

Sn90Pb10 or Lead-Free Sn100 Nickel/Solder coating

compatible with automatic soldering technologies: reflow,

wave soldering, vapor phase and manual.

COUPLING

IN

Recommended Pad Layout Dimensions

mm (inches)

ORIENTATION IN TAPE

1.1±

5±

OUT

IN

OUT

IN

(±.±43ꢀ

OHM

±.4±

(±.±16ꢀ

CP

±.5±

(±.±2±ꢀ

1.75 (±.±69ꢀ

*The recommended distance to the PCB Ground Plane is ±.254mm (±.±1±"ꢀ

36

Thin-Film Directional Couplers

CP0603 High Directivity LGA Termination

COUPLER TYPE SELECTION GRAPH

Coupling vs. Frequency

0

-5

-10

-15

-20

3

CP0603A

CL

HL

AL

DL

BL

ML

EL

FL

****

-25

-30

-35

-40

GL

0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Frequency (GHz)

Intermediate coupling factors are readily available.

Please contact factory.

37

Thin-Film Directional Couplers

CP0603 High Directivity LGA Type

Coupler P/N CP0603AxxxxAL

CP0603AxxxxALTR

±0

I. Loss

Frequency Coupling I. Loss Return Directivity

P/N

Examples

Application

Band

[MHz]

[dB]

max. Loss

[dB]

--11±0..±0

--22±0..±0

--44

[dB]

Coupling

CP±6±3A±836AL 824 - 849

CP±6±3A±881AL 869 - 894

CP±6±3A±9±2AL 89± - 915

CP±6±3A±947AL 935 - 96±

CP±6±3A±897AL 88± - 915

CP±6±3A±942AL 925 - 96±

CP±6±3A1441AL 1429 - 1453

CP±6±3A1747AL 171± - 1785

CP±6±3A1842AL 18±5 - 188±

CP±6±3A188±AL 185± - 191±

CP±6±3A196±AL 193± - 199±

CP±6±3A19±7AL 1895 - 192±

CP±6±3A189±AL 188± - 19±±

2±.±

19.7

19.4

19.±

19.4

19.±

15.5

14.±

13.5

13.2

13.±

--88

AMPS

GSM

28

R. Loss

27

--1122

--1166

--33±0..±0

--44±0..±0

±.25

28

27

24

Isolation

E-GSM

PDC

±.4±

±.5±

22

--55±0..±0

--66±0..±0

--22±0

--2244

PCN

22

PCS

±.55

±.5±

±.75

21

22

2±

±0..88

11..66

22..44

33..22

44..±0

PHP

DECT

FFrreeqquueennccyy ((GGHHzzꢀ)

13.2

11.5

Wireless LAN CP±6±3A2442AL 24±± - 2484

3

Coupler P/N CP0603AxxxxBL

CP0603AxxxxBLTR

0

-10.0

-20.0

Frequency Coupling I. Loss Return Directivity

I. Loss

P/N

Examples

Application

Band

[dB]

max. Loss

[dB]

-4

[MHz]

[dB]

Coupling

R. Loss

CP±6±3A±836BL 824 - 849

CP±6±3A±881BL 869 - 894

CP±6±3A±9±2BL 89± - 915

CP±6±3A±947BL 935 - 96±

CP±6±3A±897BL 88± - 915

CP±6±3A±942BL 925 - 96±

CP±6±3A1441BL 1429 - 1453

CP±6±3A1747BL 171± - 1785

CP±6±3A1842BL 18±5 - 188±

CP±6±3A188±BL 185± - 191±

CP±6±3A196±BL 193± - 199±

CP±6±3A19±7BL 1895 - 192±

CP±6±3A189±BL 188± - 19±±

23.±

22.7

22.5

22.±

22.5

22.±

18.5

17.±

16.4

16.2

16.±

16.1

16.2

14.2

AMPS

GSM

-8

31

±.2±

29

3±

31

3±

27

-12

-16

-30.0

-40.0

Isolation

E-GSM

PDC

PCN

-50.0

-60.0

-20

-24

25

±.25

±.35

PCS

24

25

23

24

0.8

1.6

2.4

3.2

4.0

PHP

DECT

Frequency (GHz)

Wireless LAN CP±6±3A2442BL 24±± - 2484

Coupler P/N CP0603AxxxxCL

CP0603AxxxxCLTR

±

-1±.±

-2±.±

I. Loss

Frequency Coupling I. Loss Return Directivity

P/N

Examples

Application

Band

[dB]

max. Loss

[dB]

-4.±

-8.±

-12.±

-16.±

[MHz]

[dB]

Coupling

R. Loss

CP±6±3A±836CL 824 - 849

CP±6±3A±881CL 869 - 894

CP±6±3A±9±2CL 89± - 915

CP±6±3A±947CL 935 - 96±

CP±6±3A±897CL 88± - 915

CP±6±3A±942CL 925 - 96±

CP±6±3A1441CL 1429 - 1453

CP±6±3A1747CL 171± - 1785

CP±6±3A1842CL 18±5 - 188±

CP±6±3A188±CL 185± - 191±

CP±6±3A196±CL 193± - 199±

CP±6±3A19±7CL 1895 - 192±

CP±6±3A189±CL 188± - 19±±

15.2

15.±

14.7

14.3

14.7

14.3

11.±

9.5

AMPS

GSM

±.35

23

-3±.±

-4±.±

±.4±

±.35

±.4±

±.7±

±.8±

22

23

22

19

18

23

Isolation

E-GSM

PDC

-5±.±

-6±.±

-2±.±

-24.±

PCN

9.±

8.8

8.5

±.9±

1.±±

±.9±

1.4±

PCS

17

15

21

±.8

1.6

2.4

3.2

4.±

PHP

DECT

Frequency (GHzꢀ

8.8

7.±

Wireless LAN CP±6±3A2442CL 24±± - 2484

Important: Couplers can be used at any frequency within the indicated range.

38

Thin-Film Directional Couplers

CP0603 High Directivity LGA Type

Coupler P/N CP0603AxxxxDL

CP0603AxxxxDLTR

±

Frequency Coupling I. Loss Return Directivity

I. Loss

P/N

Examples

Application

Band

[MHz]

[dB]

max. Loss

[dB]

-1±.±

-2±.±

-1.±

-2.±

-3.±

-4.±

[dB]

Coupling

R. Loss

CP±6±3A±836DL 824 - 849

CP±6±3A±881DL 869 - 894

CP±6±3A±9±2DL 89± - 915

CP±6±3A±947DL 935 - 96±

CP±6±3A±897DL 88± - 915

CP±6±3A±942DL 925 - 96±

CP±6±3A1441DL 1429 - 1453

CP±6±3A1747DL 171± - 1785

CP±6±3A1842DL 18±5 - 188±

CP±6±3A188±DL 185± - 191±

CP±6±3A196±DL 193± - 199±

CP±6±3A19±7DL 1895 - 192±

CP±6±3A189±DL 188± - 19±±

22.±

21.8

21.3

21.±

21.3

21.±

17.7

16.±

15.4

15.2

15.±

31

AMPS

GSM

±.25

±.3±

±.25

±.3±

3±

-3±.±

-4±.±

E-GSM

PDC

Isolation

27

25

PCN

-5±.±

-6±.±

-5.±

-6.±

±.4±

±.55

PCS

25

±.8

1.6

2.4

3.2

4.±

24

22

PHP

DECT

15.2

13.3

Frequency (GHzꢀ

Wireless LAN CP±6±3A2442DL 24±± - 2484

3

Coupler P/N CP0603AxxxxEL

CP0603AxxxxELTR

I. Loss

±

-1±.±

-2±.±

Frequency Coupling I. Loss Return Directivity

P/N

Examples

Application

Band

[dB]

max. Loss

[dB]

-4.±

-8.±

-12.±

-16.±

[MHz]

[dB]

Coupling

R. Loss

CP±6±3A±836EL 824 - 849

CP±6±3A±881EL 869 - 894

CP±6±3A±9±2EL 89± - 915

CP±6±3A±947EL 935 - 96±

CP±6±3A±897EL 88± - 915

CP±6±3A±942EL 925 - 96±

CP±6±3A1441EL 1429 - 1453

CP±6±3A1747EL 171± - 1785

CP±6±3A1842EL 18±5 - 188±

CP±6±3A188±EL 185± - 191±

CP±6±3A196±EL 193± - 199±

CP±6±3A19±7EL 1895 - 192±

CP±6±3A189±EL 188± - 19±±

25.8

25.3

25.±

24.7

26.±

24.7

22.±

19.5

19.±

18.8

18.5

18.7

18.8

17.±

AMPS

GSM

32

-3±.±

-4±.±

±.2±

±.25

31

32

31

28

Isolation

E-GSM

PDC

21

-5±.±

-6±.±

-2±.±

-24.±

PCN

PCS

±.3±

±.4±

26

24

±.8

1.6

2.4

3.2

4.±

4.8

5.6

6.4

Frequency (GHzꢀ

PHP

DECT

Wireless LAN CP±6±3A2442EL 24±± - 2484

Coupler P/N CP0603AxxxxFL

CP0603AxxxxFLTR

±

-1±.±

-2±.±

I. Loss

Frequency Coupling I. Loss Return Directivity

P/N

Examples

Application

Band

[dB]

max. Loss

[dB]

-4.±

-8.±

-12.±

-16.±

[MHz]

[dB]

Coupling

CP±6±3A±836FL

CP±6±3A±881FL

CP±6±3A±9±2FL

CP±6±3A±947FL

CP±6±3A±897FL

CP±6±3A±942FL

CP±6±3A1441FL 1429 - 1453

CP±6±3A1747FL 171± - 1785

CP±6±3A1842FL 18±5 - 188±

CP±6±3A188±FL 185± - 191±

CP±6±3A196±FL 193± - 199±

CP±6±3A19±7FL 1895 - 192±

CP±6±3A189±FL 188± - 19±±

824 - 849

869 - 894

89± - 915

935 - 96±

88± - 915

925 - 96±

31.2

3±.8

3±.5

3±.2

3±.5

3±.2

27.±

25.±

26.5

24.3

24.±

AMPS

GSM

38

R. Loss

±.2±

-3±.±

-4±.±

37

Isolation

E-GSM

PDC

33

31

12

-5±.±

-6±.±

-2±.±

-24.±

PCN

PCS

±.25

±.8

1.6

2.4

3.2

4.±

4.8

5.6

6.4

3±

31

3±

Frequency (GHzꢀ

PHP

DECT

24.2

21.5

Wireless LAN CP±6±3A2442FL 24±± - 2484

Important: Couplers can be used at any frequency within the indicated range.

39

Thin-Film Directional Couplers

CP0603 High Directivity LGA Type

Coupler P/N CP0603AxxxxGL

CP0603AxxxxGLTR

±

Frequency Coupling I. Loss Return Directivity

I. Loss

P/N

Examples

Application

Band

[dB]

max. Loss

[dB]

-1±.±

-2±.±

-4.±

-8.±

-12.±

-16.±

[MHz]

[dB]

CP±6±3A±836GL 824 - 849

CP±6±3A±881GL 869 - 894

CP±6±3A±9±2GL 89± - 915

CP±6±3A±947GL 935 - 96±

CP±6±3A±897GL 88± - 915

CP±6±3A±942GL 925 - 96±

CP±6±3A1441GL 1429 - 1453

CP±6±3A1747GL 171± - 1785

CP±6±3A1842GL 18±5 - 188±

CP±6±3A188±GL 185± - 191±

CP±6±3A196±GL 193± - 199±

CP±6±3A19±7GL 1895 - 192±

CP±6±3A189±GL 188± - 19±±

34.2

33.8

33.6

33.2

33.6

33.2

3±.±

28.5

28.±

27.7

27.5

27.6

27.7

25.5

AMPS

GSM

39

Coupling

±.2±

38

39

38

34

-3±.±

-4±.±

R. Loss

E-GSM

PDC

13

Isolation

PCN

-5±.±

-6±.±

-2±.±

-24.±

32

PCS

±.25

31

32

31

±.8

1.6

2.4

3.2

4.±

4.8

5.6

6.4

PHP

DECT

Frequency (GHzꢀ

Wireless LAN CP±6±3A2442GL 24±± - 2484

3

Coupler P/N CP0603AxxxxHL

CP0603AxxxxHLTR

±

-1±.±

-2±.±

Frequency Coupling I. Loss Return Directivity

I. Loss

P/N

Examples

Application

Band

[dB]

max. Loss

[dB]

-4.±

-8.±

-12.±

-16.±

[MHz]

[dB]

26

CP±6±3A±836HL 824 - 849

CP±6±3A±881HL 869 - 894

CP±6±3A±9±2HL 89± - 915

CP±6±3A±947HL 935 - 96±

CP±6±3A±897HL 88± - 915

CP±6±3A±942HL 925 - 96±

CP±6±3A1441HL 1429 - 1453

CP±6±3A1747HL 171± - 1785

CP±6±3A1842HL 18±5 - 188±

CP±6±3A188±HL 185± - 191±

CP±6±3A196±HL 193± - 199±

CP±6±3A19±7HL 1895 - 192±

CP±6±3A189±HL 188± - 19±±

17.3

17.±

16.7

16.3

17.±

16.3

13.±

11.4

11.±

1±.8

1±.5

1±.7

1±.8

8.8

AMPS

GSM

Coupling

R. Loss

±.3±

25

26

-3±.±

-4±.±

±.35

±.55

E-GSM

PDC

Isolation

22

2±

PCN

-5±.±

-6±.±

-2±.±

-24.±

PCS

24

±.75

1.±±

19

17

PHP

DECT

±.8

1.6

2.4

3.2

4.±

Frequency (GHzꢀ

Wireless LAN CP±6±3A2442HL 24±± - 2484

Coupler P/N CP0603AxxxxML

CP0603AxxxxMLTR

±

-1±.±

-2±.±

Frequency Coupling I. Loss Return Directivity

I. Loss

P/N

Examples

Application

Band

[dB]

max. Loss

[dB]

-4.±

-8.±

-12.±

-16.±

[MHz]

[dB]

33

CP±6±3A±836ML 824 - 849

CP±6±3A±881ML 869 - 894

CP±6±3A±9±2ML 89± - 915

CP±6±3A±947ML 935 - 96±

CP±6±3A±897ML 88± - 915

CP±6±3A±942ML 925 - 96±

CP±6±3A1441ML 1429 - 1453

CP±6±3A1747ML 171± - 1785

CP±6±3A1842ML 18±5 - 188±

CP±6±3A188±ML 185± - 191±

CP±6±3A196±ML 193± - 199±

CP±6±3A19±7ML 1895 - 192±

CP±6±3A189±ML 188± - 19±±

24.2

23.8

23.4

23.2

23.4

23.2

2±.±

18.4

18.±

17.8

17.5

17.7

17.8

15.6

AMPS

GSM

Coupling

R. Loss

±.2±

32

23

-3±.±

-4±.±

E-GSM

PDC

Isolation

28

27

PCN

-5±.±

-6±.±

-2±.±

-24.±

±.25

±.35

PCS

2±

26

24

PHP

DECT

±.8

1.6

2.4

3.2

4.±

Frequency (GHzꢀ

Wireless LAN CP±6±3A2442ML 24±± - 2484

Important: Couplers can be used at any frequency within the indicated range.

4±

Thin-Film Directional Couplers

CP0402 / CP0603 High Directivity Couplers Test Jigs

GENERAL DESCRIPTION

These jigs are designed for testing the CP0402 and CP0603

High Directivity Couplers using a Vector Network Analyzer.

The connectors are SMA type (female), ‘Johnson Components

Inc.’ Product P/N: 142-0701-841.

They consist of a dielectric substrate, having 50Ω microstrips

as conducting lines and a bottom ground plane located at a

distance of 0.254mm (0.010") from the microstrips.

Both a measurement jig and a calibration jig are provided.

The calibration jig is designed for a full 2-port calibration, and

consists of an open line, short line and through line. LOAD

calibration can be done by a 50Ω SMA termination.

The substrate used is Neltec’s NH9338ST0254C1BC.

MEASUREMENT PROCEDURE

When measuring a component, it can be either soldered or

pressed using a non-metallic stick until all four ports touch

the appropriate pads. Set the VNA to the relevant frequency

band. Connect the VNA using a 10dB attenuator on the jig

terminal connected to port 2. Follow the VNA’s instruction

manual and use the calibration jig to perform a full 2-Port

calibration in the required bandwidths.

Place the coupler on the measurement jig as follows:

3

Input (Coupler) ➜ Connector 1 (Jig)

Output (Coupler) ➜ Connector 2 (Jig)

Termination (Coupler) ➜ Connector 3 (Jig)

Coupling (Coupler) ➜ Connector 4 (Jig)

To measure I. Loss connect:

Connector 1 (Jig) ➜ Port 1 (VNA) Connector 3 (Jig) ➜ 50Ω

Connector 2 (Jig) ➜ Port 2 (VNA) Connector 4 (Jig) ➜ 50Ω

To measure R. Loss and Coupling connect:

Connector 1 (Jig) ➜ Port 1 (VNA) Connector 3 (Jig) ➜ 50Ω

Connector 2 (Jig) ➜ 50Ω

Connector 4 (Jig) ➜ Port 2 (VNA)

To measure Isolation connect:

Connector 1 (Jig) ➜ 50Ω

Connector 3 (Jig) ➜ 50Ω

Connector 2 (Jig) ➜ Port 1 (VNA) Connector 4 (Jig) ➜ Port 2 (VNA)

Measurement Jig

Calibration Jig

Short Line

to GND.

Connector 1

Connector

Johnson

P/N 142-±7±1-841

Connector 2

OPEN

TH

Load &

Open

Line

Connector 4

Through

Load &

Through

Connector 3

41

Thin-Film Directional Couplers

CP0603 SMD Type

GENERAL DESCRIPTION

ITF (Integrated Thin-Film) TECHNOLOGY

DIMENSIONS:

millimeters (inches)

B

W

The ITF SMD Coupler is based on thin-film multilayer technology.

The technology provides a miniature part with excellent high frequency

performance and rugged construction for reliable automatic assembly.

L

T

The ITF Coupler is offered in a variety of frequency bands compatible with

various types of high frequency wireless systems.

B1

A

Top View

Bottom View

FEATURES

APPLICATIONS

0603

1.6±±.1

(±.±63±±.±±4ꢀ

±.84±±.1

(±.±33±±.±±4ꢀ

±.6±±±.1

(±.±28±±.±±4ꢀ

±.35±±.15

(±.±14±±.±±6ꢀ

• Miniature Size: 0603

• Mobile Communications

• Satellite TV Receivers

• GPS

L

W

T

• Frequency Range: 800MHz - 3GHz

• Characteristic Impedance: 50Ω

• Operating / Storage Temp.: -40ºC to +85ºC

• Power Rating: 3W Continuous

• Low Profile

• Vehicle Location Systems

• Wireless LAN’s

A

• Rugged Construction

3

B

±.175±±.1

(±.±±7±±.±±4ꢀ

• Taped and Reeled

B1

±.±±+±.1/±-±.±

(±.±±+±.±±4/-±.±ꢀ

HOW TO ORDER

CP

0603

X

W

TR

X

****

Frequency

Type

Style

Size

0603

Sub Type

Termination

Code

Packaging Code

TR = Tape and Reel

MHz

Directional Coupler

W = Sn90, Pb10

S = Sn100

QUALITY INSPECTION

TERMINALS (Top View)

Finished parts are 100ꢀ tested for electrical parameters and

visual characteristics. Each production lot is evaluated on a

sample basis for:

OUT

50 OHM

• Static Humidity: 85°C, 85ꢀ RH, 160 hours

• Endurance: 125°C, I_R, 4 hours

TERMINATION

Nickel/Solder coating compatible with automatic soldering

technologies: reflow, wave soldering, vapor phase and

manual.

IN

COUPLING

Recommended Pad Layout Dimensions

mm (inches)

1.85

(±.±73ꢀ

±.45

(±.±18ꢀ

Orientation in tape

±.28

(±.±11ꢀ

1.±8

(±.±43ꢀ

42

Thin-Film Directional Couplers

CP0603 SMD Type

Coupler P/N CP0603A

AW

P/N CP0603A AW

****

0

-10

-20

-30

-40

0

P/N

Examples

Frequency

Band [MHz]

824 - 849

869 - 894

89± - 915

935 - 96±

88± - 915

925 - 96±

Coupling I. Loss VSWR

I. Loss

Application

AMPS

[dB]

18.5±1

18±1

17.5±1

18±1

17.5±1

14±1

12.5±1

12±1

max

-2

-4

-6

-8

CP±6±3A±836AW

CP±6±3A±881AW

CP±6±3A±9±2AW

CP±6±3A±947AW

CP±6±3A±897AW

CP±6±3A±942AW

Coupling

Isolation

±.25

GSM

Return Loss

E-GSM

PDC

CP±6±3A1441AW 1429 - 1453

CP±6±3A1747AW 171± - 1785

CP±6±3A1842AW 18±5 - 188±

CP±6±3A188±AW 185± - 191±

CP±6±3A196±AW 193± - 199±

CP±6±3A19±7AW 1895 - 192±

CP±6±3A189±AW 188± - 19±±

±.4

±.6

-50

-60

-10

-12

1.2

PCN

12±1

11.5±1

12±1

PCS

0.5

1.0

1.5

2.0

Frequency (GHz)

2.5

3.0

3.5

±.65

±.6

PHP

DECT

12±1

Wireless LAN CP±6±3A2442AW 24±± - 2484

1±±1

±.85

Coupler P/N CP0603A

BW

CP0603A BW

****

0

P/N

Examples

Frequency

Band [MHz]

824 - 849

869 - 894

89± - 915

935 - 96±

88± - 915

925 - 96±

Coupling I. Loss VSWR

I. Loss

Application

AMPS

[dB]

16±1

15.5±1

15±1

15.5±1

15±1

11.5±1

1±±1

9.5±1

9±1

max

-2

-4

-6

-8

-10

-20

-30

-40

-50

-60

Coupling

CP±6±3A±836BW

CP±6±3A±881BW

CP±6±3A±9±2BW

CP±6±3A±947BW

CP±6±3A±897BW

CP±6±3A±942BW

Return Loss

Isolation

±.25

1.2

GSM

3

E-GSM

PDC

CP±6±3A1441BW 1429 - 1453

CP±6±3A1747BW 171± - 1785

CP±6±3A1842BW 18±5 - 188±

CP±6±3A188±BW 185± - 191±

CP±6±3A196±BW 193± - 199±

CP±6±3A19±7BW 1895 - 192±

CP±6±3A189±BW 188± - 19±±

±.55

1.3

1.4

-10

-12

PCN

PCS

0.5

1.0

1.5

2.0

2.5

3.0

9±1

7.5±1

±.8

1.1

PHP

DECT

Frequency (GHz)

Wireless LAN CP±6±3A2442BW 24±± - 2484

Coupler P/N CP0603A

CW

CP0603A CW

****

0

P/N

Examples

Frequency

Band [MHz]

824 - 849

869 - 894

89± - 915

935 - 96±

88± - 915

925 - 96±

Coupling I. Loss VSWR

[dB]

21±1

I. Loss

Application

AMPS

-1

-2

-3

-4

-5

-6

-7

-8

-9

max

-10

CP±6±3A±836CW

CP±6±3A±881CW

CP±6±3A±9±2CW

CP±6±3A±947CW

CP±6±3A±897CW

CP±6±3A±942CW

Coupling

Isolation

-20

-30

-40

2±.5±1

2±±1

2±.5±1

2±±1

16.5±1

15±1

14.5±1

14±1

±.25

GSM

Return Loss

E-GSM

PDC

-50

-60

-70

CP±6±3A1441CW 1429 - 1453

CP±6±3A1747CW 171± - 1785

CP±6±3A1842CW 18±5 - 188±

CP±6±3A188±CW 185± - 191±

CP±6±3A196±CW 193± - 199±

CP±6±3A19±7CW 1895 - 192±

CP±6±3A189±CW 188± - 19±±

±.4±

1.2

-10

-11

-12

PCN

PCS

±.5

0.5

1.0

1.5

2.0

2.5

3.0

3.5

PHP

DECT

14.5±1

12.5±1

Frequency (GHz)

Wireless LAN CP±6±3A2442CW 24±± - 2484

±.65

Coupler P/N CP0603A

DW

CP0603A

DW

****

0

-10

-20

0

-1

-2

-3

-4

-5

-6

-7

-8

-9

-10

-11

-12

P/N

Examples

Frequency

Band [MHz]

824 - 849

869 - 894

89± - 915

935 - 96±

88± - 915

925 - 96±

Coupling I. Loss VSWR

Application

I. Loss

[dB]

15.±±1

14.5±1

14±1

14.5±1

14±1

1±.5±1

9±1

8.5±1

8±1

8.5±1

6.5±1

max

AMPS

CP±6±3A±836DW

CP±6±3A±881DW

CP±6±3A±9±2DW

CP±6±3A±947DW

CP±6±3A±897DW

CP±6±3A±942DW

Coupling Return Loss

Isolation

±.4±

1.2

GSM

-30

-40

-50

-60

E-GSM

PDC

CP±6±3A1441DW 1429 - 1453

CP±6±3A1747DW 171± - 1785

CP±6±3A1842DW 18±5 - 188±

CP±6±3A188±DW 185± - 191±

CP±6±3A196±DW 193± - 199±

CP±6±3A19±7DW 1895 - 192±

CP±6±3A189±DW 188± - 19±±

±.7

±.9

1.±

1.3

1.5

PCN

PCS

0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5

PHP

DECT

Frequency (GHz)

Wireless LAN CP±6±3A2442DW 24±± - 2484

1.5

Important: Couplers can be used at any frequency within the indicated range.

43

Thin-Film Directional Couplers

CP0603 SMD Type

Coupler P/N CP0603B

AW

CP0603B

AW

****

0

P/N

Frequency

Band [MHz]

824 - 849

869 - 894

89± - 915

935 - 96±

88± - 915

925 - 96±

Coupling I. Loss VSWR

I. Loss

-1

-3

-5

-7

Application

AMPS

Examples

[dB]

24.5±1

24±1

23.5±1

24±1

23.5±1

2±±1

18±1

17.5±1

15.5±1

max

-10

-20

Coupling

CP±6±3B±836AW

CP±6±3B±881AW

CP±6±3B±9±2AW

CP±6±3B±947AW

CP±6±3B±897AW

CP±6±3B±942AW

Isolation

±.2

GSM

-30

-40

-50

-60

Return Loss

E-GSM

PDC

-9

CP±6±3B1441AW 1429 - 1453

CP±6±3B1747AW 171± - 1785

CP±6±3B1842AW 18±5 - 188±

CP±6±3B188±AW 185± - 191±

CP±6±3B196±AW 193± - 199±

CP±6±3B19±7AW 1895 - 192±

CP±6±3B189±AW 188± - 19±±

1.2

±.25

-11

PCN

-13

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

PCS

±.3

Frequency (GHz)

PHP

DECT

Wireless LAN CP±6±3B2442AW 24±± - 2484

±.45

Coupler P/N CP0603B

BW

CP0603B

I. Loss

BW

****

0

-5

0

P/N

Examples

Frequency

Band [MHz]

824 - 849

869 - 894

89± - 915

935 - 96±

88± - 915

925 - 96±

Coupling I. Loss VSWR

Application

AMPS

[dB]

25.5±1

25±1

24.5±1

25±1

24.5±1

21±1

19±1

max

-10

-15

-20

-25

-2

CP±6±3B±836BW

CP±6±3B±881BW

CP±6±3B±9±2BW

CP±6±3B±947BW

CP±6±3B±897BW

CP±6±3B±942BW

Coupling

3

-4

-6

GSM

±.2

Return Loss

-30

E-GSM

PDC

-35

-40

CP±6±3B1441BW 1429 - 1453

CP±6±3B1747BW 171± - 1785

CP±6±3B1842BW 18±5 - 188±

CP±6±3B188±BW 185± - 191±

CP±6±3B196±BW 193± - 199±

CP±6±3B19±7BW 1895 - 192±

CP±6±3B189±BW 188± - 19±±

1.2

Isolation

-8

PCN

19±1

-45

-50

0.5

18.5±1

16.5±1

±.25

±.35

-10

4.0

PCS

1.0

1.5

2.0

2.5

3.0

3.5

PHP

DECT

Frequency (GHz)

Wireless LAN CP±6±3B2442BW 24±± - 2484

Coupler P/N CP0603B

CW

CP0603B

CW

****

0

-5

-10

-15

P/N

Examples

Frequency

Band [MHz]

824 - 849

869 - 894

89± - 915

935 - 96±

88± - 915

925 - 96±

Coupling I. Loss VSWR

I. Loss

Application

AMPS

[dB]

26.5±1

26±1

25.5±1

26±1

25.5±1

22±1

2±.5±1

2±±1

19.5±1

2±±1

max

-2

-4

-6

CP±6±3B±836CW

CP±6±3B±881CW

CP±6±3B±9±2CW

CP±6±3B±947CW

CP±6±3B±897CW

CP±6±3B±942CW

Coupling

-20

-25

-30

-35

-40

-45

-50

GSM

±.2

E-GSM

PDC

Return Loss

Isolation

CP±6±3B1441CW 1429 - 1453

CP±6±3B1747CW 171± - 1785

CP±6±3B1842CW 18±5 - 188±

CP±6±3B188±CW 185± - 191±

CP±6±3B196±CW 193± - 199±

CP±6±3B19±7CW 1895 - 192±

CP±6±3B189±CW 188± - 19±±

1.2

-8

PCN

-10

4.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

PCS

±.25

±.35

Frequency (GHz)

PHP

DECT

2±±1

18±1

Wireless LAN CP±6±3B2442CW 24±± - 2484

1.3

Important: Couplers can be used at any frequency within the indicated range.

44

Thin-Film Directional Couplers

CP0603 SMD Type – High Directivity

Coupler P/N CP0603D

AW

CP0603D AW

****

0

-5

Frequency Coupling I. Loss Return Directivity

I. Loss

P/N

Examples

-2

Application

Band

[dB]

max. Loss

[dB]

-4

[MHz]

[dB]

23

-10

-15

-20

-25

-30

-35

-40

Coupling

Isolation

CP±6±3D±836AW 824 - 849

CP±6±3D±881AW 869 - 894

CP±6±3D±9±2AW 89± - 915

CP±6±3D±947AW 935 - 96±

CP±6±3D±897AW 88± - 915

CP±6±3D±942AW 925 - 96±

CP±6±3D1441AW 1429 - 1453

CP±6±3D1747AW 171± - 1785

CP±6±3D1842AW 18±5 - 188±

CP±6±3D188±AW 185± - 191±

CP±6±3D196±AW 193± - 199±

CP±6±3D19±7AW 1895 - 192±

CP±6±3D189±AW 188± - 19±±

13.5±

13.±±

-6

AMPS

GSM

-8

-10

-12

-14

-16

12.5±

13.±±

12.5±

9.±±

±.5±

1.±±

22

21

E-GSM

PDC

Return Loss

18

17

19

18

8.±±

PCN

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

2.4

7.5±

Frequency (GHz)

PCS

1.4±

2.±±

17

15

PHP

DECT

7.±±

5.5±

16

15

Wireless LAN CP±6±3D2442AW 24±± - 2484

3

Coupler P/N CP0603D

BW

CP0603D

BW

****

0

-5

-10

-15

Frequency Coupling I. Loss Return Directivity

I. Loss

P/N

Examples

-1

-2

-3

-4

Application

Band

[dB]

max. Loss

[dB]

[MHz]

[dB]

Coupling

CP±6±3D±836BW 824 - 849

CP±6±3D±881BW 869 - 894

CP±6±3D±9±2BW 89± - 915

CP±6±3D±947BW 935 - 96±

CP±6±3D±897BW 88± - 915

CP±6±3D±942BW 925 - 96±

2±.±±

19.5±

AMPS

GSM

36

-20

-25

-30

-35

-40

-45

-5

-6

-7

-8

-9

±.25

35

Return Loss

Isolation

19.±±

19.5±

19.±±

36

35

3±

28

E-GSM

PDC

19

CP±6±3D1441BW 1429 - 1453 15.5±

CP±6±3D1747BW 171± - 1785 14.±±

CP±6±3D1842BW 18±5 - 188±

CP±6±3D188±BW 185± - 191± 13.5±

CP±6±3D196±BW 193± - 199±

±.4±

±.5±

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

2.4

PCN

Frequency (GHz)

PCS

±.55

±.7±

27

24

PHP

DECT

CP±6±3D19±7BW 1895 - 192±

CP±6±3D189±BW 188± - 19±±

13.±±

Wireless LAN CP±6±3D2442BW 24±± - 2484 11.±±

Important: Couplers can be used at any frequency within the indicated range.

45

Thin-Film Directional Couplers

CP0805 Type

GENERAL DESCRIPTION

ITF (Integrated Thin-Film) TECHNOLOGY

DIMENSIONS:

(Top View)

millimeters (inches)

The ITF SMD Coupler is based on thin-film multilayer technology.

The technology provides a miniature part with excellent high frequency

performance and rugged construction for reliable automatic assembly.

W

B

L

The ITF Coupler is offered in a variety of frequency bands compatible with

various types of high frequency wireless systems.

T

FEATURES

APPLICATIONS

• Small Size: 0805

• Mobile Communications

• Satellite TV Receivers

• GPS

A

• Frequency Range: 800MHz - 3GHz

• Characteristic Impedance: 50Ω

0805

• Operating / Storage Temp.:

• Vehicle Location Systems

• Wireless LAN’s

L

W

T

2.±3±±.1 (±.±8±±±.±±4ꢀ

1.55±±.1 (±.±61±±.±±4ꢀ

±.98±±.1 (±.±39±±.±±4ꢀ

±.56±±.25 (±.±22±±.±1±ꢀ

±.35±±.15 (±.±14±±.±±6ꢀ

-40°C to +85°C

• Power Rating: 3W Continuous

• Low Profile

• Rugged Construction

• Taped and Reeled

A

B

3

HOW TO ORDER

CP

0805

0902

A

W

TR

A

Style

Directional Coupler

Size

0805

Frequency

Sub Type

(see layout

sub-types)

Termination

Code

W = Nickel/Solder

(Sn/Pb)

Packaging Code

TR = Tape and Reel

Layout Type

(see layout types)

MHz

QUALITY INSPECTION

Finished parts are 100ꢀ tested for electrical parameters and

visual characteristics. Each production lot is evaluated on a

sample basis for:

Recommended Pad Layout Dimensions mm (inches)

2.33

(0.092)

0.60

• Static Humidity: 85°C, 85ꢀ RH, 160 hours

• Endurance: 125°C, I_R, 4 hours

(0.024)

TERMINATION

Nickel/Solder coating (Sn, Pb) compatible with automatic

soldering technologies: reflow, wave soldering, vapor phase

and manual.

2.25

(0.089)

0.65

(0.026)

NOTE: Components must be mounted on the board with the white

(Alumina) side DOWN.

46

Thin-Film Directional Couplers

CP0805 Layout Types

LAYOUT

5± OHM

(External

Resistorꢀ

COUP

Port

5± OHM

(External

Resistorꢀ

COUP

Port

RF OUT

Port

RF IN

Port

RF IN

Port

RF OUT

Port

Type: A

Sub-Type: A

Type: A

Sub-Type: B

0

I. Loss

-5

-1

-2

-3

-4

-1

-5

-10

-15

-20

-10

-15

-20

-25

-30

-35

-40

Coupling

Isolation

R. Loss

Coupling

R. Loss

-5

-6

-7

-8

-9

-10

-25

-30

-35

-40

Isolation

3

-45

-50

0.60

-45

-50

0.60

0.80

1.00

1.20

1.40

1.60

1.80

2.00

0.80

1.00

1.20

1.40

1.60

1.80

2.00

Frequency (GHz)

P/N

Examples

Frequency

Band [MHz]

Coupling I. Loss VSWR

Application

AMPS

P/N

Examples

Frequency

Band [MHz]

Coupling I. Loss VSWR

[dB]

max

Application

AMPS

[dB]

16.5±1

16±1

max

CP±8±5A±836BW

CP±8±5A±881BW

CP±8±5A±9±2BW

CP±8±5A±947BW

CP±8±5A±897BW

CP±8±5A±942BW

CP±8±5A1441BW 1429 - 1453

CP±8±5A1747BW 171± - 1785

CP±8±5A1842BW 18±5 - 188±

CP±8±5A188±BW 185± - 191±

CP±8±5A196±BW 193± - 199±

CP±8±5A19±7BW 1895 - 192±

CP±8±5A189±BW 188± - 19±±

824 - 849

869 - 894

89± - 915

935 - 96±

88± - 915

925 - 96±

19±1

18.5±1

18±1

CP±8±5A±836AW

CP±8±5A±881AW

CP±8±5A±9±2AW

CP±8±5A±947AW

CP±8±5A±897AW

CP±8±5A±942AW

CP±8±5A1441AW 1429 - 1453

CP±8±5A1747AW 171± - 1785

CP±8±5A1842AW 18±5 - 188±

CP±8±5A188±AW 185± - 191±

CP±8±5A196±AW 193± - 199±

CP±8±5A19±7AW 1895 - 192±

CP±8±5A189±AW 188± - 19±±

824 - 849

869 - 894

89± - 915

935 - 96±

88± - 915

925 - 96±

±.25

1.2

±.25

GSM

16±1

15.5±1

16±1

15.5±1

12±1

1±.5±1

1±±1

9.5±1

18±1

GSM

1.2

1.3

1.4

18.5±1

18±1

14.5±1

12.5±1

12±1

E-GSM

PDC

E-GSM

PDC

±.35

±.5

±.7

±.8

PCN

±.6

±.7

±.6

PCS

11.5±1

12±1

1.4

PCS

PHP

DECT

PHP

DECT

12±1

1±±1

Wireless LAN CP±8±5A2442BW 24±± - 2484

±.9

LAYOUT

5± OHM

COUP

Type: A

Sub-Type: C

IN

OUT

0

I. Loss

-5

P/N

Examples

Frequency

Band [MHz]

824 - 849

869 - 894

89± - 915

935 - 96±

88± - 915

925 - 96±

Coupling I. Loss VSWR

-10

-15

-20

Application

AMPS

Coupling

Isolation

[dB]

14±1

13.5±1

13±1

13.5±1

13±1

9.5±1

8±1

max

CP±8±5A±836CW

CP±8±5A±881CW

CP±8±5A±9±2CW

CP±8±5A±947CW

CP±8±5A±897CW

CP±8±5A±942CW

CP±8±5A1441CW 1429 - 1453

CP±8±5A1747CW 171± - 1785

CP±8±5A1842CW 18±5 - 188±

CP±8±5A188±CW 185± - 191±

Cp±8±5A196±CW 193± - 199±

CP±8±5A19±7CW 1895 - 192±

CP±8±5A189±CW 188± - 19±±

±.5

-25

-30

GSM

R. Loss

1.4

1.8

2.2

E-GSM

PDC

-35

-40

1.15

1.6

-45

-50

PCN

8±1

7.5±1

6±1

1.75

0.60 0.80 1.00 1.20 1.40 1.60 1.80

2.00 2.20 2.40

PCS

Frequency (GHz)

PHP

DECT

Wireless LAN CP±8±5A2442CW 24±± - 2484

2.5

Important: Couplers can be used at any frequency within the indicated range.

47

Thin-Film Directional Couplers

CP0805 Layout Types

LAYOUT

5± OHM

COUP

5± OHM

COUP

IN

OUT

IN

OUT

Type: A

Sub-Type: D

Type: A

Sub-Type: E

0

-5

I. Loss

-5

-10

-15

-20

Coupling

Isolation

Coupling

-10

-15

-20

-25

-30

R. Loss

Isolation

R. Loss

-35

-40

-25

-30

3

-45

-50

0.50

0.75

1.00

1.25

1.50

1.75

2.00

0.60 0.80 1.00 1.20 1.40 1.60 1.80

2.00 2.20 2.40

Frequency (GHz)

P/N

Examples

Frequency

Band [MHz]

824 - 849

869 - 894

89± - 915

935 - 96±

88± - 915

925 - 96±

Coupling I. Loss VSWR

P/N

Examples

Frequency

Coupling I. Loss VSWR

Application

AMPS

Application

AMPS

[dB]

13.±±1

12.5±1

12±1

12.5±1

12±1

8.5±1

7±1

6.5±1

7±1

max

Band [MHz]

824 - 849

869 - 894

89± - 915

935 - 96±

88± - 915

925 - 96±

[dB]

11±1

1±.5±1

1±±1

1±.5±1

1±±1

7±1

max

CP±8±5A±836DW

CP±8±5A±881DW

CP±8±5A±9±2DW

CP±8±5A±947DW

CP±8±5A±897DW

CP±8±5A±942DW

CP±8±5A1441DW 1429 - 1453

CP±8±5A1747DW 171± - 1785

CP±8±5A1842DW 18±5 - 188±

CP±8±5A188±DW 185± - 191±

Cp±8±5A196±DW 193± - 199±

CP±8±5A19±7DW 1895 - 192±

CP±8±5A189±DW 188± - 19±±

CP±8±5A±836EW

CP±8±5A±881EW

CP±8±5A±9±2EW

CP±8±5A±947EW

CP±8±5A±897EW

CP±8±5A±942EW

CP±8±5A1441EW 1429 - 1453

CP±8±5A1747EW 171± - 1785

CP±8±5A1842EW 18±5 - 188±

CP±8±5A188±EW 185± - 191±

Cp±8±5A196±EW 193± - 199±

CP±8±5A19±7EW 1895 - 192±

CP±8±5A189±EW 188± - 19±±

±.5

1.4

±.85

1.4

GSM

E-GSM

PDC

E-GSM

PDC

1.25

1.85

2.15

1.8

2.1

1.8

2.7

1.8

2.2

5.5±1

5±1

PCN

PCS

5±1

4±1

PHP

DECT

PHP

DECT

3.15

4.2

2.4

1.85

2.4

1.8

2.1

Wireless LAN CP±8±5A2442DW 24±± - 2484

5.5±1

Wireless LAN CP±8±5A2442EW 24±± - 2484

LAYOUT

RF IN

Port

COUP Port

Type: B

Sub-Type: A

0

I. Loss

-5

-1

-2

RF OUT

Port

-10

Coupling

5± OHM (External Resistorꢀ

Frequency Coupling I. Loss VSWR

-15

-3

-4

-5

-6

-7

-8

-20

P/N

R. Loss

Application

AMPS

-25

Examples

Band [MHz]

824 - 849

869 - 894

89± - 915

935 - 96±

88± - 915

925 - 96±

[dB]

21.5±1

21±1

2±.5±1

21±1

2±.5±1

17±1

15.5±1

15±1

14.5±1

15±1

max

-30

CP±8±5B±836AW

CP±8±5B±881AW

CP±8±5B±9±2AW

CP±8±5B±947AW

CP±8±5B±897AW

CP±8±5B±942AW

CP±8±5B1441AW 1429 - 1453

CP±8±5B1747AW 171± - 1785

Cp±8±5B1842AW 18±5 - 188±

CP±8±5B188±AW 185± - 191±

CP±8±5B196±AW 193± - 199±

CP±8±5B19±7AW 1895 - 192±

CP±8±5B189±AW 188± - 19±±

Isolation

-35

-40

GSM

±.25

-45

-50

1.00

-9

-10

2.40

E-GSM

1.20

1.40

1.60

1.80

2.00

2.20

PDC

PCN

Frequency (GHz)

1.2

±.3

PCS

±.4

±.3

PHP

DECT

Wireless LAN CP±8±5B2442AW 24±± - 2484

13±1

±.4

Important: Couplers can be used at any frequency within the indicated range.

48

Thin-Film Directional Couplers

CP0805 Layout Types

LAYOUT

RF IN

Port

COUP Port

RF IN

Port

COUP Port

RF OUT

Port

RF OUT

Port

5± OHM (External Resistorꢀ

Type: B

Sub-Type: C

Type: B

Sub-Type: B

0

-5

0

-5

0

I. Loss

-1

-2

-3

-4

-5

-1

-2

-10

-15

-20

-3

-4

-5

-15

-20

-25

-30

-35

-40

Coupling

R. Loss

-25

-30

R. Loss

-6

-7

-35

-40

-7

Isolation

-8

Isolation

-8

-45

-50

-9

-45

-50

1.10

3

-10

1.00 1.20 1.40 1.60 1.80 2.00 2.20 2.40 2.60

-10

2.50

1.30

1.50

1.70

1.90

2.10

2.30

Frequency (GHz)

P/N

Examples

Frequency

Band [MHz]

824 - 849

869 - 894

89± - 915

935 - 96±

88± - 915

925 - 96±

Coupling I. Loss VSWR

P/N

Examples

Frequency

Band [MHz]

824 - 849

869 - 894

89± - 915

935 - 96±

88± - 915

925 - 96±

Coupling I. Loss VSWR

Application

AMPS

Application

AMPS

[dB]

23.5±1

23±1

max

[dB]

max

CP±8±5B±836BW

CP±8±5B±881BW

CP±8±5B±9±2BW

CP±8±5B±947BW

CP±8±5B±897BW

CP±8±5B±942BW

CP±8±5B1441BW 1429 - 1453

CP±8±5B1747BW 171± - 1785

CP±8±5B1842BW 18±5 - 188±

CP±8±5B188±BW 185± - 191±

CP±8±5B196±BW 193± - 199±

CP±8±5B19±7BW 1895 - 192±

CP±8±5B189±BW 188± - 19±±

CP±8±5B±836CW

CP±8±5B±881CW

CP±8±5B±9±2CW

CP±8±5B±947CW

CP±8±5B±897CW

CP±8±5B±942CW

CP±8±5B1441CW 1429 - 1453

CP±8±5B1747CW 171± - 1785

Cp±8±5B1842CW 18±5 - 188±

CP±8±5B188±CW 185± - 191±

Cp±8±5B196±CW 193± - 199±

CP±8±5B19±7CW 1895 - 192±

CP±8±5B189±CW 188± - 19±±

25±1

24.5±1

24±1

22.5±1

22±1

GSM

24±1

23±1

22±1

24.5±1

24±1

E-GSM

PDC

E-GSM

PDC

±.25

18.5±1

17±1

16.5±1

16±1

2±±1

18.5±1

18±1

PCN

1.2

PCS

17.5±1

18±1

PHP

DECT

16±1

PHP

DECT

Wireless LAN CP±8±5B2442BW 24±± - 2484

14±1

±.4

Wireless LAN CP±8±5B2442CW 24±± - 2484

16±1

±.4

Important: Couplers can be used at any frequency within the indicated range.

49

Thin-Film Directional Couplers

CP0805 and CP0603 Test Jig

ITF TEST JIG FOR COUPLER TYPES 0805 AND 0603 SMD

GENERAL DESCRIPTION

MEASUREMENT PROCEDURE

This jig is designed for the testing of CP0805 and CP0603

series Directional Couplers using a vector network analyzer.

When measuring a component, it can be either soldered or

pressed by a non-metallic stick until all four ports touch the

appropriate pads. To measure the coupling (and the R. Loss)

place the component on the Port 1 & Port 2 pads. Use two

SMA 50Ω terminations (male) to terminate the ports, which

are not connected to the network analyzer, and connect

the network analyzer to the two ports. A 90° rotation of

the component on its pads allows measuring a second

parameter (I. Loss).

It consists of a FR4 multi-layer substrate, having 50Ω

microstrips as conducting lines and a ground plane in the

middle layer, located at a distance of 0.2mm from the

microstrips.

The connectors are SMA type (female), ‘Johnson Components

Inc.’ Product P/N: 142-0701-881.

The jig is designed for a full 2-port calibration. LOAD calibration

can be done either by a 50Ω SMA termination, or by soldering

a 50Ω chip resistor at the 50Ω ports.

Connector (1 of 12ꢀ

P/N 142-±7±1-881

Load & Thru

Calibration Area

Short

Open

3

Port 1

Port 2

Coupler 0805

5±Ω

Port 1

Coupler 0603

5±Ω

Port 2

5±Ω

CP0805 SERIES DIRECTIONAL COUPLERS

Orientation and Tape and Reel Packaging Specification

(Top View)

5±

OHM

5±

OHM

COUP

RF

IN

RF

OUT

RF

IN

RF

OUT

TYPE AA

TYPE AC

TYPE BA

TYPE AB

TYPE AD

TYPE BB

5±

COUP

OHM

RF

IN

RF

OUT

RF

IN

RF

OUT

RF

IN

RF

OUT

TYPE AE

RF

IN

RF

IN

RF

IN

COUP

5±

OHM

5±

OHM

5±

OHM

RF

OUT

RF

OUT

RF

OUT

TYPE BC

The parts should be mounted on the PCB with White (Alumina)

side down and the "dark" side up.

5±

Thin-Film Directional Couplers

DB0805 3dB 90° Couplers

GENERAL DESCRIPTION

ITF TECHNOLOGY

The ITF SMD 3dB 90° Coupler is based on thin-film multilayer

technology. The technology provides a miniature part with excellent

high frequency performance and rugged construction for reliable

automatic assembly.

FEATURES

• Miniature 0805 size

APPLICATIONS

• Balanced Amplifiers and

Signal Distribution in

• Low I. Loss

Mobile Communications

• High Isolation

• Power Handling:

10W RF CW

The ITF 3dB 90° Coupler is offered in a variety of frequency bands

compatible with various types of high frequency wireless

systems.

• Surface Mountable

• Supplied on Tape and Reel

• Operating Temperature

-40°C to +85°C

Recommended Pad Layout Dimensions

mm (inches)

DIMENSIONS:

millimeters (inches)

2.24 (0.088)

Bottom View

0.70

(0.028)

2.±3±±.1±

(±.±8±±±.±±4ꢀ

L

W

1.55±±.1±

(±.±61±±.±±4ꢀ

B

L

W

±.98±±.15

(±.±37±±.±±6ꢀ

T

3

±.56±±.25

(±.±22±±.±1±ꢀ

±.35±±.15

A

B

1.76

(0.069)

0.64

(0.025)

GROUND

(±.±14±±.±±6ꢀ

A

TERMINALS (Top View)

Orientation in Tape

0.15 (0.006) TYP.

5±

OUT1

OUT2

OUT1

OHM

Code Letter

Marking

IN

OUT2

ELECTRICAL PARAMETERS*

Frequency F_OI. Loss @ F_OPhase Balance Code Letter

Part Number

[MHz]

[dB]

±.35

±.3±

±.25

[deg] max.

Marking

DB±8±5A±88±AWTR

DB±8±5A±915AWTR

DB±8±5A±967AWTR

DB±8±5A135±AWTR

DB±8±5A165±AWTR

DB±8±5A18±±AWTR

DB±8±5A185±AWTR

DB±8±5A19±±AWTR

DB±8±5A195±AWTR

DB±8±5A214±AWTR

DB±8±5A2325AWTR

88±±3±

915±3±

967±3±

3

Y

V

C

F

135±±5±

165±±5±

18±±±5±

185±±5±

19±±±5±

195±±5±

214±±5±

2325±5±

F

K

L

T

*With Recommended Pad Layout

All intermediate frequencies within the

indicated range are readily available.

Important:

51

Thin-Film Directional Couplers

DB0805 3dB 90° Couplers

880 30MHz DB0805A0880AWTR

-3.±

I. Loss 1

-3.2

-3.4

I. Loss 2

-3.6

3

-3.8

85±

865

88±

895

91±

Frequency (MHzꢀ

-1±

-12

-14

-16

-18

-2±

-22

R. Loss

Isolation

-24

-26

-28

-3±

85±

855

88±

9±5

93±

Frequency (MHzꢀ

52

Thin-Film Directional Couplers

DB0805 3dB 90° Couplers

915 30MHz DB0805A0915AWTR

-2.8

-3.±

-3.2

I. Loss 1

-3.4

I. Loss 2

3

-3.6

-3.8

885

9±±

915

93±

945

Frequency (MHzꢀ

-1±

-12

-14

-16

-18

-2±

-22

Isolation

R. Loss

-24

-26

-28

-3±

865

89±

915

94±

965

Frequency (MHzꢀ

53

Thin-Film Directional Couplers

DB0805 3dB 90° Couplers

967 30MHz DB0805A0967AWTR

-2.8

-3.±

-3.2

I. Loss 1

-3.4

I. Loss 2

3

-3.6

-3.8

937

952

967

982

997

Frequency (MHzꢀ

-1±

-12

-14

-16

-18

-2±

-22

-24

-26

-28

-3±

R. Loss

Isolation

917

942

967

992

1±17

Frequency (MHzꢀ

54

Thin-Film Directional Couplers

DB0805 3dB 90° Couplers

1350 50MHz DB0805A1350AWTR

-3.±

-3.2

I. Loss 1

-3.4

I. Loss 2

-3.6

3

-3.8

13±±

135±

14±±

Frequency (MHzꢀ

-1±

-12

-14

-16

-18

-2±

-22

Isolation

R. Loss

-24

-26

-28

-3±

13±±

135±

14±±

Frequency (MHzꢀ

55

Thin-Film Directional Couplers

DB0805 3dB 90° Couplers

1650 50MHz DB0805A1650AWTR

-2.8

-3.±

I. Loss 1

-3.2

-3.4

3

I. Loss 2

-3.6

155±

16±±

165±

17±±

175±

Frequency (MHzꢀ

-1±

-12

-14

-16

-18

-2±

-22

Isolation

R. Loss

-24

-26

-28

-3±

155±

16±±

165±

17±±

175±

Frequency (MHzꢀ

56

Thin-Film Directional Couplers

DB0805 3dB 90° Couplers

1800 50MHz DB0805A1800AWTR

-2.8

-3.±

I. Loss 1

-3.2

I. Loss 2

-3.4

3

-3.6

175±

1775

18±±

1825

185±

Frequency (MHzꢀ

-1±

-12

-14

-16

-18

-2±

-22

-24

-26

-28

-3±

Isolation

R. Loss

175±

1775

18±±

1825

185±

Frequency (MHzꢀ

57

Thin-Film Directional Couplers

DB0805 3dB 90° Couplers

1850 50MHz DB0805A1850AWTR

-2.8

-3.±

I. Loss 1

-3.2

I. Loss 2

-3.4

3

-3.6

18±±

1825

185±

1875

19±±

Frequency (MHzꢀ

-1±

-12

-14

-16

-18

-2±

-22

-24

-26

-28

-3±

R. Loss

Isolation

18±±

1825

185±

1875

19±±

Frequency (MHzꢀ

58

Thin-Film Directional Couplers

DB0805 3dB 90° Couplers

1900 50MHz DB0805A1900AWTR

-3.±

I. Loss 1

-3.2

I. Loss 2

-3.4

3

-3.6

185±

1875

19±±

1925

195±

Frequency (MHzꢀ

-1±

-12

-14

-16

-18

-2±

-22

-24

-26

-28

-3±

Isolation

R. Loss

185±

1875

19±±

1925

195±

Frequency (MHzꢀ

59

Thin-Film Directional Couplers

DB0805 3dB 90° Couplers

1950 50MHz DB0805A1950AWTR

-2.8

-3.±

I. Loss 1

-3.2

I. Loss 2

-3.4

-3.6

3

19±±

1925

195±

1975

2±±±

Frequency (MHzꢀ

-1±

-12

-14

-16

-18

-2±

-22

-24

-26

-28

-3±

R. Loss

Isolation

19±±

1925

195±

1975

2±±±

Frequency (MHzꢀ

6±

Thin-Film Directional Couplers

DB0805 3dB 90° Couplers

2140 50MHz DB0805A2140AWTR

-2.6

-2.8

-3.±

I. Loss 1

-3.2

I. Loss 2

-3.4

-3.6

-3.8

3

2±4±

2±9±

214±

219±

224±

Frequency (MHzꢀ

-1±

-12

-14

-16

-18

-2±

-22

-24

-26

-28

-3±

R. Loss

Isolation

214±

2±9±

214±

219±

224±

Frequency (MHzꢀ

61

Thin-Film Directional Couplers

DB0805 3dB 90° Couplers

2325 50MHz DB0805A2325AWTR

-3.±

-3.1

I. Loss 1

-3.2

-3.3

I. Loss 2

-3.4

3

-3.5

2275

23±±

2325

235±

2375

Frequency (MHzꢀ

-1±

-12

-14

-16

-18

-2±

-22

-24

-26

-28

-3±

R. Loss

Isolation

2275

23±±

2325

235±

2375

Frequency (MHzꢀ

62

Thin-Film Directional Couplers

DB0805 3dB 90° Test Jigs

GENERAL DESCRIPTION

These jigs are designed for testing the DB0805 3dB 90°

Couplers using a Vector Network Analyzer.

The connectors are SMA type (female), ‘Johnson Components

Inc.’ Product P/N: 142-0701-841.

They consist of a dielectric substrate, having 50Ω microstrips

as conducting lines and a bottom ground plane located at a

distance of 0.254mm from the microstrips.

Both a measurement jig and a calibration jig are provided.

The calibration jig is designed for a full 2-port calibration, and

consists of an open line, short line and through line. LOAD

calibration can be done by a 50Ω SMA termination.

The substrate used is Neltec’s NH9338ST0254C1BC.

MEASUREMENT PROCEDURE

When measuring a component, it can be either soldered or

pressed using a non-metallic stick until all four ports touch

the appropriate pads. Set the VNA to the relevant frequency

band. Connect the VNA using a 10dB attenuator on the jig

terminal connected to port 2. Follow the VNA’s instruction

manual and use the calibration jig to perform a full 2-port

calibration in the required bandwidths.

Place the coupler on the measurement jig as follows:

3

Input (Coupler) ➜ Connector 1 (Jig)

50Ω (Coupler) ➜ Connector 2 (Jig)

Output 1 (Coupler) ➜ Connector 3 (Jig)

Output 2 (Coupler) ➜ Connector 4 (Jig)

To measure R. Loss and I. Loss 1 connect:

Connector 1 (Jig) ➜ Port 1 (VNA) Connector 3 (Jig) ➜ Port 2 (VNA)

Connector 2 (Jig) ➜ 50Ω

Connector 4 (Jig) ➜ 50Ω

To measure R. Loss and I. Loss 2 connect:

Connector 1 (Jig) ➜ Port 1 (VNA) Connector 3 (Jig) ➜ 50Ω

Connector 2 (Jig) ➜ 50Ω

Connector 4 (Jig) ➜ Port 2 (VNA)

To measure Isolation connect:

Connector 1 (Jig) ➜ 50Ω

Connector 3 (Jig) ➜ Port 1 (VNA)

Connector 4 (Jig) ➜ Port 2 (VNA)

Connector 2 (Jig) ➜ 50Ω

Calibration Jig

Measurement Jig

Connector 1

Load &

Through

Connector

Johnson

P/N 142-±7±1-841

Connector 2

Load &

Through

Connector 4

Short Line

to GND

Open

Line

Connector 3

63

Thin-Film Technology

Integrated Thin-Film

Low-Pass Filters

4

64

Thin-Film Low Pass Filter

LP0603 Lead-Free LGA Type

GENERAL DESCRIPTION

APPLICATIONS

The LP0603 ITF (Integrated Thin Film) Lead-Free LGA Low

Pass Filter is based on thin-film multilayer technology. The

technology provides a miniature part with excellent high

frequency performance and rugged construction for reliable

automatic assembly.

• Mobile communications

• Satellite TV receivers

• GPS

• Vehicle location systems

• Wireless LANs

• RFID

The ITF Low Pass Filters are offered in a variety of frequency

bands compatible with various types of high frequency

wireless systems.

LAND GRID ARRAY ADVANTAGES

• Inherent Low Profile

• Self Alignment during Reflow

• Excellent Solderability

• Low Parasitics

FEATURES

• Miniature Size: 0603

• Frequency Range: 900MHz -2.4GHz

• Characteristic Impedance: 50 Ohm

• Operating/Storage Temperature: -40°C to +85°C

• Power Rating: 3W Continuous

• Low Profile

• Better Heat Dissipation

• Rugged Construction

• Lead Free

• Taped and Reeled

HOW TO ORDER

4

LP

0603

A

XXXX

A

N

TR

Style

Size

0603

Type

Frequency

Sub-Type

Termination

LGA

Taped & Reeled

MHz

Ni/Lead Free Solder

FINAL QUALITY INSPECTION

Finished parts are 100ꢀ tested for electrical parameters and

visual characteristics. Each production lot is evaluated on a

sample basis for:

• Static Humidity: 85°C, 85ꢀ RH, 160 hours

• Endurance: 125°C, IR, 4 hours

TERMINATION

Nickel/Lead-Free Solder coating compatible with automatic

soldering technologies: reflow, wave soldering, vapor phase

and manual.

65

Thin-Film Low Pass Filter

LP0603 Lead-Free LGA Type

DIMENSIONS: millimeters (inches)

(Bottom View)

TERMINALS AND ORIENTATION IN TAPE

(Top View)

S

B

A

GND

IN

OUT

L

T

W

RECOMMENDED PAD LAYOUT (mm)

1.6±±.1

±.25±±.±5

L

W

T

A

B

S

(±.±63±±.±±4ꢀ

(±.±1±±±.±±2ꢀ

±.84±±.1

(±.±33±±.±±4ꢀ

±.6±±±.1

(±.±24±±.±±4ꢀ

±.2±±±.±5

(±.±±8±±.±±2ꢀ

±.±5±±.±5

(±.±±2±±.±±2ꢀ

1.1±

(±.±43ꢀ

±.4±

(±.±16ꢀ

4

±.5±

(±.±2±ꢀ

1.75 (±.±69ꢀ

ELECTRICAL CHARACTERISTICS

(Guaranteed over –40°C to +85°C Operating Temperature Range)

P/N

Frequency

Band [MHz]

I. Loss

[dB]

VSWR

max

Attentuation

typ.

[dB]

±.35 typ

(±.5 maxꢀ

25 @ 2xF_±

14 @ 3xF_±

LP±6±3A±9±2ANTR

LP±6±3A±947ANTR

LP±6±3A1747ANTR

LP±6±3A1842ANTR

LP±6±3A188±ANTR

LP±6±3A195±ANTR

LP±6±3A214±ANTR

LP±6±3A2442ANTR

89±-915

935-96±

1.4

±.35 typ

(±.5 maxꢀ

25 @ 2xF_±

17 @ 3xF_±

±.3 typ

(±.5 maxꢀ

25 @ 2xF_±

17 @ 3xF_±

171±-1785

18±5-188±

184±-192±

192±-198±

211±-217±

2412-2472

±.3 typ

(±.5 maxꢀ

27 @ 2xF_±

15 @ 3xF_±

±.3 typ

(±.5 maxꢀ

25 @ 2xF_±

17 @ 3xF_±

±.3 typ

(±.5 maxꢀ

27 @ 2xF_±

15 @ 3xF_±

±.3 typ

(±.5 maxꢀ

27 @ 2xF_±

17 @ 3xF_±

±.3 typ

(±.5 maxꢀ

25 @ 2xF_±

17 @ 3xF_±

Note: additional frequencies available upon request

66

Thin-Film Low Pass Filter

LP0603 Lead-Free LGA Type Test Jig

LP0603A0947ANTR

LP0603A0902ANTR

0

-5

S21

S11

S21

F₀

-5

-10

-15

-20

-25

-30

–35

-40

-45

-50

-10

-15

-20

-25

-30

–35

-40

-45

-50

3*F₀

S11

2*F₀

0

0.25 0.5 0.75

1

1.25 1.5 1.75

2

2.25 2.5 2.75

3

3.25 3.5 3.75

4

0

0.25 0.5 0.75

1

1.25 1.5 1.75

2

2.25 2.5 2.75

3

3.25 3.5 3.75

4

Frequency (GHz)

LP0603A1747ANTR

LP0603A1842ANTR

0

-5

0

-5

S21

F₀

S21

F₀

-10

-15

-20

-25

-30

–35

-40

-45

-50

-10

-15

-20

-25

-30

–35

-40

-45

-50

S11

3*F₀

4

2*F₀

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

6

6.5

7

7.5

8

8.5

9

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

6

6.5

7

7.5

8

Frequency (GHz)

LP0603A1880ANTR

LP0603A1950ANTR

0

-5

0

S21

S11

S21

F₀

-5

-10

-15

-20

-25

-30

–35

-40

-45

-50

-10

-15

-20

-25

-30

–35

-40

-45

-50

S11

3*F₀

2*F₀

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

6

6.5

7

7.5

8

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

6

6.5

7

7.5

8

Frequency (GHz)

67

Thin-Film Low Pass Filter

LP0603 Lead-Free LGA Type Test Jig

LP0603A2140ANTR

LP0603A2442ANTR

0

-5

S21

F₀

S21

S11

-5

-10

-15

-20

-25

-30

–35

-40

-45

-50

-10

-15

-20

-25

-30

–35

-40

-45

-50

S11

3*F₀

2*F₀

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

6

6.5

7

7.5

8

0

0.5

1

1.5

2

2.5

3

3.5

4 4.5 5 5.5 6 6.5 7 7.5 8 8.5 9 9.5 10

Frequency (GHz)

TEST JIG FOR LP0603 LEAD-FREE LGA LOW PASS FILTER

GENERAL DESCRIPTION

MEASUREMENT PROCEDURE

These jigs are designed for testing the LP0603 LGA Low

Pass Filters using a Vector Network Analyzer.

Follow the VNA’s instruction manual and use the calibration

jig to perform a full 2-Port calibration in the required band-

widths.

4

They consist of a dielectric substrate, having 50Ω microstrips

as conducting lines and a bottom ground plane located at a

distance of 0.127mm from the microstrips.

Solder the filter to the measurement jig as follows:

Input

(Filter)

➨ Connector 1 (Jig)

➨ Connector 2 (Jig)

GND (Filter) ➨ GND (Jig)

The substrate used is Neltec’s NH9338ST0127C1BC (or

similar).

Output

(Filter)

The connectors are SMA type (female), ‘Johnson

Components Inc.’ Product P/N: 142-0701-841 (or similar).

Both a measurement jig and a calibration jig are provided.

Set the VNA to the relevant frequency band. Connect the

VNA using a 10dB attenuator on the jig terminal connected

to port 2 (using an RF cable).

The calibration jig is designed for a full 2-port calibration, and

consists of an open line, short line and through line. LOAD

calibration can be done by a 50Ω SMA termination.

Measurement

Calibration Jig

Short line to

GND

Open

line

Connector 1

Connector 2

Connector

Johnson

P/N 152-0701-841

Load &

Through

Load &

OUT

68

Thin-Film Low Pass Filter

LP0805 Type Harmonic

DIMENSIONS: millimeters (inches)

GENERAL DESCRIPTION

2.±3±±.1

The ITF (Integrated Thin-Film) SMD Filter is based on thin-film

multilayer technology. The technology provides a miniature

part with excellent high frequency performance and rugged

construction for reliable automatic assembly.

L

W

T

(±.±8±±±.±±4ꢀ

1.55±±.1

(±.±61±±.±±4ꢀ

1.±2±±.1

(±.±4±±±.±±4ꢀ

±.56±±.25

(±.±22±±.±1±ꢀ

±.35±±.15

(±.±14±±.±±6ꢀ

The ITF Filter is offered in a variety of frequency bands com-

patible with various types of high frequency wireless systems.

A

B

FEATURES

• Small Size: 0805

• Frequency Range: 800MHz - 3.5GHz

• Characteristic Impedance: 50Ω

• Operating / Storage Temp.: -40°C to +85°C

• Power Rating: 3W Continuous

• Low Profile

FINAL QUALITY INSPECTION

Finished parts are 100ꢀ tested for electrical parameters and

visual/mechanical characteristics. Each production lot is

evaluated on a sample basis for:

• Rugged Construction

• Taped and Reeled

• Static Humidity: 85°C, 85ꢀ RH, 160 hours

• Endurance: 125°C, I_R4 hours

APPLICATIONS

TERMINATION

Nickel/Solder coating (Sn, Pb) compatible with automatic

soldering technologies: reflow, wave soldering, vapor phase

and manual.

• Mobile Communications

• Satellite TV Receivers

• GPS

4

• Vehicle Location Systems

• Wireless LAN’s

HOW TO ORDER

LP

0805A

0902

AW

TR

Style

Low Pass

Size

0805

Frequency

Termination

Nickel/Solder (Sn/Pb)

Packaging Code

TR = Tape and Reel

MHz

TERMINALS AND LAYOUT (Top View)

Orientation in Tape

TYPE A

TYPE B

TYPE C

TYPE D

IN

GND

IN

GND

IN

GND

IN

GND

OUT

GND OUT

GND

OUT

69

Thin-Film Low Pass Filter

LP0805 Type Harmonic

ELECTRICAL CHARACTERISTICS

Part

Frequency

Band (MHz)

880 - 915

925 - 960

890 - 915

935 - 960

1007 - 1231

824 - 849

I. Loss

max

VSWR

max

Attenuation

(dB) Typical

Layout

Application

Number

Type

A

E-GSM

LP0805A0897AW

LP0805A0942AW

LP0805A0902AW

LP0805A0947AW

LP0805A1119AW

LP0805A0836AW

LP0805A0881AW

LP0805A1747AW

LP0805A1842AW

LP0805A1880AW

LP0805A1960AW

LP0805A1907AW

LP0805A1890AW

LP0805A2150AW

A

D

B

GSM

AMPS

PCN

PCS

869 - 894

1710 - 1785

1805 - 1880

1850 - 1910

1930 - 1990

1895 - 1920

1880 - 1900

1935 - 2365

2400 - 2484

3400 ~ 3600

0.4dB

(0.3dB typ)

1.7

30 @ 2XFo

20 @ 3xFo

PHP

DECT

3G

Wireless LAN LP0805A2442AW

B

C

WLL

LP0805A3500AW

Typical Electrical Performance

LP0805A0902AWTR

LP0805A0836AWTR

LP0805A0881AWTR

±

Fo

-1±

-2±

-3±

-4±

-1±

-2±

-3±

-4±

-1±

-2±

-3±

4

3Fo

-4±

3Fo

2Fo

-5±

-6±

-7±

-6±

-7±

-6±

-7±

±

±.5

1

1.5

2

2.5

3

3.5

4

±

±.5

1

1.5

2

2.5

3

3.5

4

±

±.5

1

1.5

2

2.5

3

3.5

Frequency (GHzꢀ

LP0805A1842AWTR

LP0805A1747AWTR

LP0805A0967AWTR

±

Fo

-1±

-2±

-3±

-4±

-1±

-2±

-3±

-4±

-1±

-2±

-3±

-4±

3Fo

2Fo

3Fo

2Fo

-5±

2Fo

-6±

-7±

-6±

-7±

-6±

-7±

±

1

2

3

4

5

6

7

8

9

1±

±

1

2

3

4

5

6

7

8

9

1±

±

±.5

1

1.5

2

2.5

3

3.5

4

Frequency (GHzꢀ

LP0805A1950AWTR

LP0805A2442AWTR

LP0805A3500AWTR

±

Fo

-1±

-2±

-3±

-4±

-1±

-2±

-3±

-4±

-1±

-2±

-3±

-4±

3Fo

2Fo

-5±

2Fo

-6±

-7±

-6±

-7±

-6±

-7±

2Fo

±

1

2

3

4

5

6

7

8

9

1±

±

1

2

3

4

5

6

7

8

9

1±

±

1

2

3

4

5

6

7

8

9

1±

11

12 13

Frequency (GHzꢀ

LP0805A1119AWTR

LP0805A2150AWTR

±

-1±

-2±

-3±

-4±

-5±

-6±

-7±

±

Fo

-1±

-2±

-3±

-4±

-5±

-6±

-7±

3Fo

2Fo

±

±.5

1

1.5

2

2.5

3

3.5

4

±

1

2

3

4

5

6

7

8

9

1±

Frequency (GHzꢀ

7±

Thin-Film Low Pass Filter

LP0805 Test Jig

ITF TEST JIG FOR LOW PASS FILTER 0805

GENERAL DESCRIPTION

This jig is designed for the testing of the 0805 Low Pass Filter

using a vector network analyzer.

CALIBRATION AND

MEASUREMENT PROCEDURE

The jig is designed for a full 2-port calibration. LOAD calibra-

It consists of a FR4 multi-layer substrate, having 50Ω

microstrips as conducting lines and a ground plane in the

middle layer, located at a distance of 0.2mm from the

microstrips.

tion is carried out using a 50Ω SMA termination.

To measure a component, it can be either soldered or

pressed down by a non-metallic stick until all four ports

touch the appropriate pads.

The connectors are SMA type (female), ‘Johnson Components

Inc.’ Product P/N: 142-0701-881.

Calibration

Measurement

Short

4

Thru/Load

Open

OUT

IN

Connector

p/n 142-0701-881

(6x)

Connector

p/n 142-0701-881

(6x)

GND

71

Thin-Film Products

Designer Kits

Accu-P^®/Accu-L^®Kits

5

72

RF/Microwave Thin-Film Products

Designer Kits (Special Kits Available Upon Request)

®

Accu-P

Designer Kit Type 1700

Designer Kit Type 1800

Designer Kit Type 1300

®

Order Number: Accu-P 0201KIT02

Order Number: Accu-P 0201KIT03

Order Number: Accu-P 0402KIT01

Capacitors

Value pF

Capacitors

Value pF

Capacitors

Value pF

Volts

Tolerance

Volts

Tolerance

Volts

Tolerance

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.5

1.8

2.0

2.2

2.4

2.7

3.0

3.3

3.6

3.9

4.7

5.6

6.8

7.5

8.2

10.0

12.0

A

B

G

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.0

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

2.9

3.0

3.1

3.3

3.4

3.6

3.9

4.1

4.3

4.5

4.7

A

B

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

1.5

1.8

2.0

2.2

2.4

2.7

3.0

3.3

3.9

4.7

5.6

6.8

8.2

10.0

12.0

15.0

18.0

22.0

A

B

G

25

16

10

16

10

16

10

600 Capacitors, 20 each of 30 values

Tolerance A = 0.05pF

B = 0.1pF

600 Capacitors, 20 each of 30 values

Tolerance A = 0.05pF

B = 0.1pF

600 Capacitors, 20 each of 30 values

Tolerance A = 0.05pF

B = 0.1pF

G = 2ꢀ

®

Accu-P

Designer Kit Type 1400

Designer Kit Type 900

Designer Kit Type 800

®

Order Number: Accu-P 0402KIT02

Order Number: Accu-P 0603KIT01

Order Number: Accu-P 0805KIT02

5

Capacitors

Volts

Tolerance

Volts

Tolerance

Volts

Tolerance

Value pF

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

1.5

1.8

2.0

2.2

2.4

2.7

3.0

3.3

3.9

4.7

5.6

6.8

8.2

10.0

12.0

15.0

18.0

22.0

A

B

G

0.1

A

B

G

J

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.0

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

2.9

3.0

3.1

3.3

3.4

3.6

3.9

4.1

4.3

4.5

4.7

A

B

0.2

0.3

0.4

0.5

0.7

0.8

0.9

1.0

1.2

100

1.5

1.8

2.0

50

2.2

25

2.7

3.3

3.9

4.7

5.6

6.8

8.2

10.0

12.0

15.0

18.0

22.0

27.0

33.0

39.0

47.0

50

25

J

25

J

600 Capacitors, 20 each of 30 values

Tolerance A = 0.05pF

B = 0.1pF

300 Capacitors, 10 each of 30 values

Tolerance A = 0.05pF G = 2ꢀ

B = 0.1pF J = 5ꢀ

600 Capacitors, 20 each of 30 values

Tolerance A = 0.05pF

B = 0.1pF

G = 2ꢀ

73

RF/Microwave Thin-Film Products

Designer Kits (Special Kits Available Upon Request)

®

Accu-P

Designer Kit Type 700

Designer Kit Type 2100

®

Order Number: Accu-P 1210KIT02

Order Number: Accu-P 0402KIT03

Capacitors

Value pF

Capacitors

Value pF

Volts

Tolerance

Volts

Tolerance

1.0

B

G

0.05

0.10

0.15

0.20

0.25

0.30

0.35

0.40

0.45

0.50

0.55

0.60

0.65

0.70

0.75

P

1.5

1.8

2.2

2.7

3.3

4.7

100

5.6

25

6.8

10.0

12.0

18.0

22.0

27.0

33.0

150 Capacitors, 10 each of 15 values

Tolerance B = 0.1pF

G = 2ꢀ

300 Capacitors, 20 each of 15 values

Tolerance P = 0.02pF

®

Accu-P

Designer Kit Type 2200

Designer Kit Type 2000

®

Order Number: Accu-P 0603KIT02

Order Number: Accu-P 0201KIT04

Capacitors

Value pF

Capacitors

Value pF

Volts

Tolerance

Volts

Tolerance

0.05

0.10

0.15

0.20

0.25

0.30

0.35

0.40

0.45

0.50

0.55

0.60

0.65

0.70

0.75

P

0.05

0.10

0.15

0.20

0.25

0.30

0.35

0.40

0.45

0.50

0.55

0.60

0.65

0.70

0.75

P

50

25

5

300 Capacitors, 20 each of 15 values

Tolerance P 0.02pF

300 Capacitors, 20 each of 15 values

Tolerance P 0.02pF

=

®

Accu-L

Designer Kit Type 1600

Designer Kit Type 1100

®

Order Number: Accu-L 0603KIT02

Order Number: Accu-L 0805KIT02

Inductance

Tolerance

Value (nH)

Inductance

Tolerance

Value (nH)

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

10

C

G

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

10.0

12.0

15.0

18.0

22.0

C

D

J

12

15

J

280 Inductors, 20 each of 14 values

Tolerance

C = 0.2nH

G = 2ꢀ

Tolerance

C = 0.2nH

D = 0.5nH

J = 5ꢀ

74

RF/Microwave

MLC’s

AQ Series

CDR Series

Porcelain and Ceramic

RF/Microwave

Multilayer Capacitors

High Voltage RF Power Capacitors

6

75

Microwave MLC’s

AQ Series

These porcelain and ceramic dielectric multilayer

capacitor (MLC) chips are best suited for RF/

Microwave applications typically ranging from 10

MHz to 4.2 GHz. Characteristic is a fine grained,

high density, high purity dielectric material imper-

vious to moisture with heavy internal palladium

electrodes.

L

W

A

L

T

W

1±1J

W

T

L

1R5

T

These characteristics lend well to applications

requiring:

bw

1) high current carrying capabilities;

2) high quality factors;

Approx. L x W x T

L = .±63"/1.6±mm

W = .±32"/.813mm

Approx. L x W x T

L = .±55"/1.4mm

W = .±55"/1.4mm

Approx. L x W x T

L = .11±"/2.8mm

3) very low equivalent series resistance;

4) very high series resonance;

5) excellent stability under stresses of

changing voltage, frequency, time

and temperature.

W = .11±"/2.8mm

T = .1±2"/2.59mm max.

T = .±35"/.889mm max. T = .±57"/1.45mm max.

AQ06

AQ11/12

AQ13/14

MECHANICAL DIMENSIONS: inches (millimeters)

Case

Length (L)

Width (W)

Thickness (T)

Band Width (bw)

.±63±.±±6

(1.6±±.152ꢀ

.±32±.±±6

(.813±.152ꢀ

.±35 Max.

(.889ꢀ

.±14±.±±6

(.357 +.152ꢀ

AQ±6

.±55±.±15

.±2±/.±57

.±1± + .±1± -.±±5

(.254 +.254 -.127ꢀ

AQ11

AQ12

AQ13

AQ14

(1.4±±.381ꢀ

(.5±8/1.45ꢀ

.±55 + .±15 - .±1±

(1.4±+ .381 - .254ꢀ

.±55±.±15

(1.4±±.381ꢀ

.±2±/.±57

(.5±8/1.45ꢀ

.±1± + .±1± -.±±5

(.254 +.254 -.127ꢀ

.11±±.±2±

(2.79±.5±8ꢀ

.11±±.±2±

(2.79±.5±8ꢀ

.±3±/.1±2

(.762/2.59ꢀ

.±15±.±1±

(.381±.254ꢀ

.11± + .±2± - .±1±

(2.79 +.889 -.254ꢀ

.11±±.±1±

(2.79±.5±8ꢀ

.±3±/.1±2

(.762/2.59ꢀ

.±15±.±1±

(.381±.254ꢀ

*For Tape and Reel packaging details see page 88

HOW TO ORDER

AQ

11

E

M

100

J

A

1

ME

6

Case Size

(See Chart)

Capacitance

Failure Rate

Packaging*

Code

3A = 13" Reel

(AQ06 only)

6A = Waffle Pack

(AQ06 only)

ME = 7" Reel

RE = 13" Reel

WE = Waffle Pack

1A = 7" Reel

(AQ06 only)

EIA Capacitance Code in pF.

Code

A = Not

First two digits = significant

figures or “R” for decimal

place.

AVX Style

AQ06, AQ11,

AQ12, AQ13,

AQ14

Voltage

Code

Applicable

5 = 50V

1 = 100V

E = 150V

2 = 200V

V = 250V

9 = 300V

7 = 500V

Third digit = number of zeros

or after “R” significant figures.

Termination

Style Code

1 = Pd/Ag

(AQ11/13 only)

7 = Ag/Ni/Au

(AQ11/13 only)

J = Nickel Barrier

Sn/Pb (60/40) -

(AQ06/12/14

only)

Capacitance

Tolerance Code

A = .05 pF

B = .1 pF

C = .25 pF

D = .5 pF

F = 1ꢀ

Temperature

Coefficient Code

M = +90 20ppm/°C (AQ06/11/12/13/14)

A = 0 30ppm/°C (AQ11/12/13/14)

C = 15ꢀ (“J” Termination only) (AQ12/14)

G = 2ꢀ

J = 5ꢀ

K = 10ꢀ

M = 20ꢀ

N = 30ꢀ

PACKAGING

Standard Packaging = Waffle Pack (for T&R packaging see page 88)

AQ11/12 maximum quantity per waffle pack is 100.

AQ13/14 maximum quantity is 80.

76

Microwave MLC’s

AQ Series

ELECTRICAL SPECIFICATIONS

AQ06, AQ11, AQ12, AQ13, AQ14

M & A

C

Temperature Coefficient

(M) +90 20PPM/°C and

15ꢀ

(A) 0 30PPM/°C

0.1 pF to 5100 pF

0.1 pF to 20ꢀ

Capacitance Range

0.001µF to 0.1µF

10ꢀ, 20ꢀ, 30ꢀ

-55°C to +125°C

2.5ꢀ @ 1kHz

Capacitance Tolerance

Operating Temperature

Quality Factor or Dissipation Factor

Insulation Resistance

-55°C + 125°C

Per MIL-PRF-55681/4

Per MIL-PRF-55681

10⁶megohm to 470 pF @ +25°C

10⁵megohm to 470 pF @ +125°C

10⁵megohm above 470 pF @ +25°C

10⁴megohm above 470 pF @ +125°C

10⁴megohm min @ 25°C & R VDC

10³megohm min @ 25°C & R VDC

Aging

None

2.5 x rated voltage

<3ꢀ per decade hour

None

2.5 x rated voltage

Piezoelectric Effects

Dielectric Withstanding Voltage

(for 500V rated 1.5 x rated voltage)

ENVIRONMENTAL CHARACTERISTICS

Will meet or exceed performance characteristics as outlined in MIL-PRF-55681/4.

REQUIREMENT

MIL-STD-202

METHOD

Life

Shock

1±8, Condition F

213, Condition J

2±4, Condition B

1±4, Condition B

1±1, Condition B

2±8

Vibration

Immersion

Salt Spray

Solderability

Thermal Shock

1±7, Condition B

211

Terminal Strength

Temperature Cycling

Moisture Resistance

Barometric Pressure

Resistance to Soldering Heat

1±2, Condition C

1±6

1±5, Condition B

21±, Condition C

6

QUALITY FACTOR vs. FREQUENCY (Typical)

Capacitance

@ 30 MHz

3±±±±

9±±±

@ 150 MHz

@ 500 MHz

@ 1000 MHz

1 pF

4±±±

8±±

4±±

2±±

7±

35±

15±

6±

1± pF

2±±±

3± pF

5±±±

8±±

1±± pF

2±± pF

28±±

4±±

25

15±±

25±

4±

12

CAPACITANCE AND SIZE vs.

SERIES SELF RESONANT FREQUENCY (Typical)

DIMENSIONS: inches (millimeters)

Case

Size (Nominal)

1 pF

10 pF

50 pF

100 pF

.±63 x .±32 x .±35

(1.6± x .813 x .889ꢀ

AQ±6

9.6 GHz

3.2 GHz

1.5 GHz

1.± GHz

.±55 x .±55 x .±57

(1.4± x 1.4± x 1.45ꢀ

AQ11/12

AQ13/14

9.6 GHz

6.4 GHz

3.2 GHz

2.2 GHz

1.5 GHz

1.± GHz

±.7 GHz

.11± x .11± x .1±2

(2.79 x 2.79 x 2.59ꢀ

77

Microwave MLC’s

AQ Series Available Capacitance/Size/WVDC/T.C.

TABLE I: TC: M (+90 20PPM/°C)

CASE SIZE 06, 11, 12, 13 & 14

DIMENSIONS: inches (millimeters)

Case

Length

Width

Thickness

Band Width

Avail. Term.

06

.063 .006 (1.60 .152)

.055 .015 (1.40 .381)

.055 .025 (1.40 .635)

.110 .020 (2.79 .508)

.032 .006 (.813 .152)

.055 .015 (1.40 .381)

.110 .020 (2.79 .508)

.035 Max. (.889)

.014 .006 (.357 +.152)

J

1 & 7

J

1 & 7

J

11

12

13

14

.020/.057 (.508/1.45) .010 +.010 -.005 (.254 +.254 -.127)

.030/.102 (.762/2.59)

.015 .010 (.381 .254)

.110 +0.035 -0.020 (2.79 +.889 -.508) .110 .020 (2.79 .508)

Case: AQ11, AQ12

Case: AQ13, AQ14

Case: AQ06

Cap. pF

Cap. Tol.

WVDC Cap. pF

Cap. Tol.

WVDC Cap. pF

Cap. Tol.

WVDC Cap. pF

Cap. Tol.

WVDC

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

B

250

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

B

150

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

B

500

100

110

120

130

150

160

180

200

220

240

F, G, J, K, M

500

300

200

B

B,C

B, C, D

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.0

B, C, D

250

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.0

B, C, D

150

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.0

B, C, D

500

270

300

330

360

390

430

470

510

560

620

F, G, J, K, M

200

150

2.2

2.4

2.7

3.0

3.3

3.6

3.9

4.3

4.7

5.1

B, C, D

250

2.2

2.4

2.7

3.0

3.3

3.6

3.9

4.3

4.7

5.1

B, C, D

150

2.2

2.4

2.7

3.0

3.3

3.6

3.9

4.3

4.7

5.1

B, C, D

500

680

F, G, J, K, M

150

750

820

910

1000

5.6

6.2

6.8

7.5

8.2

B, C, D

250

5.6

6.2

6.8

7.5

8.2

9.1

10

11

12

13

B, C, D

150

5.6

6.2

6.8

7.5

8.2

9.1

10

11

12

13

B, C, D

500

B, C, D

B, C, J, K, M

F, G, J, K, M

B, C, J, K, M

F, G, J, K, M

B, C, J, K, M

F, G, J, K, M

6

9.1

10

11

12

13

15

16

18

20

22

24

27

30

33

36

F, G, J, K, M

250

50

15

16

18

20

22

24

27

30

33

36

F, G, J, K, M

150

15

16

18

20

22

24

27

30

33

36

F, G, J, K, M

500

39

43

47

51

56

62

68

75

82

91

F, G, J, K, M

50

39

43

47

51

56

62

68

75

82

91

F, G, J, K, M

150

39

43

47

51

56

62

68

75

82

91

F, G, J, K, M

500

100

120

F, G, J, K, M

F, G J K M

50

100

F, G, J, K, M

150

78

Microwave MLC’s

AQ Series Available Capacitance/Size/WVDC/T.C.

TABLE II: TC: A (0 30PPM/°C)

CASE SIZE 06, 11, 12, 13 & 14

DIMENSIONS: inches (millimeters)

Case

Length

Width

Thickness

Band Width

Avail. Term.

06

.063 .006 (1.60 .152)

.055 .015 (1.40 .381)

.055 .025 (1.40 .635)

.110 .020 (2.79 .508)

.032 .006 (.813 .152)

.055 .015 (1.40 .381)

.110 .020 (2.79 .508)

.035 Max. (.889)

.014 .006 (.357 +.152)

J

1 & 7

J

1 & 7

J

11

12

13

14

.020/.057 (.508/1.45) .010 +.010 -.005 (.254 +.254 -.127)

.030/.102 (.762/2.59)

.015 .010 (.381 .254)

.110 +0.035 -0.020 (2.79 +.889 -.508) .110 .020 (2.79 .508)

Case: AQ06

Case: AQ11, AQ12

Case: AQ13, AQ14

Cap. pF

Cap. Tol.

WVDC

Cap. pF

Cap. Tol.

WVDC

Cap. pF

Cap. Tol.

WVDC

Cap. pF

Cap. Tol.

WVDC

Cap. pF

Cap. Tol.

WVDC

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

B

500

51

56

62

68

75

82

91

100

110

120

F, G, J, K, M

500

300

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

B

250

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

B

150

24

27

30

33

36

39

43

47

51

56

F, G, J, K, M

150

B,C

B, C, D

B,C

B, C, D

B,C

B, C, D

1.1

1.2

1.3

1.4

1.5

B, C, D

500

130

150

160

180

200

F, G, J, K, M

300

1.1

1.2

1.3

1.4

1.5

B, C, D

250

1.1

1.2

1.3

1.4

1.5

B, C, D

150

62

68

75

82

91

F, G, J, K, M

150

1.6

1.7

1.8

1.9

2.0

B, C, D

500

220

240

270

300

330

F, G, J, K, M

200

1.6

1.7

1.8

1.9

2.0

B, C, D

250

1.6

1.7

1.8

1.9

2.0

B, C, D

150

100

110

120

130

150

F, G, J, K, M

150

50

2.2

2.4

2.7

3.0

3.3

B, C, D

500

360

390

430

470

510

F, G, J, K, M

200

150

2.2

2.4

2.7

3.0

3.3

B, C, D

250

2.2

2.4

2.7

3.0

3.3

B, C, D

150

160

180

200

220

240

F, G, J, K, M

50

3.6

3.9

4.3

4.7

5.1

5.6

6.2

B, C, D

500

560

620

680

750

820

910

1000

1100

1200

1300

1500

1600

1800

2000

2200

F, G, J, K, M

150

50

3.6

3.9

4.3

4.7

5.1

5.6

6.2

B, C, D

250

3.6

3.9

4.3

4.7

5.1

5.6

6.2

6.8

7.5

8.2

B, C, D

B, C, J, K, M 150

F, G, J, K, M 150

150

270

300

330

360

390

430

470

510

560

620

F, G, J, K, M

50

6.8 B, C, J, K, M

7.5 B, C, J, K, M

8.2 B, C, J, K, M

9.1 B, C, J, K, M

10

11

12

13

6.8 B, C, J, K, M 250

7.5 B, C, J, K, M 250

8.2 B, C, J, K, M 250

9.1 B, C, J, K, M 250

10

11

12

13

9.1

680

F, G, J, K, M

F, G, J, K, M 250

10

750

11

820

12

910

13

1000

15

16

18

20

22

24

27

30

33

36

F, G, J, K, M

500

2400

2700

3000

3300

3600

3900

4300

4700

5000

5100

F, G, J, K, M

50

15

16

18

20

22

24

27

30

33

36

F, G, J, K, M 250

15

16

18

20

22

F, G, J, K, M 150

6

F, G, J, K, M 250

F, G, J, K, M

50

39

43

47

F, G, J, K, M

500

39

43

47

51

56

F, G, J, K, M

50

62

68

75

82

91

F, G, J, K, M

50

100

120

F, G, J, K, M

F, G J K M

50

TABLE III: TC: C ( 15ꢀ)

CASE SIZE 12 & 14

Case: AQ12

Case: AQ14

Cap. pF Cap. Tol. WVDC

1000

1200

1500

1800

2000

K, M, N

50

2200 K, M, N

2700 K, M, N

3300 K, M, N

3900 K, M, N

4700 K, M, N

50

5100

5600

6800

8200

10000

K, M, N

50

5000

6800

K, M, N

50

15000 K, M, N

18000 K, M, N

27000 K, M, N

33000 K, M, N

39000 K, M, N

50

47000 K, M, N

68000 K, M, N

50

8200

82000 K, M, N

100000 K, M, N

50

10000

12000

79

Microwave MLC’s

CDR Series — MIL-PRF-55681 (RF/Microwave Chips)

MILITARY DESIGNATION PER MIL-PRF-55681

L

W

A

L

T

W

47±J

T

1±±J

bw

CDR11/12

CDR13/14

CROSS REFERENCE: AVX/MIL-PRF-55681

Per MIL-C-55681

AVX

Length (L)

Width (W)

Thickness (T)

Termination Band (bw)

Style

Max

Min

Max

Min

.±55±.±15

.±57

.±2±

.±±5

CDR11

CDR12

CDR13

CDR14

AQ11

AQ12

AQ13

AQ14

(1.4±±.381ꢀ

(1.45ꢀ

(.5±8ꢀ

(.127ꢀ

.±55±.±25

.±55±.±15

.±57

.±2±

.±±5

(1.4±±.635ꢀ

(1.4±±.381ꢀ

(1.45ꢀ

(.5±8ꢀ

(.127ꢀ

.11±±.±2±

.1±2

.±3±

.±25

.±±5

(2.79±.5±8ꢀ

(2.59ꢀ

(.762ꢀ

(.635ꢀ

(.127ꢀ

.11± +.±35 -±.2±

(2.79 +.889 -.5±8ꢀ

.11±±.±2±

.1±2

.±3±

.±25

.±±5

(2.79±.5±8ꢀ

(2.59ꢀ

(.762ꢀ

(.635ꢀ

(.127ꢀ

HOW TO ORDER

CDR12

BG

101

A

K

U

S

MIL Style

CDR11, CDR12,

CDR13, CDR14

Capacitance

EIA Capacitance Code in pF.

Capacitance

Tolerance Code

B = .1 pF

C = .25 pF

D = .5 pF

F = 1ꢀ

Failure Rate

Level

M = 1.0ꢀ

P = .1ꢀ

First two digits = significant figures

or “R” for decimal place.

R = .01ꢀ

S = .001ꢀ

6

Third digit = number of zeros or

after “R” significant figures.

Termination

Finish (Military

Designations)

Code

G = 2ꢀ

J = 5ꢀ

K = 10ꢀ

M = 20ꢀ

Voltage

Temperature

Limits

Rated Voltage

Code

M = Palladium/Silver

(CDR11 & 13 only)

N = Silver, Nickel, Gold

(CDR11 & 13 only)

S = Solder Coated, Final

(CDR12 & 14 only)

U = Base Metallization, Barrier Metal,

Solder Coated.

(Solder M.P. 200°C or less)

(CDR12 & 14 only)

W = Base Metallization, Barrier Metal,

Tinned (Tin or Tin/Lead Alloy)

(CDR12 & 14 only)

A = 50V

B = 100V

C = 200V

D = 300V

E = 500V

BG = +90 20 ppm/°C

with and without

rated voltage from

-55°C to + 125°C

BP = 0 30ppm/°C

with and without

rated voltage from

-55°C to +125°C

Y = 100ꢀ Tin

Z = Base Metallization, Barrier Metal

(TIn Lead Alloy With 4ꢀ Lead Min.)

PACKAGING

Standard Packaging = Waffle Pack (for T&R packaging see page 88)

AQ11/12 maximum quantity per waffle pack is 100.

AQ13/14 maximum quantity is 80.

8±

Microwave MLC’s

CDR Series — MIL-PRF-55681 (RF/Microwave Chips)

TABLE I: STYLES CDR11 AND CDR12 CAPACITOR CHARACTERISTICS

Type

Rated temperature

Type

Rated temperature

Designation Capacitance Capacitance

and

WVDC

Designation Capacitance Capacitance

and

WVDC

1/

in pF

tolerance

V/Temperature

1/

in pF

tolerance

V/Temperature

CDR1 -B-±R1AB--

CDR1 -B-±R2AB--

CDR1 -B-±R3A---

CDR1 -B-±R4A---

CDR1 -B-±R5A---

CDR1 -B-±R6A---

CDR1 -B-±R7A---

CDR1 -B-±R8A---

CDR1 -B-±R9A---

CDR1 -B-1R±A---

CDR1 -B-1R1A---

CDR1 -B-1R2A---

CDR1 -B-1R3A---

CDR1 -B-1R4A---

CDR1 -B-1R5A---

CDR1 -B-1R6A---

CDR1 -B-1R7A---

CDR1 -B-1R8A---

CDR1 -B-1R9A---

CDR1 -B-2R±A---

CDR1 -B-2R1A---

CDR1 -B-2R2A---

CDR1 -B-2R4A---

CDR1 -B-2R7A---

CDR1 -B-3R±A---

CDR1 -B-3R3A---

CDR1 -B-3R6A---

CDR1 -B-3R9A---

CDR1 -B-4R3A---

CDR1 -B-4R7A---

CDR1 -B-5R1A---

CDR1 -B-5R6A---

CDR1 -B-6R2A---

CDR1 -B-6R8A---

CDR1 -B-7R5A---

CDR1 -B-8R2A---

CDR1 -B-9R1A---

CDR1 -B-1±±A---

CDR1 -B-11±A---

CDR1 -B-12±A---

CDR1 -B-13±A---

CDR1 -B-15±A---

CDR1 -B-16±A---

CDR1 -B-18±A---

CDR1 -B-2±±A---

CDR1 -B-22±A---

CDR1 -B-24±A---

CDR1 -B-27±A---

±.1

±.2

±.3

±.4

±.5

±.6

±.7

±.8

±.9

1.±

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.±

2.1

2.2

2.4

2.7

3.±

3.3

3.6

3.9

4.3

4.7

5.1

5.6

6.2

6.8

7.5

8.2

9.1

1±

B

B, C

B, C, D

BG, BP

5±

CDR1 -B-3±±A---

CDR1 -B-33±A---

CDR1 -B-36±A---

CDR1 -B-39±A---

CDR1 -B-43±A---

CDR1 -B-47±A---

CDR1 -B-51±A---

CDR1 -B-56±A---

CDR1 -B-62±A---

CDR1 -B-68±A---

CDR1 -B-75±A---

CDR1 -B-82±A---

CDR1 -B-91±A---

CDR1 -B-1±1A---

CDR1 -B-111A---

CDR1 -B-121A---

CDR1 -B-131A---

CDR1 -B-151A---

CDR1 -B-161A---

CDR1 -B-181A---

CDR1 -B-2±1A---

CDR1 -B-221A---

CDR1 -B-241A---

CDR1 -B-271A---

CDR1 -B-3±1A---

CDR1 -B-331A---

CDR1 -B-361A---

CDR1 -B-391A---

CDR1 -B-431A---

CDR1 -B-471A---

CDR1 -B-511A---

CDR1 -B-561A---

CDR1 -B-621A---

CDR1 -B-681A---

CDR1 -B-751A---

CDR1 -B-821A---

CDR1 -B-911A---

CDR1 -B-1±2A---

3±

33

36

39

43

47

51

56

62

68

75

82

91

1±±

11±

12±

13±

15±

16±

18±

2±±

22±

24±

27±

3±±

33±

36±

39±

43±

47±

51±

56±

62±

68±

75±

82±

91±

F, G, J, K, M

BG, BP

BP

5±

B, C, D

B, C, J, K, M

F, G, J, K, M

1±±±

11

12

13

15

16

18

2±

22

1/Complete type designation will include additional symbols to indicate style,

voltage-temperature limits, capacitance tolerance (where applicableꢀ, termina-

tion finish (“M” or “N” for style CDR11, and “S”, “U” or “W” for style CDR12ꢀ

and failure rate level.

24

27

6

81

Microwave MLC’s

CDR Series — MIL-PRF-55681 (RF/Microwave Chips)

TABLE II: STYLES CDR13 AND CDR14 CAPACITOR CHARACTERISTICS

Type

Rated temperature

Type

Rated temperature

Designation Capacitance Capacitance

and

WVDC

Designation Capacitance Capacitance

and

WVDC

1/

in pF

tolerance

V/Temperature

1/

in pF

tolerance

V/Temperature

CDR1 -B-±R1*B--

CDR1 -B-±R2*B--

CDR1 -B-±R3*---

CDR1 -B-±R4*---

CDR1 -B-±R5*---

CDR1 -B-±R6*---

CDR1 -B-±R7*--

CDR1 -B-±R8*---

CDR1 -B-±R9*---

CDR1 -B-1R±*---

CDR1 -B-1R1*---

CDR1 -B-1R2*---

CDR1 -B-1R3*---

CDR1 -B-1R4*---

CDR1 -B-1R5*---

CDR1 -B-1R6*---

CDR1 -B-1R7*---

CDR1 -B-1R8*---

CDR1 -B-1R9*---

CDR1 -B-2R±*---

CDR1 -B-2R1*---

CDR1 -B-2R2*--

CDR1 -B-2R4*---

CDR1 -B-2R7*---

CDR1 -B-3R±*---

CDR1 -B-3R3*---

CDR1 -B-3R6*---

CDR1 -B-3R9*---

CDR1 -B-4R3*---

CDR1 -B-4R7*---

CDR1 -B-5R1*---

CDR1 -B-5R6*---

CDR1 -B-6R2*---

CDR1 -B-6R8*---

CDR1 -B-7R5*---

CDR1 -B-8R2*---

CDR1 -B-9R1*---

CDR1 -B-1±±*---

CDR1 -B-11±*---

CDR1 -B-12±*---

CDR1 -B-13±*---

CDR1 -B-15±*---

CDR1 -B-16±*---

CDR1 -B-18±*---

CDR1 -B-2±±*---

CDR1 -B-22±*---

CDR1 -B-24±*---

CDR1 -B-27±*---

CDR1 -B-3±±*---

CDR1 -B-33±*---

CDR1 -B-36±*---

CDR1 -B-39±*---

CDR1 -B-43±*---

CDR1 -B-47±*---

CDR1 -B-51±*---

±.1

±.2

±.3

±.4

±.5

±.6

±.7

±.8

±.9

1.±

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.±

2.1

2.2

2.4

2.7

3.±

3.3

3.6

3.9

4.3

4.7

5.1

5.6

6.2

6.8

7.5

8.2

9.1

1±

11

12

13

15

16

18

2±

22

24

27

3±

33

36

39

43

47

B

B, C

B, C, D

BG, BP

2±±/5±±

CDR1 -B-56±*---

CDR1 -B-62±*---

CDR1 -B-68±*---

CDR1 -B-75±*---

CDR1 -B-82±*---

CDR1 -B-91±*---

CDR1 -B-1±1*---

CDR1 -B-111‡---

CDR1 -B-121‡---

CDR1 -B-131‡---

CDR1 -B-151‡---

CDR1 -B-161‡---

CDR1 -B-181‡---

CDR1 -B-2±1‡---

CDR1 -B-221C---

CDR1 -B-241C---

CDR1 -B-271C---

CDR1 -B-3±1C---

CDR1 -B-331C---

CDR1 -B-361C---

CDR1 -B-391C---

CDR1 -B-431C---

CDR1 -B-471C---

CDR1 -B-511B---

CDR1 -B-561B---

CDR1 -B-621B---

CDR1 -B-681A---

CDR1 -B-751A---

CDR1 -B-821A---

CDR1 -B-911A---

CDR1 -B-1±2A---

CDR1 -B-112A---

CDR1 -B-122A---

CDR1 -B-132A---

CDR1 -B-152A---

CDR1 -B-162A---

CDR1 -B-182A---

CDR1 -B-2±2A---

CDR1 -B-222A---

CDR1 -B-242A---

CDR1 -B-272A---

CDR1 -B-3±2A---

CDR1 -B-332A---

CDR1 -B-362A---

CDR1 -B-392A---

CDR1 -B-432A---

CDR1 -B-472A---

CDR1 -B-5±2A---

CDR1 -B-512A---

56

62

68

75

82

F, G, J, K, M

BG, BP

BP

2±±/5±±

2±±/3±±

2±±

1±±

5±

91

1±±

11±

12±

13±

15±

16±

18±

2±±

22±

24±

27±

3±±

33±

36±

39±

43±

47±

51±

56±

62±

68±

75±

82±

91±

1±±±

11±±

12±±

13±±

15±±

16±±

18±±

2±±±

22±±

24±±

27±±

3±±±

33±±

36±±

39±±

43±±

47±±

5±±±

51±±

B, C, D

B, C, J, K, M

F, G, J, K, M

5±

BP

1/Complete type designation will include additional symbols to indicate style,

voltage-temperature limits, capacitance tolerance (where applicableꢀ, termina-

tion finish (“M” or “N” for style CDR13, and “S”, “U” or “W” for style CDR14ꢀ

and failure rate level.

6

51

*C=2±±V; E=5±±V.

‡C=2±±V; D=3±±V.

82

Microwave MLC’s

Performance Curves

TYPICAL Q vs. FREQUENCY

TYPICAL ESR vs. FREQUENCY

AQ11/12

MIL-PRF-55681E - BG

STANDARD - M

MIL-PRF-55681E - BG

STANDARD - M

1±±±±

1

1±±±

Q

ESR (ohmsꢀ ±.1

1±±

±.±1

1±

1±±

1±±±

1±±

1±±±

Frequency (MHzꢀ

AVX CORPORATION

1± Picofarad

1 Picofarad

1± Picofarad

1±± Picofarad

3.3 Picofarad

1±± Picofarad

TYPICAL ESR vs. CAPACITANCE

AQ11/12

TYPICAL Q vs. CAPACITANCE

AQ11/12

MIL-PRF-55681E - BG

STANDARD - M

MIL-PRF-55681E - BG

STANDARD - M

1

1±±±±

1±±±

1±±

6

ESR (ohmsꢀ ±.1

Q

±.±1

1±

1

1±

1±±

1

1±

1±±

Capacitance (pFꢀ

AVX CORPORATION

5±± MHz

AVX CORPORATION

5±± MHz

25± MHz

1±±± MHz

25± MHz

1±±± MHz

83

Microwave MLC’s

Performance Curves

TYPICAL Q vs. FREQUENCY

AQ13/14

TYPICAL ESR vs. FREQUENCY

AQ13/14

MIL-PRF-55681E - BG

STANDARD - M

1±±±±

1

1±±±

Q

ESR (ohmsꢀ ±.1

1±±

±.±1

1±

1±±

1±±±

1±±

1±±±

Frequency (MHzꢀ

AVX CORPORATION

15 Picofarad

1 Picofarad

1± Picofarad

47 Picofarad

33± Picofarad

1 Picofarad

1±± Picofarad

TYPICAL Q vs. CAPACITANCE

AQ13/14

TYPICAL ESR vs. CAPACITANCE

AQ13/14

MIL-PRF-55681E - BG

STANDARD - M

MIL-PRF-55681E - BG

STANDARD - M

1±±±±

1

6

1±±±

1±±

1±

ESR (ohmsꢀ ±.1

Q

±.±1

1

1±

1±±

1

1±

1±±

Capacitance (pFꢀ

AVX CORPORATION

5±± MHz

AVX CORPORATION

5±± MHz

25± MHz

1±±± MHz

25± MHz

1±±± MHz

84

Microwave MLC’s

Performance Curves

TYPICAL ESR vs. FREQUENCY

AQ11/12

TYPICAL Q vs. FREQUENCY

AQ11/12

MIL-PRF-55681E - BP

STANDARD - A

MIL-PRF-55681E - BP

STANDARD - A

1

1±±±±

1±±±

ESR (ohmsꢀ ±.1

Q

1±±

±.±1

1±

1±±

1±±±

1±±

1±±±

Frequency (MHzꢀ

AVX CORPORATION

15 Picofarad

AVX CORPORATION

15 Picofarad

1 Picofarad

1±± Picofarad

1 Picofarad

1±± Picofarad

TYPICAL Q vs. CAPACITANCE

AQ11/12

TYPICAL ESR vs. CAPACITANCE

AQ11/12

MIL-PRF-55681E - BP

STANDARD - A

MIL-PRF-55681E - BP

STANDARD - A

1±±±±

1±±±

1±±

1

6

ESR (ohmsꢀ ±.1

Q

1±

±.±1

1

1±

1±±

1

1±

1±±

Capacitance (pFꢀ

AVX CORPORATION

5±± MHz

AVX CORPORATION

5±± MHz

25± MHz

1±±± MHz

25± MHz

1±±± MHz

85

Microwave MLC’s

Performance Curves

TYPICAL ESR vs. FREQUENCY

AQ13/14

TYPICAL Q vs. FREQUENCY

AQ13/14

MIL-PRF-55681E - BP

STANDARD - A

MIL-PRF-55681E - BP

STANDARD - A

1

1±±±±

1±±±

ESR (ohmsꢀ ±.1

Q

1±±

±.±1

1±

1±±

1±±±

1±±

1±±±

Frequency (MHzꢀ

AVX CORPORATION

47 Picofarad

AVX CORPORATION

15 Picofarad

1±± Picofarad

2 Picofarad

1±± Picofarad

TYPICAL Q vs. CAPACITANCE

AQ13/14

TYPICAL ESR vs. CAPACITANCE

AQ13/14

MIL-PRF-55681E - BP

STANDARD - A

MIL-PRF-55681E - BP

STANDARD - A

1±±±±

1±±±

1±±

1

6

ESR (ohmsꢀ ±.1

Q

1±

±.±1

1

1±

1±±

1

1±

1±±

Capacitance (pFꢀ

AVX CORPORATION

5±± MHz

AVX CORPORATION

5±± MHz

25± MHz

1±±± MHz

25± MHz

1±±± MHz

86

Microwave MLC’s

Performance Curves

6

F r e q u e n c y ( G H z ꢀ

87

Microwave MLC’s

Automatic Insertion Packaging

TAPE & REEL: All tape and reel specifications are in compliance with EIA RS481 (equivalent to IEC 286 part 3ꢀ.

“U” Series - 0603/0805/1210 Size Chips

Sizes AQ11/12 through 13/14, CDR11/12 through 13/14.

—8mm carrier

—7" reel: 0603 & 0805 ≤0.40" thickness = 4000 pcs

0805 . 0.040" thickness & 1210= 2000 pcs

—13" reel: ≤0.075" thickness = 10,000 pcs

—7" reel: ≤0.040" thickness = 2000 pcs

≤0.075" thickness = 2000 pcs

—13" reel: ≤0.075" thickness = 10,000 pcs

REEL DIMENSIONS: millimeters (inches)

Tape

A

B*

C

D*

N

W₂

Max.

W₃

W₁

Size⁽¹⁾Max. Min.

Min. Min.

7.9 Min.

(.311ꢀ

(.567ꢀ 1±.9 Max.

(.429ꢀ

1.±

8mm

8.4 ⁺-±.±

14.4

(.331^+.±6±

ꢀ

-±.±

33±

1.5 13.±±±.2± 2±.2

5±

(12.992ꢀ (.±59ꢀ (.512±.±±8ꢀ (.795ꢀ (1.969ꢀ

11.9 Min.

(.469ꢀ

ꢀ (.724ꢀ 15.4 Max.

(.6±7ꢀ

12mm

12.4 ⁺-±^2..^±±

18.4

+.±76

-±.±

(.488

Metric dimensions will govern.

English measurements rounded and for reference only.

(1ꢀ For tape sizes 16mm and 24mm (used with chip size 364±ꢀ consult EIA RS-481 latest revision.

EMBOSSED CARRIER CONFIGURATION

8 & 12 MM TAPE ONLY

CONSTANT DIMENSIONS

Tape

Size

8mm

and

D0

E

P0

P2

T

T1

G1

G2

Max.

8.4 -⁺±^±.^.±^1±

1.75 ± ±.1±

4.± ± ±.1±

2.± ± ±.±5

±.6±± ±.1± ±.75 ±.75

(.±59 ^+.±±4

ꢀ

(.±69 ± .±±4ꢀ (.157 ± .±±4ꢀ (.±79 ± .±±2ꢀ (.±24ꢀ (.±±4ꢀ (.±3±ꢀ (.±3±ꢀ

Max. Min. Min.

-±.±

12mm

See

Note 3 Note 4

VARIABLE DIMENSIONS

Tape Size

B1

D1

F

P1

R

T2

W

A0B0K0

Max.

Min.

See Note 6

See Note 5

See Note 2

8.± ⁺-±^±.^.1³

6

4.55

(.179ꢀ

1.±

(.±39ꢀ

3.5 ± ±.±5

(.138 ± .±±2ꢀ

5.5 ± ±.±5

(.217 ± .±±2ꢀ

4.± ± ±.1±

(.157 ± .±±4ꢀ

4.± ± ±.1±

(.157 ± .±±4ꢀ

25

(.984ꢀ

3±

(1.181ꢀ

2.5 Max

(.±98ꢀ

6.5 Max

(.256ꢀ

8mm

See Note 1

(.315 ^+.±12

_-.±±4ꢀ

8.2

(.323ꢀ

1.5

(.±59ꢀ

12.± ± .3±

(.472 ± .±12ꢀ

12mm

NOTES:

3. G dimension is the flat area from the edge of the sprocket hole to either the

outward deformation of the carrier tape between the embossed cavities or to

the edge of the cavity whichever is less.

1

1.

A

0,

B

0, and K are determined by the max. dimensions to the ends of the

0

terminals extending from the component body and/or the body dimensions of

the component. The clearance between the end of the terminals or body of the

component to the sides and depth of the cavity (A^0,

B

0, and K ) must be within

0

4. G dimension is the flat area from the edge of the carrier tape opposite the

sprocket holes to either the outward deformation of the carrier tape between the

embossed cavity or to the edge of the cavity whichever is less.

2

0.05 mm (.002) min. and 0.50 mm (.020) max. The clearance allowed must also

prevent rotation of the component within the cavity of not more than 20 degrees

(see sketches C & D).

5. The embossment hole location shall be measured from the sprocket hole

controlling the location of the embossment. Dimensions of embossment

location and hole location shall be applied independent of each other.

2. Tape with components shall pass around radius “R” without damage. The

minimum trailer length (Note 2 Fig. 3) may require additional length to provide R

min. for 12mm embossed tape for reels with hub diameters approaching N min.

(Table 4).

6. B dimension is a reference dimension for tape feeder clearance only.

1

88

®

Hi-Q High RF Power

MLC Surface Mount Capacitors

For 600V to 4000V Application

PRODUCT OFFERING

®

Hi-Q , high RF power, surface mount MLC capacitors from AVX

Corporation are characterized with ultra-low ESR and dissipation factor

at high frequencies. They are designed to handle high power and

high voltage levels for applications in RF power amplifiers, inductive

heating, high magnetic field environments (MRI coils), medical and

industrial electronics.

HOW TO ORDER

HQCC

A

271

J

A

T

1

A

AVX

Voltage Temperature Capacitance Code

Capacitance

Tolerance

F = 1ꢀ

G = 2ꢀ

J = 5ꢀ

K = 10ꢀ

M = 20ꢀ

Test

Termination

Packaging

1 = 7" Reel

3 = 13" Reel

9 = Bulk

Special

Code

A = Standard

Style

600V = C Coefficient

(2 significant digits

+ no. of zeros)

Examples:

Level

1 = Pd/Ag

HQCC 1000V = A

HQCE 1500V = S

2000V = G

C0G = A

A = Standard T = Solderable

Plate

10 pF = 100

2500V = W

100 pF = 101

1,000 pF = 102

22,000 pF = 223

3000V = H

4000V = J

DIMENSIONS

millimeters (inches)

HQCE

L

STYLE

HQCC

W

(L) Length

5.84 0.51

9.4 0.51

(0.230 0.020)

(0.370 0.020)

(W) Width

6.35 0.51

(0.250 0.020)

9.9 0.51

(0.390 0.020)

T

(T) Thickness

Max.

3.3 max.

(0.130 max.)

3.3 max.

(0.130 max.)

(t) terminal

0.64 0.38

(0.025 0.015)

0.64 0.38

(0.025 0.015)

t

DIELECTRIC PERFORMANCE CHARACTERISTICS

6

Capacitance Range

10pF to 6,800pF

(25°C, 1.0 0.2 Vrms at 1kHz, for ≤ 1000 pF use 1MHz)

1ꢀ, 2ꢀ, 5ꢀ, 10ꢀ, 20ꢀ

0.1ꢀ Max (+25°C, 1.0 0.2 Vrms at 1kHz, for ≤ 1000 pF use 1MHz)

-55°C to +125°C

C0G: 0 30 ppm/°C (-55°C to +125°C)

600, 1000, 1500, 2000, 2500, 3000, 4000VDC

100K MΩ min. @ +25°C and 500VDC

10K MΩ min. @ +125°C and 500VDC

120ꢀ of rated WVDC

Capacitance Tolerances

Dissipation Factor 25°C

Operating Temperature Range

Temperature Characteristic

Voltage Ratings

Insulation Resistance

Dielectric Strength

HIGH VOLTAGE CAPACITANCE VALUES (pF)

600

1000

WVDC

1500

WVDC

2000

WVDC

min./max.

2500

WVDC

min./max.

3000

WVDC

min./max.

4000

WVDC

min./max.

Style

WDC

min./max.

HQCC

HQCE

2,200 - 2,700

5,600 - 6,800

1,500 - 1,800

3,300 - 4,700

820 - 1,200

470 - 680

330 - 390

10 - 270

470-680

2,200 - 2,700

1,200 - 1,800

820 - 1,000

10-390

89

RF/Microwave

NP0 Capacitors

“U” Series

Ceramic C±G (NP±ꢀ Microwave

Multilayer Capacitors

7

9±

RF/Microwave C0G (NP0) Capacitors

Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors

GENERAL INFORMATION

are met on each value producing lot to lot uniformity.

Sizes available are EIA chip sizes 0603, 0805, and 1210.

“U” Series capacitors are C0G (NP0) chip capacitors spe-

cially designed for “Ultra” low ESR for applications in the

communications market. Max ESR and effective capacitance

DIMENSIONS: inches (millimeters)

0402

0603

0805

1210

A

E

A

E

C

B

C

B

C

D

E

inches (mm)

Size

0402

0603

0805

1210

A

B

C

D

N/A

E

N/A

0.039 0.004 (1.00 0.1)

0.060 0.010 (1.52 0.25) 0.030 0.010 (0.ꢀ6 0.25)

0.0ꢀ9 0.008 (2.01 0.2)

0.126 0.008 (3.2 0.2)

0.020 0.004 (0.50 0.1)

0.024 (0.6) max

0.036 (0.91) max

0.010 0.005 (0.25 0.13)

0.030 (0.ꢀ6) min

0.020 (0.51) min

0.049 0.008 (1.25 0.2)

0.098 0.008 (2.49 0.2)

0.040 0.005 (1.02 0.12ꢀ) 0.020 0.010 (0.51 0.254)

0.050 0.005 (1.2ꢀ 0.12ꢀ) 0.025 0.015 (0.635 0.381) 0.040 (1.02) min

HOW TO ORDER

0805

1

U

100

J

A

T

2

A

Case Size

0402

Dielectric =

Ultra Low

ESR

Capacitance

Tolerance

Code

Termination

T= Plated Ni

and Tin

Special

Code

A = Standard

0603

0805

1210

B = 0.1pF

C = 0.25pF

D = 0.5pF

F = 1%

G = 2%

J = 5%

K = 10%

M = 20%

Voltage

Code

3 = 25V

5 = 50V

1 = 100V

2 = 200V

Failure Rate

Code

Packaging

Code

2 = ꢀ" Reel

4 = 13" Reel

9 = Bulk

A = Not

Capacitance

Applicable

EIA Capacitance Code in pF.

First two digits = significant figures

or “R” for decimal place.

Third digit = number of zeros or

after “R” significant figures.

ELECTRICAL CHARACTERISTICS

Dielectric Working Voltage (DWV):

7

Capacitance Values and Tolerances:

Size 0402 - 0.2 pF to 22 pF @ 1 MHz

Size 0603 - 1.0 pF to 100 pF @ 1 MHz

Size 0805 - 1.6 pF to 160 pF @ 1 MHz

Size 1210 - 2.4 pF to 1000 pF @ 1 MHz

250% of rated WVDC

Equivalent Series Resistance Typical (ESR):

0402 - See Performance Curve, page 92

0603 - See Performance Curve, page 92

0805 - See Performance Curve, page 92

1210 - See Performance Curve, page 92

Temperature Coefficient of Capacitance (TC):

0 30 ppm/ꢁC (-55ꢁ to +125ꢁC)

Marking: Laser marking EIA J marking standard

(except 0603) (capacitance code and

tolerance upon request).

Insulation Resistance (IR):

10¹²Ω min. @ 25ꢁC and rated WVDC

10¹¹Ω min. @ 125ꢁC and rated WVDC

Working Voltage (WVDC):

MILITARY SPECIFICATIONS

Size

Working Voltage

Meets or exceeds the requirements of MIL-C-55681

0402 - 50, 25 WVDC

0603 - 200, 100, 50 WVDC

0805 - 200, 100 WVDC

1210 - 200, 100 WVDC

91

RF/Microwave C0G (NP0) Capacitors

Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors

CAPACITANCE RANGE

Size

Cap (pF) Tolerance 0402 0603 0805 1210

Size

Cap (pF) Tolerance 0402 0603 0805 1210

Size

Cap (pF) Tolerance 0402 0603 0805 1210

Available

Cap (pF) Tolerance 0402 0603 0805 1210

7.5

8.2

9.1

10

11

12

13

15

18

20

22

24

27

30

33

36

39

43

47

51

56

68

75

82

91

B,C,J,K,M 50V 200V 200V 200V

100

110

120

130

140

150

160

180

200

220

270

300

330

360

390

430

470

510

560

620

680

750

820

910

F,G,J,K,M N/A 100V 200V 200V

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

B,C

50V N/A N/A N/A

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.0

2.1

2.2

2.4

2.7

3.0

3.3

3.6

3.9

4.3

4.7

5.1

5.6

6.2

6.8

B,C,D

50V 200V 200V 200V

ꢀ

50V

ꢀ

B,C,J,K,M

F,G,J,K,M

200V

B,C

ꢀ

100V

B,C,D

ꢀ

50V

ꢀ

N/A 100V

N/A

ꢀ

B,C,D

ꢀ

100

ꢀ

50V

N/A

ꢀ

100

ꢀ

B,C,D

B,C,J,K,M

ꢀ

F,G,J,K,M

1000 F,G,J,K,M

ULTRA LOW ESR, “U” SERIES

TYPICAL ESR vs. FREQUENCY

0402 “U” SERIES

TYPICAL ESR vs. FREQUENCY

0603 “U” SERIES

1

10 pF

15 pF

3.3 pF

3.9 pF

4.7 pF

5.1 pF

6.8 pF

10.0 pF

15.0 pF

0.1

0.01

2500

0

500

1000

Frequency (MHz)

2000

500

1000

Frequency (MHz)

2000

1500

TYPICAL ESR vs. FREQUENCY

1210 “U” SERIES

TYPICAL ESR vs. FREQUENCY

0805 “U” SERIES

7

1

100 pF

10.0 pF

10 pF

100 pF

0.1

300 pF

0.01

2500

0

500

1000

2000

500

1000

Frequency (MHz)

2000

1500

Frequency (MHz)

ESR Measured on the Boonton 34A

92

RF/Microwave C0G (NP0) Capacitors

Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors

7

F r e q u e n c y ( G H z )

93

RF/Microwave

AQ 12 & 14 and “U” Series

Designer Kits

8

94

Designer Kits

Tuning Kits: AQ12/AQ14 Series

TUNING KITS

Solder Plated, Nickel Barrier

Porcelain (+90)

Ceramic (NP0)

AQ12

Kit 1500 UZ

AQ14

Kit 2500 UZ

AQ12

Kit 1501 UZ

AQ14

Kit 2501 UZ

Capacitor

Value pF

Capacitor

Value pF

Capacitor

Value pF

Capacitor

Value pF

Tolerance*

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.0

2.1

2.2

2.4

2.7

3.0

3.3

3.6

3.9

4.3

4.7

5.1

5.6

6.2

6.8

7.5

8.2

9.1

10.0

B

C

J

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.0

2.1

2.2

2.4

2.7

3.0

3.3

3.6

3.9

4.3

4.7

5.1

5.6

6.2

6.8

7.5

8.2

9.1

10.0

B

C

J

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.0

2.1

2.2

2.4

2.7

3.0

3.3

3.6

3.9

4.3

4.7

5.1

5.6

6.2

6.8

7.5

8.2

9.1

10.0

B

C

J

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.0

2.1

2.2

2.4

2.7

3.0

3.3

3.6

3.9

4.3

4.7

5.1

5.6

6.2

6.8

7.5

8.2

9.1

10.0

B

C

J

38± Capacitors 1± each of 38 values. All chips are laser marked.

*Tolerance: B =±±.1pF, C =±±.25pF, J =±5ꢁ.

8

95

Designer Kits

Evaluation Kits: AQ12/AQ14 Series

EVALUATION KITS

Solder Plated, Nickel Barrier

Porcelain (+90)

Ceramic (NP0)

AQ12

AQ14

AQ12

AQ14

Kit 1000 UZ

Kit 2000 UZ

Kit 1001 UZ

Kit 2001 UZ

Capacitor

Value pF

Tolerance*

Value pF

Tolerance*

Value pF

Tolerance*

Value pF

Tolerance*

.5

B

C

J

1.0

B

C

J

.5

B

C

J

1.0

B

C

J

1.0

1.2

1.0

1.5

1.2

1.5

1.8

1.5

1.8

2.0

1.8

2.0

2.2

2.0

2.2

2.4

2.2

2.4

2.7

2.4

2.7

3.0

2.7

3.0

3.3

3.0

3.3

3.6

3.3

3.6

3.9

3.6

3.9

4.3

3.9

4.3

4.7

4.3

4.7

5.1

4.7

5.1

6.8

5.6

6.8

5.6

8.2

J

6.2

8.2

J

6.2

10.0

12.0

15.0

22.0

27.0

33.0

39.0

47.0

56.0

68.0

82.0

100.0

470.0

1000.0

J

6.8

10.0

12.0

15.0

18.0

22.0

27.0

33.0

39.0

47.0

56.0

68.0

82.0

100.0

J

6.8

J

8.2

J

8.2

J

10.0

12.0

15.0

22.0

27.0

33.0

39.0

47.0

56.0

68.0

82.0

100.0

120.0

150.0

180.0

220.0

240.0

270.0

330.0

390.0

470.0

560.0

680.0

820.0

1000.0

2700.0

5100.0

J

10.0

12.0

15.0

18.0

22.0

27.0

33.0

39.0

47.0

56.0

68.0

82.0

100.0

120.0

150.0

180.0

220.0

240.0

270.0

330.0

390.0

470.0

560.0

680.0

820.0

1000.0

J

3±± Capacitors 1± each of 3± values.

All chips are laser marked.

3±± Capacitors 1± each of 3± values.

All chips are laser marked.

J

*Tolerance: B = ±±.1 pF, C = ±±.25

pF, J = ±5ꢁ.

*Tolerance: B = ±±.1 pF, C = ±±.25

pF, J = ±5ꢁ.

J

K

J

K

45± Capacitors 1± each of 45 values.

All chips are laser marked.

45± Capacitors 1± each of 45 values.

All chips are laser marked.

*Tolerance: B = ±±.1 pF, C = ±±.25

pF, J = ±5ꢁ, K = ±1±ꢁ

*Tolerance: B = ±±.1 pF, C = ±±.25

pF, J = ±5ꢁ, K = ±1±ꢁ

NOTE: Order by Kit Number

Example: Kit 1±±± UZ

8

96

Designer Kits

Communication Kits “U” Series

“U” SERIES KITS

Solder Plated, Nickel Barrier

0402

0603

Kit 5000 UZ*

Kit 4000 UZ**

Cap.

Value

pF

Cap.

Tol.† Value

pF

Cap.

Value

pF

Cap.

Tol.† Value

pF

Tol.†

0.5

1.0

1.5

1.8

2.2

2.4

3.0

3.6

B

4.7

5.6

6.8

B

J

1.0

1.2

1.5

1.8

2.0

2.4

2.7

3.0

3.3

3.9

4.7

5.6

.25pF

6.8

7.5

8.2

.25pF

5ꢀ

8.2

10.0

12.0

15.0

18.0

22.0

27.0

33.0

39.0

47.0

10.0

12.0

15.0

* 150 Capacitors 10 each of 15 values.

5ꢀ

** 240 Capacitors 10 each of 24 values.

0805

1210

Kit 3000 UZ***

Kit 3500 UZ***

Cap.

Value

pF

Cap.

Tol.† Value

pF

Cap.

Value

pF

Cap.

Value

pF

Cap.

Tol.† Value

pF

Cap.

Value

pF

Tol.†

1.0

1.5

2.2

2.4

2.7

3.0

3.3

3.9

4.7

5.6

C

7.5

8.2

9.1

10.0

12.0

15.0

18.0

22.0

24.0

27.0

C

J

33

36

39

47

56

68

82

100

130

160

J

2.2

2.7

4.7

5.1

6.8

8.2

9.1

10

C

J

18

20

24

27

30

36

39

47

51

56

J

68

82

J

100

120

130

240

300

390

470

680

13

15

J

*** 300 Capacitors 10 each of 30 values.

†Tolerance – B = 0.1pꢀ

C = 0.25pꢀ

J = 5ꢁ

8

97

Introduction

to

Microwave Capacitors

9

98

Introduction to

Microwave Capacitors

Microwave Capacitors in MICs

The top side of the capacitor should be completely metal-

lized so that the bond wire from the FET to the edge of the

capacitor is minimized.

Typical Microwave Circuit Applications

Microwave MLC, SLC, or Thin-Film capacitor applications in

MIC circuits can be grouped into the following categories:

The height of the capacitor must be less than or equal to the

height of the FET, usually about 0.005 inches. If the capaci-

tor is higher than the FET, the capacitor will interfere with the

bonding tool when wire bonding to the FET.

• DC Block (in series with an MIC transmission line)

• RF Bypass (in shunt with transmission lines)

• Source Bypass (in shunt with active device)

• Impedance Matching

Impedance Matching

The impedance matching application is to use the chip

capacitor to provide the required reactance at a specific

point in the circuit.

This chapter discusses these applications and the perfor-

mance parameters of microwave capacitors affecting these

applications.

This is usually the most critical application in terms of the

capacitor maintaining a tight tolerance over temperature and

from unit-to-unit.

DC Block

In the DC block application, the chip capacitor is placed in

series with the transmission line to prevent the DC voltage

from one circuit from affecting another circuit.

The other applications only require that the capacitance for

the DC block and RF bypass maintains a low reactance and

the tolerance can be as much as 50ꢀ. Whereas the imped-

ance matching function often requires 1ꢀ tolerance.

The capacitance is chosen so that the reactance is only a

fraction of an ohm at the lowest microwave frequency of

interest.

In general, microwave capacitors should have the following

properties:

The largest value capacitor is used as long as the self-resonant

frequency is still much higher than the highest frequency of

interest.

• Low-loss

• Operate very much below the self-resonant frequency

RF Bypass

• The power handling capability should be commensurate

with the expected power performance of the circuit

The RF bypass application is used to effectively short out the

RF to ground. The capacitor value is also picked to be as

large as possible without approaching the self-resonance of

the capacitor.

• Capable of wire bonding and gap welding

• Low variation of capacitance over temperature

• Low unit-to-unit variations in capacitance

• Low dimensional variations from unit-to-unit

Typical SLC applications in MIC circuits are shown in:

Source Bypass

The source bypass application is the same as the RF bypass

except the capacitor is used in conjunction with an active

device.

In this application the chip capacitor is butted up to the

source of the microwave FET device mounted on the MIC

circuit. This is done to minimize the length of the wire bond

from the source of the FET to the capacitor. The shorter the

wire bond, the lower the corresponding inductance.

RF

IN

R

C

D

SIMPLIFIED RF SPECTRUM

5±± MHz

DISTRIBUTED NET

LUMPED NET

C

6± cm

3 GHz

WAVEGUIDE

SYSTEMS

COAXIAL

SYSTEMS

D

C

R

D

RF

OUT

R

1± cm

D

MF. HF

VHF

UHF

SHF. EHF

BIAS

Figure 2. Typical MIC Microwave Attenuator Hybrid with SLC’s.

“C” indicates SLC locations.

3± MHz

1± m

3 MHz

1±± m

AM

3±± MHz

1 m

3±± KHz

1 km

3 GHz

1± cm

3± GHz

1 cm

9

FM

SATELLITE

(COMMERCIALꢀ

BROADCAST

Figure 1

99

Introduction to

Microwave Capacitors

Microwave Parameters

Scattering Parameters

return loss can be related to the reflection coefficient and

VSWR:

Generally, transmission and reflections coefficient measure-

ments completely characterize any black box or network.

Transmission and reflections parameters — attenuation

(gain), phase shift, and complex impedance — can be

described in terms of a set of linear parameters called

“scattering” or “s” parameters. Knowing these characteristic

parameters, one can predict the response of cascaded

or parallel networks accurately. Unlike y or h parameters

which require short circuit and open circuit terminations, “s”

parameters are determined with the input and output ports

terminated in the characteristic impedance of the transmis-

sion line which is a much more practical condition to obtain

at RF and microwave frequencies.

Eq. 2. RL (dB) = 10 log (Pinc/Pref)

*

= 20 log (Einc/Eref) = 20 log (1/Rho)

*

Eq. 3. Rho = (VSWR - 1)/(VSWR + 1)

Eq. 4. VSWR = (1 + Rho)/(1 - Rho)

where Rho = reflection coefficient

RL = return loss

Pinc = power incident

Pref = power reflected

Einc = voltage incident

Eref = voltage reflected

VSWR = voltage standing wave ratio

To summarize, “s” parameters are more useful at microwave

frequencies because:

By the above equation, when the reflection coefficient is 1,

the return loss is zero. In this case, no signal is lost and all

the signal incident upon the discontinuity was returned to the

source. As the reflection coefficient approaches zero, the

return loss approaches infinity. That is, the more perfect the

load, the less the reflection from that load.

1. Equipment to measure total voltage and total currents

at the ports of the networks is not readily available.

2. Short and open circuits are difficult to achieve over a

broad band of frequencies because of lead inductance

and capacitance. Furthermore, these measurements

typically require tuning stubs separately adjusted at

each frequency to reflect short and open circuits to the

device terminals, and this makes the process inconve-

nient and tedious.

The return loss can be improved by an attenuator.

Assume that we connect a perfectly matched 3 dB attenua-

tor into a short circuit as shown in Figure 3.

P_INC

3. Active devices such as transistors and negative resis-

tance diodes are very often not short- or open-circuit

stable.

SHORT CIRCUIT

P_REF

3 dB ATTEN

There are four scattering parameters for a two-port network:

S11, S12, S21, and S22.

P_REF

____

P_INC

= -6 dB

S11 is the reflection coefficient at the input port with the

output port terminated in a 50 ohm load.

Figure 3

The indicated 100 mw is decreased to 50 mw at the output

of the 3 dB attenuator. This 50 mw is reflected from the short

circuit back through the attenuator in the reverse direction

and one-half of this reflected power is lost in the 3 dB atten-

uator. The reflected power at the input is 25 mw. Notice the

return loss is equal to twice the attenuation because it is the

“round trip” loss. This example shows that VSWR is

decreased when attenuation exists on a transmission line

and also that a high VSWR can be decreased by placing an

attenuator in the line.

S12 is the reverse transmission coefficient in a 50 ohm

system.

S21 is the forward transmission coefficient in a 50 ohm

system.

S22 is the reflection coefficient at the output port with the

input port terminated into a 50 ohm load.

The reflection coefficients can be directly related to the

impedance of the device by the equation:

Eq.1. ZIN/ZO = (1 + S11)/(1 - S11)

where ZIN= input impedance

ZO = characteristic impedance of

the transmission line

Mismatch Loss

Mismatch loss is a measure of power loss caused by reflec-

tion. It is the ratio of incident power to the difference between

incident and reflected power and is expressed in dBs as

follows:

This equation also defines the Smith Chart.

Return Loss

Eq. 5. Mismatch loss (dB) = 10 log

*

Return loss is the ratio of the incident power to the reflected

power at a point on the transmission line and is expressed in

decibels. The reflected power from a discontinuity is

expressed as a certain number of decibels below the inci-

dent power upon the discontinuity. It can be shown that

[Pinc/(Pinc - Pref)]

= 10 log

*

[1/(1-Rho = 2)]

9

1±±

Introduction to

Microwave Capacitors

Microwave Parameters

(1)

(2)

(3)

(4)

(5)

(6)

(7)

N

GPC-7

SMA

GPC-7

SWR

AUTOTESTING

SWEEP

GENERATOR

GPC-7

TO SMA

GPC-7

TO SMA

DUT

DET

ATTEN

(8)

SCALAR

ANALYZER

TRANSMISSION

REFLECTION

(1ꢀ Wiltron 6647A 1±MHz - 18GHz sweepers

(2ꢀ Wiltron 56±-97-A5±

Test set-up for:

______________

(3ꢀ OSM 2±82-27±±-±±

(4ꢀ Device under test

(1ꢀ Insertion loss

(2ꢀ VSWR

(5ꢀ OSM 2±82-27±±-±±

(6ꢀ OSM 7±82-6193-1±

(7ꢀ Wiltron 56±-7A5±

Figure 4

The mismatch loss for various values of VSWR is tabulated

as follows:

mismatch losses due to the two VSWRs to a small fraction

of the expected insertion loss of the DUT.

In using the scalar network analyzer it is a temptation to nor-

malize the amplitude response regardless what the actual

response is during calibration. It is advisable to eliminate the

amplitude ripple first before normalizing the scalar analyzer.

One way is to make use of the fact that VSWRs can be

improved by the use of matched attenuators. Often, 10 dB

attenuators are placed before and after the DUT to provide a

minimum of 20 dB return loss which corresponds to source

and load VSWRs of less than 1.20:1. This will reduce the

uncertainties due to mismatch losses to less than 0.02 dB.

Table I

VSWR

1.00

1.20

1.40

1.50

1.70

2.00

2.50

3.00

Mismatch Loss

0.00 dB

0.04 dB

0.12 dB

0.18 dB

0.30 dB

0.51 dB

0.88 dB

1.25 dB

Return Loss Measurement

Insertion Loss Measurement

The return loss is measured by the following method: The

test port is terminated by a short circuit so that all the inci-

dent power is reflected. A detector on the bridge measures

this power and this power is used as the reference for the

incident power. The test port is then terminated by the DUT

and the reflected power now measured. The difference

between the power levels is the return loss.

Insertion loss is measured by the substitution method. The

insertion loss of the measurement system is used as a refer-

ence. Then the DUT (Device Under Test) is inserted into the

setup and the new insertion loss is measured. The difference

between the two losses is the insertion loss of the DUT.

The insertion loss is measured using the test setup as shown

in Figure 5.

SWR BRIDGE

In order to accurately measure the insertion loss, source

VSWR and load VSWR must be extremely Iow. It is assumed

during calibration (loss of the measurement system with

the DUT removed from the test setup) that the VSWR of the

generator and the load does not contribute any mismatch

losses. As discussed in the section on mismatch loss, any

VSWR above 1.2:1 may cause a minimum error of 0.04 dB.

In addition, the two VSWRs may be additive or subtractive

depending on the phasing of the reflections. For example,

source and load VSWRs of 1.2:1 can add to create an error

of 0.08 dB. The mismatches usually exhibit themselves as

amplitude ripple as a function of frequency. It is important

when measuring low insertion losses that precautions are

taken to ensure low source and load VSWRs and to keep the

INCIDENT

POWER

DETECTOR

9

Figure 5. Return Loss Measurement:

Establishing a Reference

1±1

Introduction to

Microwave Capacitors

Microwave Parameters

Note that the insertion loss and return loss can be measured

simultaneously by using the dual trace feature of the Wiltron

Scalar Analyzer. Furthermore, the two measurements can be

done by using a controller such as the HP85 computer for

semi-automatic testing.

SWR BRIDGE

INCIDENT

INPUT

5± OHM

TERMINATION

DUT

REFLECTED

The calibration for 0 dB return loss can be improved by aver-

aging the short circuit and open circuit reflected powers.

Since the phase difference is 180 degrees, the average

closely approximates the actual full reflection.

DETECTOR

Decibels

DUT IN PLACE

The decibel, abbreviated “dB,” is one-tenth of the interna-

tional transmission unit known as the “bel.” The origin of the

bel is the logarithm to the base 10 of the power ratio. It is

the power to which the number 10 must be raised in order

to equal the given number. The number 10 is raised to the

second power, or squared, in order to get 100. Therefore,

the log of 100 is 2.

Figure 6

• All incident power is reflected at the short circuit.

• The detector measures the reflected power.

• An SWR bridge usually has a directivity of 35 to 40 dB.

In other words, only a minute fraction of the incident power

reaches the detector (the dotted line path) that is not

reflected off the short circuit.

The decibel is expressed mathematically by the equation:

Eq. 6 dB = 10 * log (P /P )

1

2

• The DUT is substituted for the short circuit and the oppo-

site port is terminated by a matched termination (50 ohms).

P2 = larger power

P1 = lower power

• The reflected power depends on the DUT and is sensed by

the detector.

The use of log tables can be avoided in practical applications

where exact values of the power are not required. One only

needs to know that a factor of 2 is equal to 3 dB and a fac-

tor of 10 is equal to 10 dB and the rest of the conversions

are derived from these two relationships. The use of dBs

reduces multiplication into an addition. For example:

• The return loss is the difference between this reflected

power and that measured with a reference short circuit.

• A significant improvement in calibrating a 0 dB return loss

reference by averaging the short circuit and open circuit

reflected powers.

3dB =

6dB = 2 x 2

2

4

=

• The dotted line in the figure below shows the reflections

due to an open circuit.

9dB = 2 x 2 x 2 =

10dB =

20dB =

8

10

100

• The solid line in the figure below shows the reflections due

to a short circuit.

The technique is based on the fact that 3, 6, and/or 9 dB

can be added or subtracted (in some combination) to any

decibel value. Adding or subtracting 10 to a decibel value

simply multiplies or divides the number by ten. Examples:

• Since the phase difference between short circuit and open

circuit is 180 degrees.

• By taking the average between these two voltages, the

actual full reflection is very closely approximated.

1. 17dB = 20dB - 3dB

20dB is 10dB + 10dB or is equal to 100.

3dB is equal to 2

AVERAGING THE SHORT CIRCUIT AND OPEN CIRCUIT

REFERENCES FOR HIGHER ACCURACY

Therefore, 20 dB - 3dB = 100/2 = 50

1

A

B

C

B

2. 36dB = 30dB + 6dB

1000 x 4 = 4000

SHORT

1

C

OPEN

±

1

A

Decibel:

E

The decibel is not a unit of power but merely is a logarithmic

expression of a ratio of two numbers. The unit of power may

be expressed in terms of dBm, where “m” is the unit, mean-

ing above or below one milliwatt. Since one mw is neither

above nor below 1 mw, 1 mw= 0 dBm.

ACTUAL

FULL

REFLECTION

f

1

f

2

PREFERRED REFLECTION CALIBRATION

Nepers:

Figure 7

An alternate unit called the neper is defined in terms of the

logarithm to the base “e.” e = 2.718.

9

1 neper = 8.686dB

1dB = 0.1151 neper

1±2

Introduction to

Microwave Capacitors

Electrical Model

Figures 9 and 10 also show the point of series resonance (LS

in series with C), and parallel resonance (LS in parallel with

Capacitance

Microwave chip capacitors, although closely approx-

imating an ideal capacitor, nonetheless also contain

parasitic elements that are important at microwave fre-

quencies. The equivalent circuit is shown below:

CP).

R_Sꢀ QP²

INDUCTIVE

ꢁLS

C

R_S

L_S

R_S

ꢁ_P

Z (ꢁꢀ

ꢁ_S

R_S

1

ꢁC

___

1

ꢁCP

___

C_P

CAPACITIVE

Figure 8. Equivalent Circuit of a

Microwave Capacitor

R_Sꢀ QP²

where, C = desired capacitance

L_S= parasitic series inductance

R_S= series resistance

Figure 9. SLC Impedance Magnitude vs. Frequency

SERIES RESONANCE

j5±

j1±±

j25

j15±

C_P= parasitic parallel capacitance,

j1±

j25±

Rp, the parallel resistance is not shown as it is of concern

only at dc and low frequencies.

PARALLEL

RESONANCE

25

1±

5±

1±± 15± 25± 5±±

±

The primary capacitance, C, is typically determined by mea-

surement at 1 MHz where the effects of Rs, Ls, and Cp

become negligible compared to the reactance of C. The

value of C determined at this low frequency is also valid

at microwave frequencies when the dielectric constant has

a very low variation versus frequency, as is typical in the

modern dielectrics employed in microwave capacitors.

-j1±

-j25±

-j15±

-j1±±

-j25

-j5±

COORDINATES IN OHMS

FREQUENCY IN GHz

The equivalent impedance of the capacitor at any frequency is:

Figure 10. SLC Impedance on Smith Chart

1

Eq. 7. Zs =

Because there is always some parasitic inductance associat-

ed with capacitors, there will be a frequency at which the

inductive reactance will equal that of the capacitor. This is

known as the series resonant frequency (SRF). At the SRF,

the capacitor will appear as a small resistor (RS). The trans-

mission loss through a series mounted capacitor at its series

resonant frequency will be low.

sCp +

1/s

Cs

Rs + sLs +

where s = j2ꢀf, f = frequency

Series and Parallel Resonance

At frequencies above the SRF, the capacitor begins to act

like an inductor.

Ideally, the impedance magnitude of a series mounted

capacitor will vary monotonically from infinite at dc to zero at

infinite frequency. However, the parasitics associated with

any capacitor result in a nonideal response.

When used as a DC block, the capacitor will begin to exhib-

it gradually higher insertion loss above the SRF. In other

words, the capacitor will cause a high frequency rolloff of its

transmission amplitude response.

Figure 9 shows the magnitude, :Z (F):, as a function of

frequency.

When used as an RF bypass, as for the source of an FET, the

inductance will cause the FET to become unstable which can

cause oscillations or undesirable effects on the gain

response of the FET amplifier.

Figure 10 shows Z(f) on the Smith Chart, which includes

magnitude and phase.

Eq. 8. In general, an impedance is represented by Z=R + j X.

The Smith Chart maps the entire impedance half plane for

R > 0 into the interior of a unit circle. The Smith Chart is a

mapping of the reflection coefficient, S11, of an impedance.

S11 = (Z- ZO) / (Z + ZO). ZO is a reference impedance, typ-

ically 50 ohms, and is in the center of the chart. The central

horizontal axis is for X = O, with R < 50 to the left of center,

and R > 50 to the right of center.

Beyond the SRF, there is a frequency called the parallel

resonant frequency (PRF). This occurs when the reactance of

the series inductor equals that of the parallel capacitor.

9

1±3

Introduction to

Microwave Capacitors

Electrical Model

At this parallel resonant frequency, the capacitor will appear

as a large resister whose value is RPRF defined as:

Equivalent Series Resistance

The equivalent series resistance is the RS in the electrical

model. At the SRF, the ESR can be readily determined on the

Smith Chart display of the capacitor’s impedance. However,

the ESR is not necessarily constant with frequency and its

value is typically determined by an insertion loss measure-

ment of the capacitor at the desired frequency.

Eq. 9. RPRF = Rs x Q

P

X QP; where,

Q_P= 1/R

S

WP/CP

WP = 2ꢀfPRF

The parasitic parallel capacitance is usually very small which

results in a parallel resonant frequency that is much higher

than the series resonance.

The insertion loss is a combination of reflective and absorp-

tive components. The absorptive component is the part

associated with the value of the ESR (i.e., the loss in RS).

Because of the low values of ESR in microwave capacitors

(on the order of 0.01 ohm), the insertion loss measurement

is very difficult to make, but can be made with a test fixture

similar to that shown in Figure 11, but with the input and out-

put 50 ohm impedances transformed down to some more

convenient impedance level, Rref, to obtain a more accurate

measurement.

For capacitor usage in RF impedance matching and tuning

applications, the maximum practical frequency for use is up

to 0.5 times the SRF.

For DC filtering and RF shorting applications, best perfor-

mance is obtained near the SRF.

At frequencies above the SRF, but below the PRF, the SLC

can be used as a low loss inductor with a built-in DC block

for bypassing and decoupling.

The series resonant frequency (SRF) of an SLC can be

measured by mounting the capacitor in series on a 50 ohm

transmission line as shown in Figure 11.

When used as a DC block in the transmission line test fixture,

the forward transmission coefficient, S21, and the input

reflection coefficient, S11, can be measured to determine:

CHIP CAPACITOR

Eq. 10. Dissipative Loss.

DL=(1-:S11:^2)/(:S21:^2)

Eq. 11. Reflection Loss.

RL=(1-:S11:^2) where S11 and S21 are expressed

as complex phasors.

From the dissipative loss, DL, the ESR can be determined

as:

5± ohm

LINE

5± ohm

LINE

Eq. 12. ESR = Rref * [1 - SQRT(DL)]/[1 + SQRT(DL)]

The ESR typically increases with operating temperature and

self-heating under high power. This increase can be seen

directly in the lab by measuring the insertion loss of the

capacitor as a function of temperature.

A low ESR is especially necessary in SLC’s when used in

series with transistors in low noise amplifiers, high gain

amplifiers, or high power amplifiers. For example, an ESR of

1 ohm in series with a base input impedance of 1 ohm would

result in a serious compromise in ampIifier gain and noise

figure by up to 3 dB.

Figure 11

At its series resonant frequency (SRF), the SLC will appear as

a small resistance. This measurement can be performed with

a vector network analyzer such as the Hewlett Packard

8510. The SRF is at the frequency for which the phase of the

input reflection coefficient, S11, is crossing the real axis on

the Smith Chart at 180 degrees.

Power Rating

The RF power rating of chip capacitors is dependent on:

The resonant frequency will be lowered by the inductance

associated with the bonding attachment to the capacitor

(i.e., bonding wires, ribbons, leads, etc.). The actual resonant

frequency of the capacitor by itself can be determined by

taking out the effects of the bonding attachment inductance.

Using the low frequency measurements of the primary

capacitance alone, the inductance of the capacitor can be

derived from the resonant frequency. With AVX SLC’s, the

inductance is low enough so that the practical operating fre-

quencies achieved can be beyond 20 GHz.

• Thermal Breakdown

• Voltage Breakdown

Thermal Breakdown

Thermal breakdown is self-heating caused by RF power dis-

sipated in the capacitor.

If the resultant heat generated is greater than what can be

conducted away through the leads or other means of heat

sinking, the capacitor temperature will rise.

9

1±4

Introduction to

Microwave Capacitors

Electrical Model

As the capacitor temperature increases, the dissipation fac-

tor and ESR of the capacitor also increase which creates a

thermal runaway situation.

Dielectric Constant Measurement at

Microwave Frequencies

The measurement of dielectric constants at low frequencies

is easily done by measuring the capacitance of a substrate

of known dimensions and calculating the dielectric constant.

The small signal insertion loss is used to determine the per-

centage of power which is dissipated in the capacitor.

For instance, if the insertion loss is:

The resonance method is used in measuring dielectric

constants at microwave frequencies of metallized ceramic

substrates. This is based on the model of the high dielectric

constant substrate as a parallel plate dielectrically loaded

waveguide resonator. By observing the resonant frequencies

and knowing the dimensions of the substrate, the dielectric

constant is calculated by fitting the resonances into a table

of expected fundamental and higher order modes. This

method can be measured by connecting the corners of the

substrates to the center conductors of either an APC-7 or

Type N connector. The test setup is the same as for insertion

loss measurements. This method as described in the litera-

ture for an alumina substrate with a dielectric constant of

approximately 10 and a substrate height of 0.025 inches can

be measured to an accuracy of 2ꢀ. The Napoli-Hughes

Method uses an open circuit assumption for the unmetallized

edges which can be radiative. This inaccuracy is reduced if

thinner substrates or if higher dielectric constant substrates

are used which will tend to reduce radiation. Higher accuracy

can be achieved by metallizing all six sides of the substrate

except for the corners where the RF is coupled to the sub-

strate. This method as reported by Howell provided more

consistent results.

0.01 dB then .2ꢀ of the incident power is lost as heat

0.10 dB then 2ꢀ of the incident power is lost as heat

1.00 dB then 20ꢀ of the incident power is lost as heat

The capacitor will heat up according to the amount of power

dissipated in the capacitor and the heat sinking provided.

Even very low ESR, 0.01 ohm at 1 GHz, can be significant

when passing power through a series mounted capacitor

into a typically low impedance bipolar transistor base input

with an input impedance of only 1 ohm. If 1ꢀ of 10 watts is

dissipated in the capacitor, this 100 milliwatt of power causes

a very large increase in the capacitor temperature dependent

on its heat sinking in the MIC circuit.

Voltage Breakdown

The voltage breakdown also limits the maximum power

handling capability of the capacitor.

The voltage breakdown properties of the capacitors is

dependent on the following:

• dielectric material

• voids in the material

• form factor

• separation of the electrodes

Most microwave capacitors have a DC voltage rating of 50

VDC. This is much greater than typical DC voltages of 3 to

15 volts present on an MIC circuit.

m = 2

2L

W

___

f_±

2f_±

f_±

m = 1

L

W

___

f_±

FROM

AUTO

TESTER

SCALAR

ANALYZER

SWEEP

DETECTOR

GENERATOR

4

n = 1

2

3

Figure 13

Test Configuration for Resonance Measurements

Figure 12

9

Dispersion Curve of a Rectangular Resonator

1±5

Introduction to

Microwave Capacitors

Transmission Lines

Propagation Constant and

Characteristic Impedance

Standing Waves

Standing waves on the lossless transmission line:

The incident waves of voltage and current decrease in mag-

nitude and vary in phase as one goes toward the receiving

end of the transmission line which has losses. The propaga-

tion constant is a measure of the phase shift and attenuation

along the line.

An incident wave will not be reflected if the transmission line

is terminated in either matched load or if the transmission line

is infinitely long. Otherwise, reflected waves will be present.

In other words, any impedance will cause reflections.

Let us consider the case of a lossless transmission line ter-

minated in a short line. In this case all of the incident wave

will be reflected. See Figure 15.

• attenuation per unit length of line is called the attenuation

constant. (dB or nepers per unit length)

• phase constant, phase shift per unit length. (radians per

unit length)

The dotted sine wave to the right of the short circuit in the

diagram indicates the position and distance the wave would

have traveled in the absence of the short circuit. With the

short circuit placed at X, the wave travels the same distance

back toward the generator. In order to satisfy the boundary

conditions, the voltage at the short circuit must be zero at all

times. This is accomplished by a reflected wave which is

equal in magnitude and reversed in polarity (shown by the

superimposed reflected wave and the resultant total voltage

on the line). Note that the total voltage is twice the amplitude

of the incident voltage at a quarter wavelength back toward

the generator and the total voltage is zero at one-half wave-

length from the short.

• angular frequency, 2 * pi * f

(R+jwL) - complex series impedance per unit length of line.

(G+jwC) - complex shunt admittance per unit length of line.

L

Eq. 13. Z_±for lossless case: Z_±=

ꢀ ⁄

C

ꢀ

WAVE

CIRCUIT

X

D

E

1

2E

1

3

2

E

i

3

1

2

±

DISTRIBUTED PARAMETER MODEL

OF A SECTION OF TRANSMISSION LINES:

RESULTANT

(aꢀ

SHORT

E

1

rꢂx

lꢂx

3

5

6

2

gꢂx

cꢂx

4

2

1

4

3

1

E

r

(bꢀ

RESULTANT

SHORT

ꢂx

where

G = Conductance per unit length

R = Resistance per unit length

C = Capacitance per unit length

L = Inductance per unit length

3

2

4

1

2

4

1

3

2E

i

= Incremental length

ꢂX

(cꢀ

SHORT

1

7

Figure 15

6

5

2

3

6

5

2

3

4

5

6

PURE TRAVELING WAVE

4

3

2

4

5

6

4

3

2

V

I

+

AMPLITUDE

-

1

7

1

7

(dꢀ

(eꢀ

X

Figure 14

DISTANCE ALONG LINE

This figure shows generation of standing waves on a short-

ed transmission line. Dotted lines to the right of the short cir-

cuit represent the distance the wave would have traveled in

absence of the short. Dotted vectors represent the reflected

wave. The heavy solid line represents the vector sum of the

incident and refected waves. (d) and (e) represent instanta-

neous voltages and currents at different intervals of time.

V = Instantaneous voltage

I = Instantaneous current

9

Pure traveling waves: V & I in the lossless case are in phase.

V & I also reverse polarity every half wavelength.

Figure 16

1±6

Introduction to

Microwave Capacitors

Transmission Lines

FIELD ORIENTATION OF A COAXIAL LINE

Open Circuit:

At a distance of one-quarter wavelength from the short, the

voltage is found to be twice the amplitude of the incident

voltage, which is equivalent to an open circuit. Therefore, this

same distribution would be obtained if an open circuit were

placed a quarter wavelength from the short. In the case the

first node is located a quarter wavelength from the open and

the first antinode is right as the open. The node-to-node

spacing remains half wavelength as is the antinode-to-antinode

spacing.

E

H

I

•

V

DIRECTION OF PROPAGATION

Figure 17

Voltage Standing Wave Ratio:

The voltage standing wave ratio is defined as the ratio of the

maximum voltage to the minimum voltage on a transmission

line. This ratio is most frequently referred to as VSWR (Viswar).

MICROSTRIP

TWO

COAXIAL

WIRE

RECTANGULAR

WAVEGUIDE

RIDGED

WAVEGUIDE

CIRCULAR

WAVEGUIDE

E^max

E^min

E_i+ E_r1 + Rho

Eq. 14. VSWR =

=

E_i- E_r

1 - Rho

CROSS SECTIONAL CONFIGURATIONS OF

VARIOUS TYPES OF GUIDING STRUCTURES

where Rho = reflective coefficient

If the transmission line is terminated in a short or open circuit,

the reflected voltage, E_r, is equal to the incident voltage, E_i.

From the above equation the reflection coefficient is 1.0, and

the VSWR is infinite. If a matched termination is connected to

the line, the reflected wave is zero, the reflection coefficient is

zero, and the VSWR is zero.

Figure 18

The total voltage pattern is called a standing wave. Standing

waves exist as the result of two waves of the same frequency

traveling in opposite directions on a transmission line.

The total voltage at any instant has a sine wave distribution

along the line with zero voltage at the short and zero points at

half wave intervals from the short circuit. The points of zero

voltages are called voltage nodes and the points of maximum

voltage halfway between these nodes are called antinodes.

9

1±7

Introduction to

Microwave Capacitors

Incorporation of Capacitors into Microwave Integrated Circuit Hybrids

• Dielectric Constant: Increase of the dielectric constant of

the substrate will decrease the ZO of the microstrip line.

Microwave Integrated Circuit Hybrids

A Microwave Integrated Circuit Hybrid (MIC) is a microwave

Table II shows a brief listing of substrate properties.

circuit that uses integrated circuit production techniques

involving such factors as thin or thick films, substrates,

dielectrics, conductors, resistors, and microstrip lines, to

build passive assemblies on a dielectric. Active elements

such as microwave diodes and transistors are usually added

after photo resist, masking, etching, and deposition process-

es have been completed. MICs usually are enclosed as

shielded microstrip to prevent electromagnetic interference

with other components or systems. This section will discuss

some of the important characteristics of MICs, such as:

Table II

Material

Alumina

Sapphire Quartz Beryllium

Oxide

Relative

Dielectric

Constant, E

9.8*

11.7

0.0001

0.4

3.8

0.0001

0.01

6.6

0.0001

2.5

r

Loss

Tangent at

10 GHz

0.0001

0.3

• MIC substrates

• MIC metallization

• MIC components

Thermal

Conductivity

K, in W/CM/

Deg. C

MIC Substrates:

Microstrip employs circuitry that is large compared to the

wavelength of the frequency used with the circuit. For this

reason, the etched metal patterns often are distributed cir-

cuits with transmission lines etched directly onto the MIC

substrate. Figure 19 shows the pertinent dimensional para-

meters for a microstrip transmission line.

*Alumina E depends on vendor and purity.

r

The dependence of ZO to the above parameters is as shown:

Eq. 15. ZO(f) = 377 * H/(W)/Sqrt (Er)

where,

H = height of the substrate

For the current discussion we are most interested in the high-

er microwave frequencies. The MIC circuit design requires a

uniform and predictable substrate characteristic. Several

types of substrates in common usage are: alumina, sapphire,

quartz, and beryllium oxide. Key requirements for a MIC sub-

strate are that it have:

W = width of the microstrip

conductor

Er = dielectric constant of the

substrate

A graph of ZO versus W/H for several values of dielectric

constants is shown below:

• Low dielectric loss

1±±±

• Uniform dielectric constant

• Smooth finish

• Low expansion coefficient

5±±

4±±

3±±

2±±

2.3

2.55

1±±

4.8

6.8

5±

1±

4±

STRIP

CONDUCTOR

3±

2±

W

1±

5

4

DIELECTRIC

h

3

2

1

GROUND PLANE

.1

.4 .5

1

2

3

4

5

7.5 1±

2± 3±

4± 5±

1±±

.2 .3

Figure 19. MIC Microstrip Outline

MICROSTRIP W/H

The characteristic impedance of the microstrip line is depen-

dent primarily on the following:

Figure 20

The most popular substrate material is alumina which has a

dielectric constant of between 9.6 and 10.0 depending on

the vendor and the purity. Other substrates are used where

the specified unique properties of the material (beryllia for

high power, ferrites for magnetic properties) are demanded

by design.

• Width of the conductor: Increase in the width “W” of the

conductor will decrease the ZO of the microstrip line.

• Height of the substrate: Increase in the height “H” of the

substrate will increase the ZO of the microstrip line.

9

1±8

Introduction to

Microwave Capacitors

Incorporation of Capacitors into Microwave Integrated Circuit Hybrids

MIC Metallization:

Capacitors:

MIC metallization is a thin film of two or more layers of met-

als. A base metallization layer is deposited onto the sub-

strate, another layer may be optionally deposited on top of

this, and then a final gold layer is deposited onto the surface.

The base metallization is chosen for its adhesion to the sub-

strate and for compatibility with the next layer.

A lumped capacitor can be realized by the parallel gap

capacitance of an area of metallization on the top of the sub-

strate to the ground plane. Values of capacitance that can be

obtained by this method are usually less than a few pico-

farads. At microwave frequencies if the capacitor size in any

one dimension begins to approach a quarter-wavelength, a

resonance will occur.

The base metallization is usually lossy at microwave fre-

quencies. The losses due to this metallization can be kept to

a minimum if its thickness does not exceed one “skin depth”

of the metal.

Large values of capacitance can be achieved with a dielec-

tric constant between the capacitor plates while maintaining

the small size required for MIC circuits.

Skin effect defines a phenomenon at microwave frequencies

where the current travelling along a conductor does not pen-

etrate the conductor but remains on the surface of the con-

ductor. The “skin depth” indicates how far the microwave

current will penetrate into the metal. The “skin depth” is

smaller as the frequency increases.

Chip capacitors can be fabricated on substrate with a dielec-

tric constant up to 5000. This higher dielectric constant

allows a much smaller size capacitor for a given capacitance

value which is a very desirable feature both from the real

estate aspect and the self-resonance aspect.

Resistors:

By keeping the lossy metallization as thin as possible, more

of the microwave current will propagate in the top metalliza-

tion gold layer and loss is minimized.

MIC resistors are often realized by using a resistive base layer

on the MIC substrate metallization, and by etching the prop-

er pattern to expose the resistive layer in the MIC circuitry.

Typical metallization schemes used in the industry are:

The exact value of the resistor is determined by:

• Chromium-Gold:

• Nichrome-Gold:

Cr-Au

NiCr-Au

• resistivity of the resistive base layer, and

• length and width of the resistor.

• Chromium-Copper-Gold: Cr-Cu-Au

Thin film resistive base layers are usually the following:

• Titanium-Tungsten-Gold:

• Others

TiW-Au

• tantalum nitrite, or

• nickel-chrome (nichrome).

MIC Components:

When chip resistors are used, they are mounted and con-

nected in the same way as the chip capacitors.

Microstrip has advantages over other microwave circuit

topologies in that active semiconductors and passive com-

ponents can easily be incorporated to make active hybrid

circuits. It is possible to mix high and low frequency circuitry

to attain a “system-on-a substrate.”

Inductors:

Inductors are often realized by using narrow etched

microstrip lines which provides inductance on the order of

1 to 5 nanohenrys.

Passive Components:

Higher values up to 50 nanohenrys are obtained by etching

a round or square spiral onto the MIC metallization.

On MIC circuits, the passive components are either distrib-

uted or lumped elements. The distributed components are

usually realized by etched patterns on the substrate metal-

lization. The lumped components are capacitors, resistors,

and inductors; and whenever possible components are

derived by etching them directly on the MlC metallization thin

film. Chip components are used when they offer advantages

such as:

Even higher values can be obtained by using wound wire

inductors or chip inductors which are wire coils encased in a

ceramic.

Both types of discrete inductors are attached to the circuit

by the same means as the capacitors.

• Component values are beyond that realizable by thin film

techniques on the MIC substrates,

• Smaller size is required,

• High power capability is required.

Capacitors, resistors, and inductors are discussed in the

following:

9

1±9

Introduction to

Microwave Capacitors

Incorporation of Capacitors into Microwave Integrated Circuit Hybrids

temperature. Other combinations have transition states with

wider temperature ranges. For instance, the eutectic tem-

perature for the following alloys are:

Active components:

The active devices in the MIC circuit can be made of entirely

different materials than the substrates and are usually

attached to the substrates by eutectic soldering or conduc-

tive epoxy.

Table III

Eutectic

Typical active devices on MIC circuits are the following:

Alloy

Composition

Temperature

• GaAs FETs

Gold Germanium

Gold Tin

88ꢀ Au 12ꢀ Ge

80ꢀ Au 20ꢀ Sn

356°C

280°C

• Bipolar Transistors

• Schottky Barrier Diodes

• PIN Diodes

• Various other Semiconductors

For best results, the eutectic attach is performed under an

inert gas atmosphere, typically nitrogen, to reduce oxidation

at high temperatures. The eutectic must be selected so that

the die attach operations will not interfere with prior solder-

ing operations and itself will not be disturbed by subsequent

process steps. The metallization should be able to undergo

400°C without any blistering or other adhesion degradation.

The active devices can be either in:

• a plastic or ceramic package with metal leads, or

• chip form.

The packaged devices are commonly used at a lower

frequency range than the chip devices since they exhibit

more parasitic circuit elements that limit their performance at

higher frequency.

2. Epoxy Die Attach

The epoxy die attach method uses silver or gold conductive

particles in an epoxy. The epoxy for chip attach on MIC

circuits is a one-part type which cures at temperatures of from

125°C to 200°C. The curing time is a function of temperature.

A cure time of 30 minutes at 150°C is a good compromise for

high reliability and a reasonable cure time.

The advantages of packaged devices are protection of the

devices during transport and mounting, ease of characteri-

zation, and ease of mounting onto the MIC circuit.

Chip Component Attach:

The methods of attachment of the chip components to the

substrate are usually by:

Chip Components Interconnection:

The chip components are interconnected to the MIC circuit

by means of:

• eutectic solder die attach, and

• epoxy die attach.

1. Eutectic Die Attach

• wire bonding, and

The eutectic die attach method can be used with several

alloys. Eutectic defines the exact alloy combination at which

the solidus to liquidus transition takes place at one particular

• miniature parallel gap welding.

9

11±

Other Products

PASSIVES

CONNECTORS

2mm Hard-Metric for CompactPCI^®

Automotive Connectors

Capacitors

Multilayer Ceramic

Tantalum

Filters

EMI

SAW

Dielectric

Board to Board Connectors –

SMT and Through-Hole

Card Edge

Compression

Custom Designed Connectors

Customized Backpanel, Racking and

Harnessing Services

DIN 41612 Connectors

FFC/FPC Connectors

Insulation Displacement Connectors

I/O Connectors

Memory Card Connectors

CF, PCMCIA, SD, MMC

MOBO^TM, I/O, Board to Board and

Battery Connectors

Press-fit Connectors

Varicon^®

Wire to Board, Crimp or IDC

Microwave

Glass

Film

Power Film

Power Ceramic

Ceramic Disc

Trimmer

Thin Film

Inductors

Fuses

Capacitors

Couplers

Baluns

BestCap™

Filters

Resistors

Integrated Passive

Components

Arrays

Timing Devices

Resonators

Oscillators

Low Inductance Chip Arrays

Capacitor Arrays

Dual Resonance Chips

Custom IPCs

Crystals

Voltage Suppressors,

Varistors and Thermistors

Acoustical Piezos

For more information please visit

our website at

http://www.avx.com

NOTICE: Specifications are subject to change without notice. Contact your nearest AVX Sales Office for the latest specifications. All statements, information and data given

herein are believed to be accurate and reliable, but are presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements

or suggestions concerning possible use of our products are made without representation or warranty that any such use is free of patent infringement and are not

recommendations to infringe any patent. The user should not assume that all safety measures are indicated or that other measures may not be required. Specifications are

typical and may not apply to all applications.

111

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AVX Czech Republic

Tel: ++420 465-358-111

FAX: ++420 465-323-010

AVX/ELCO, England

Tel: ++44 (0) 1638-675000

FAX: ++44 (0) 1638-675002

ASIA-PACIFIC

AVX/Kyocera, Singapore

Asia-Pacific Headquarters

AVX/Kyocera, Taiwan

Tel: (886) 2-2698-8778

FAX: (886) 2-2698-8777

Kyocera, Japan - KDP

Tel: (81) 75-604-3424

FAX: (81) 75-604-3425

Tel: (65) 6286-7555

FAX: (65) 6488-9880

AVX/Kyocera, Shanghai, China

AVX/Kyocera, Malaysia

AVX/Kyocera, Hong Kong

Tel: 86-21 6886 1000

FAX: 86-21 6886 1010

Tel: (60) 4-228-1190

FAX: (60) 4-228-1196

Tel: (852) 2-363-3303

FAX: (852) 2-765-8185

AVX/Kyocera, Tianjin, China

Elco, Japan

Tel: 86-22 2576 0098

FAX: 86-22 2576 0096

Tel: 045-943-2906/7

FAX: 045-943-2910

AVX/Kyocera, Korea

Tel: (82) 2-785-6504

FAX: (82) 2-784-5411

Kyocera, Japan - AVX

Tel: (81) 75-604-3426

FAX: (81) 75-604-3425

Contact:

A KYOCERA GROUP COMPANY

http://www.avx.com

S-RFMTF00M904-C


型号：	CP0603A1441ENTR
厂家：	KYOCERA AVX
描述：	Directional Coupler, 1429MHz Min, 1453MHz Max, 0.25dB Insertion Loss-Max, ROHS COMPLIANT, MINIATURE, LGA-4 射频微波
文件：	总113页 (文件大小：1309K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

CP0603A1441ENTR [KYOCERA AVX]

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